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IRGSL6B60KDTRRPBF

产品描述Insulated Gate Bipolar Transistor, 13A I(C), 600V V(BR)CES, N-Channel, TO-262AA, LEAD FREE PACKAGE-3
产品类别分立半导体    晶体管   
文件大小311KB,共16页
制造商International Rectifier ( Infineon )
官网地址http://www.irf.com/
标准
下载文档 详细参数 全文预览

IRGSL6B60KDTRRPBF概述

Insulated Gate Bipolar Transistor, 13A I(C), 600V V(BR)CES, N-Channel, TO-262AA, LEAD FREE PACKAGE-3

IRGSL6B60KDTRRPBF规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称International Rectifier ( Infineon )
零件包装代码TO-262AA
包装说明IN-LINE, R-PSIP-T3
针数3
Reach Compliance Codecompliant
外壳连接COLLECTOR
最大集电极电流 (IC)13 A
集电极-发射极最大电压600 V
配置SINGLE WITH BUILT-IN DIODE
JEDEC-95代码TO-262AA
JESD-30 代码R-PSIP-T3
JESD-609代码e3
湿度敏感等级1
元件数量1
端子数量3
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)260
极性/信道类型N-CHANNEL
认证状态Not Qualified
表面贴装NO
端子面层MATTE TIN OVER NICKEL
端子形式THROUGH-HOLE
端子位置SINGLE
处于峰值回流温度下的最长时间40
晶体管应用MOTOR CONTROL
晶体管元件材料SILICON
标称断开时间 (toff)258 ns
标称接通时间 (ton)45 ns
Base Number Matches1

文档预览

下载PDF文档
PD - 94381E
INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
C
IRGB6B60KD
IRGS6B60KD
IRGSL6B60KD
V
CES
= 600V
I
C
= 7.0A, T
C
=100°C
Features
• Low VCE (on) Non Punch Through IGBT Technology.
• Low Diode VF.
• 10µs Short Circuit Capability.
• Square RBSOA.
• Ultrasoft Diode Reverse Recovery Characteristics.
• Positive VCE (on) Temperature Coefficient.
G
E
t
sc
> 10µs, T
J
=150°C
Benefits
• Benchmark Efficiency for Motor Control.
• Rugged Transient Performance.
• Low EMI.
• Excellent Current Sharing in Parallel Operation.
n-channel
V
CE(on)
typ. = 1.8V
TO-220AB
IRGB6B60KD
D
2
Pak
IRGS6B60KD
Max.
600
13
7.0
26
26
13
7.0
26
± 20
90
36
-55 to +150
TO-262
IRGSL6B60KD
Units
V
Absolute Maximum Ratings
Parameter
V
CES
I
C
@ T
C
= 25°C
I
C
@ T
C
= 100°C
I
CM
I
LM
I
F
@ T
C
= 25°C
I
F
@ T
C
= 100°C
I
FM
V
GE
P
D
@ T
C
= 25°C
P
D
@ T
C
= 100°C
T
J
T
STG
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current
Clamped Inductive Load Current„
Diode Continuous Forward Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
A
V
W
°C
300 (0.063 in. (1.6mm) from case)
Thermal Resistance
Parameter
R
θJC
R
θJC
R
θCS
R
θJA
R
θJA
Wt
Junction-to-Case - IGBT
Junction-to-Case - Diode
Case-to-Sink, flat, greased surface
Junction-to-Ambient, typical socket mount

Junction-to-Ambient (PCB Mount, steady state)
‚
Weight
Min.
–––
–––
–––
–––
–––
–––
Typ.
–––
–––
0.50
–––
–––
1.44
Max.
1.4
4.4
–––
62
40
–––
Units
°C/W
g
www.irf.com
1
8/18/04

 
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