NAND Gate, LVC/LCX/Z Series, 2-Func, 2-Input, CMOS, PDSO8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Nexperia |
| 包装说明 | 3 MM, PLASTIC, SOT505-2, TSSOP-8 |
| Reach Compliance Code | compliant |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | S-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 逻辑集成电路类型 | NAND GATE |
| 湿度敏感等级 | 1 |
| 功能数量 | 2 |
| 输入次数 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 10.8 ns |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 宽度 | 3 mm |
| Base Number Matches | 1 |
| 935273581125 | 935291501115 | 935292381115 | 935275224125 | 935277235125 | |
|---|---|---|---|---|---|
| 描述 | NAND Gate, LVC/LCX/Z Series, 2-Func, 2-Input, CMOS, PDSO8 | NAND Gate, LVC/LCX/Z Series, 2-Func, 2-Input, CMOS, PDSO8 | LVC/LCX/Z SERIES, DUAL 2-INPUT NAND GATE, PDSO8, 1.35 X 1 MM, 0.35 MM HEIGHT, 0.35 MM PITCH, SOT-1203, SON-8 | NAND Gate, LVC/LCX/Z Series, 2-Func, 2-Input, CMOS, PDSO8 | NAND Gate, LVC/LCX/Z Series, 2-Func, 2-Input, CMOS, PQCC8 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
| 包装说明 | 3 MM, PLASTIC, SOT505-2, TSSOP-8 | VSON, | VSON, | VSSOP, | VQCCN, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compli |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | S-PDSO-G8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-G8 | S-PQCC-N8 |
| JESD-609代码 | e4 | e3 | e3 | e4 | e4 |
| 长度 | 3 mm | 1.35 mm | 1.35 mm | 2.3 mm | 1.6 mm |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | VSON | VSON | VSSOP | VQCCN |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | CHIP CARRIER, VERY THIN PROFILE |
| 传播延迟（tpd） | 10.8 ns | 10.8 ns | 10.8 ns | 10.8 ns | 10.8 ns |
| 座面最大高度 | 1.1 mm | 0.5 mm | 0.35 mm | 1 mm | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Tin (Sn) | Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | NO LEAD | NO LEAD | GULL WING | NO LEAD |
| 端子节距 | 0.65 mm | 0.35 mm | 0.35 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD |
| 宽度 | 3 mm | 1 mm | 1 mm | 2 mm | 1.6 mm |
| Base Number Matches | 1 | 1 | 1 | - | - |
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