INTERCONNECTS
Solder Cup Headers and Sockets
Single and Double Row
•
Series 380 & 480 use M-M #8000
pins. See page 174 for details.
•
Series 329 & 429 use M-M #2954
pin receptacles and accept pin
diameters from 0,38 - 0,64. See
page 140 for details.
•
Series 329 & 429 receptacles use
Hi-Rel, 4 finger #30 contacts rated
at 3 amps. See page 208 for details.
2,54
Series 329, 380,
429, 480
Number of Pins
0,99 DIA.
HOLE
2,54
1,83 DIA.
3,23
2,79 3,15
0,51 DIA.
4,22
Fig. 1
•
Solder cups are pre-aligned.
Ordering Information
0,99 DIA.
Number of Pins
2,54
HOLE
Series 380...001
Solder Cup / Solder Tail
1,83 DIA.
3,23
2,79 3,15
Fig. 1
380-XX-1_ _-00-001000
Specify # of pins
01-64
Solder Cup / Solder Tail
0,51 DIA.
4,22
Series 480...001
2,54
2,54
Fig. 2
480-XX-2 _ _-00-001000
Specify # of pins
XX= Plating Code
See Below
Fig. 2
02-64
0,38-0,64
0,25 * 0,46
2,54
Number of Pins
2,54
For RoHS compliance, select plating code.
For the gold option (XX=10) also change
part number from X80-XX-XXX-00-001000
to X80-10-XXX-00-001100
90
5,08µmSn/Pb
2,54
2,79
3,81
7,37
SPECIFY PLATING CODE XX=
10
0,25µm Au
40
5,08µmSn
1,35 DIA.
1,52
2,29
Pin Plating
Series 329...540
2,54
Solder Cup Sockets
0,97 DIA.
HOLE
Fig. 3
329-XX-1 _ _-41-540000
Specify # of pins
Series 429...540
01-64
Solder Cup Sockets
Fig. 3
0,38-0,64
0,25 * 0,46
5,08
Number of Pins
2,54
Fig. 4
429-XX-2 _ _-41-540000
Specify # of pins
02-64
2,54
2,79
3,81
7,37
1,35 DIA.
1,52
0,97 DIA.
HOLE
2,29
XX= Plating Code
See Below
2,54
For RoHS compliance, select plating code.
For the gold option (XX=13) also change
part number from X29-XX-XXX-41-540000
to X29-13-XXX-41-540100
93
5,08µmSn/Pb
2,54
SPECIFY PLATING CODE XX=
13
0,25µmAu
0,76µmAu
43
5,08µmSn
0,76µmAu
Fig. 4
Sleeve (Pin)
Contact (Clip)
0,76µmAu
w w w. m i l l - m a x . c o m
65.1
516-922-6000
FPGA/CPLD
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