(P-TCA-E006)
OUTLINE (Type TCA)
Type TCA is a tantalum solid electrolytic capacitor which uses conductive polymer as cathode layer.
Their equivalent series resistance (ESR) is extremely lowered with the characteristics of the polymer having high electric conductivity.
This ensures higher permissible ripple current and excellent noise absorption performance on high-frequency circuits.
APPLICATION
Mobile phones, digital cameras, high-performance portable equipments, personal computers, digital TV sets, DC/DC converters, regulators
and peripherals.
FEATURES
1. Low ESR and Low impedance
Using a conductive polymer as cathode layer makes low ESR and impedance possible.
Type TCA makes high permissible ripple current and is suitable for noise bypass application.
2. Stable ESR over temperature
ESR is extremely stable from low temperature through high temperature.
3. Compact and Large capacitance
The capacitor is smaller and has larger capacitance than ceramic capacitor and aluminum electrolytic capacitor.
4. Benign Failure Mode
Type TCA offers very safe characteristics which makes ignition and smoking harder by taking advantages of characteristics of conductive
polymer if the capacitor be short-circuited.
5. Lead Free and RoHS Compliant.
RATINGS
Item
Ratings
Failure Rate Level
1% / 1000 h
Category Temperature Range
-55 to +105°C (to be used at derated voltage when temperature exceeds 85°C)
Rated Voltage
2.5 – 4 - 6.3 - 10 VDC
Derated Voltage
2.0 - 3.2 - 5.0 - 8.0 VDC (105°C)
Capacitance
10~470
µF
Capacitance Tolerances
± 20% (M)
DIMENSIONS
(mm)
[ S case]
L
[ A case]
W
[ B case]
W
W
Case
Code
T
EIA
Code
L±0.2
2.0
3.2
3.2
3.5
6.0
7.3
7.3
W±0.2
1.25
1.6
1.6
T±0.2
1.2max.
1.2max.
1.6
P
1
±0.2
0.5
0.8
0.75
0.8
1.3
1.3
1.3
P
2
min.
0.8
1.4
1.4
1.5
3.0
4.0
4.0
C±0.1
T
T
S
2012
3216L
3216
3528
6032
7343L
7343
0.9
1.2
1.2
2.2
2.2
2.4
2.4
12A
A
[ C case]
W
P
1
P
2
P
1
[ 12A,20D,D case]
W
B
C
T
2.8
3.2
4.4
4.4
1.9
2.5
2.0max.
2.8
C
T
20D
D
Note : Dimension T of
the case code “S” , “12A” and “20D” specifies max. value.
STANDARD RATING
RV(VDC)
Cap(µF)
10
15
22
33
47
May, 2013
4
6.3
S(200,500)
S(200,500)
12A(200)
A(180,200)
A(180,200), B(80,60)
2.5
10
12A(200)
S(200,500), A(180,200)
A(180,200)
A(180,200)
A(180,200)
A(180,200)
B(80,60)
A(180,200)
A(180,200)
B(70,60)
B(70,60)
68
A(200), B(70,55)
B(70,55)
B(70,55)
C(45,60)
100
B(70,55)
B(70,55)
B(70,55)
20D(45,55)
150
B(70,55)
B(70,55)
C(40,60), 20D(35,55)
D(40,55)
220
C(40,60), 20D(35,55)
D(40)
D(40,55)
330
470
D(40,55)
The parenthesized values show ESR.(maximum values in mΩ at 100 kHz)
1
RECOMMENDED PAD DIMENSIONS
Case Size
S
12A , A
B
C
20D , D
a
1.4
2.0
2.0
2.4
2.4
b
1.2
1.5
2.4
2.5
2.7
c
0.9
1.5
1.8
3.3
4.6
C
a
In order to expect the self alignment effect, it is recommended that the land width is almost the same size as terminal of capacitor,
and space between lands(c) nearly equal to the space between terminals for appropriate soldering.
PERFORMANCE
No
1
b
Item
Leakage Current (µA)
Performance
Shall not exceed 0.1 CV Max. or the values shown in CATALOG NUMBERS AND
RATING.
Test Method
JIS C 5101-1, 4.9
Applied voltage : Rated voltage
Duration : 5 min
Measuring temperature : 20±2
℃
JIS C 5101-1, 4.7
Measuring frequency : 120 Hz±20%
Measuring temperature : 20±2
℃
JIS C 5101-1, 4.8
Test conditions shown in No.2
Capacitance (µF)
2
Shall be within specified tolerances.
Dissipation Factor
3
Shall not exceed the values shown in CATALOG NUMBERS AND RATING.
4
Equivalent Series
Resistance
Shall not exceed the values shown in CATALOG NUMBERS AND RATING.
5
Characteristics at High
and Low Temperature
Step 1
Step 2
Step 3
Step 4
Step 5
Step 6
Surge
Leakage Current
Shall not exceed the value in No.1.
–
Shall not exceed the value in No.1.
Shall not exceed 10-times of the
value in No.1.
Shall not exceed 10-times of the
value in No.1.
Shall not exceed the value in No.1.
