NAND Gate, LVC/LCX/Z Series, 2-Func, 2-Input, CMOS, PQCC8
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Nexperia |
包装说明 | VQCCN, |
Reach Compliance Code | compli |
系列 | LVC/LCX/Z |
JESD-30 代码 | S-PQCC-N8 |
JESD-609代码 | e4 |
长度 | 1.6 mm |
逻辑集成电路类型 | NAND GATE |
湿度敏感等级 | 1 |
功能数量 | 2 |
输入次数 | 2 |
端子数量 | 8 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | VQCCN |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, VERY THIN PROFILE |
传播延迟(tpd) | 10.8 ns |
座面最大高度 | 0.5 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 1.65 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
宽度 | 1.6 mm |
935277235125 | 935273581125 | 935291501115 | 935292381115 | 935275224125 | |
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描述 | NAND Gate, LVC/LCX/Z Series, 2-Func, 2-Input, CMOS, PQCC8 | NAND Gate, LVC/LCX/Z Series, 2-Func, 2-Input, CMOS, PDSO8 | NAND Gate, LVC/LCX/Z Series, 2-Func, 2-Input, CMOS, PDSO8 | LVC/LCX/Z SERIES, DUAL 2-INPUT NAND GATE, PDSO8, 1.35 X 1 MM, 0.35 MM HEIGHT, 0.35 MM PITCH, SOT-1203, SON-8 | NAND Gate, LVC/LCX/Z Series, 2-Func, 2-Input, CMOS, PDSO8 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
包装说明 | VQCCN, | 3 MM, PLASTIC, SOT505-2, TSSOP-8 | VSON, | VSON, | VSSOP, |
Reach Compliance Code | compli | compliant | compliant | compliant | compliant |
系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
JESD-30 代码 | S-PQCC-N8 | S-PDSO-G8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-G8 |
JESD-609代码 | e4 | e4 | e3 | e3 | e4 |
长度 | 1.6 mm | 3 mm | 1.35 mm | 1.35 mm | 2.3 mm |
逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 2 | 2 | 2 | 2 | 2 |
输入次数 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | VQCCN | TSSOP | VSON | VSON | VSSOP |
封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
传播延迟(tpd) | 10.8 ns | 10.8 ns | 10.8 ns | 10.8 ns | 10.8 ns |
座面最大高度 | 0.5 mm | 1.1 mm | 0.5 mm | 0.35 mm | 1 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Tin (Sn) | Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD | GULL WING | NO LEAD | NO LEAD | GULL WING |
端子节距 | 0.5 mm | 0.65 mm | 0.35 mm | 0.35 mm | 0.5 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL |
宽度 | 1.6 mm | 3 mm | 1 mm | 1 mm | 2 mm |
Base Number Matches | - | 1 | 1 | 1 | - |
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