Capacitance
Within specified tolerances
0
Within
- 20
%of value at Step 1
Dissipation Factor
Shall not exceed the value in No.3.
Shall not exceed the value in No.3.
Shall not exceed the value in No.3.
–
Shall not exceed 1.5-times of
the value in No.3.
Shall not exceed the value in No.3.
EIAJ RC-2378, 4.5.4
Measuring frequency : 100 kHz±10%
Measuring temperature : 20±2
℃
JIS C 5101-1, 4.29
20±2
℃
-55±
℃
3
20±
℃
2
85±2
℃
Within
±
5% of value at Step 1
–
Within
+ 50
%of value at Step 1
0
Within
±
5% of value at Step 1
105±
℃
2
Derated voltage at 105℃
20±2
℃
JIS C 5101-1, 4.26
Test temperature : 85℃ and 105℃
Applied voltage : According to the following table
Rated voltage (VDC)
85℃
Surge voltage (VDC)
105℃
2.5
3.3
2.6
4
5.2
4.2
6.3
8.2
6.5
10
13
10.4
6
Leakage current : Shall not exceed 3-times of the value in No.1.
Capacitance change : Within
±
20% of the value before test
Dissipation Factor : Shall not exceed the value in No.3.
Visual Examination : There shall be no evidence of mechanical damage.
Shear Test
7
Substrate Bending Test
No separation of terminal from solder.
Capacitance : Initial value to remain steady during measurement.
Visual Examination : There shall be no evidence of mechanical damage.
Capacitance : Initial value to remain steady during measurement.
Visual Examination : There shall be no evidence of mechanical damage.
8
Vibration
Series protective resistance : 1000
Ω
Discharge resistance : 1000
Ω
Number of cycles : 1000 cycles
JIS C 5101-1, 4.34
Force : 5 N
Holding time : 5±
sec
1
JIS C 5101-1, 4.35
Bending : 3 mm
JIS C 5101-1 4.17
Frequency range : 10-55 Hz Swing width : 1.5 mm
Vibration direction : 3 directions with mutually right-angled
Duration : 2 hours in each of these mutually perpendicular
directions (total 6 hours)
Mounting : Solder terminal to the printed board
JIS C 5101-1 4.19
Peak acceleration : 490 m/s
2
Duration : 11 ms
Wave form : Half-sine
JIS C 5101-1 4.15
Solder temperature : 230±5℃
Dipping time : 3 to 5 seconds
Dipping depth : Terminal shall be dipped into melted solder
EIAJ RC-2378, 4.6
IR reflow Preheating : 140 to 160℃, 110 to 130 sec
Reflow : 200℃, 25 to 30 sec
Peak : 240℃ max.
Number of cycles : 2
JIS C 5101-1, 4.16
Step 1 : -55
±
℃,
30±
min
3
3
Step 2 : 25
+ 10
℃,
3 min or less
- 5
Step 3 : 105
±2℃,
30
±3
min
Step 4 : 25
+ 10
℃,
3 min or less
- 5
Number of cycles : 5
JIS C 5101-1, 4.21
Temperature : 40±
℃
2
Moisture : 90 to 95% RH
Duration : 500
+ 24
hrs
0
JIS C 5101-1, 4.23
Test temperature : 85±
℃
2
Applied voltage : Rated voltage
+ 48
Duration : 1000
0
hrs
JIS C 5101-1, 4.23
Test temperature : 105±
℃
2
Applied voltage : Derated voltage
+ 48
Duration : 1000
0
hrs
9
Shock
10
Solderability
There shall be no intermittent contact of 0.5 ms or greater, short, or open. Nor shall there
be any spark discharge, insulation breakdown, or evidence of mechanical damage.
Shall be covered to over 3/4 of terminal surface by new soldering.
11
Resistance to Soldering
Heat
Leakage Current : Shall not exceed 2-times of the value in No.1.
Capacitance change : Within
±
20% of the value before test.
Dissipation Factor : Shall not exceed 1.3-times of the value in No.3.
Visual Examination : There shall be no evidence of mechanical damage.
Leakage Current : Shall not exceed 2-times of the value in No.1.
Capacitance change : Within
±
20% of the value before test.
Dissipation Factor : Shall not exceed 1.5-times of the value in No.3.
Visual Examination : There shall be no evidence of mechanical damage.
12
13
Rapid Change of
Temperature
14
Damp Heat,
Steady State
Endurance I
15
Endurance II
16
Leakage Current : Shall not exceed 2-times of the value in No.1.
Capacitance change : Within -20% to +40% of the value before test.
Dissipation Factor : Shall not exceed 1.5-times of the value in No.3.
Visual Examination : There shall be no evidence of mechanical damage.
Leakage Current : Shall not exceed 2-times of the value in No.1.
Capacitance change : Within
±
20% of the value before test.
Dissipation Factor : Shall not exceed 1.5-times of the value in No.3.
Visual Examination : There shall be no evidence of mechanical damage.
Leakage Current : Shall not exceed 2-times of the value in No.1.
Capacitance change : Within
±
20% of the value before test.
Dissipation Factor : Shall not exceed 3-times of the value in No.3.
Visual Examination : There shall be no evidence of mechanical damage.
4
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
