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386876

产品描述63/37 400 2% .024dia/23swg
产品类别工具与设备   
文件大小79KB,共2页
制造商Henkel
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386876概述

63/37 400 2% .024dia/23swg

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Technical Data Sheet
C400
April-2011
PRODUCT DESCRIPTION
C400 provides the following product characteristics:
Technology
Product Benefits
Cored solder wire
• Halide free
• No clean
• Clear residue
• Good wetting
• Fast soldering
• Heat stable
• Mild odor
• Pb-free and SnPb alloys available
ROL0
Soldering - Cored wire
Copper, Brass and Nickel
IPC/J-STD-004
Classification
Application
Surface Finishes
Soldering Iron:
● Good results can be obtained using a range of tip
temperatures. However, the optimum tip temperature and
heat capacity required for a hand-soldering process is a
function of both soldering iron design and the nature of
the task.
● Care should be exercised to avoid unnecessarily high tip
temperatures for extensive periods of time.
● A high tip temperature may increase any tendency to flux
spitting and it may produce some residue darkening.
● The tip of the soldering iron should be properly tinned.
Severely contaminated soldering iron tips should be
cleaned with Multicore® Tip Tinner/Cleaner.
● Wipe the tip on a clean, damp sponge before re-tinning
with C400 wire.
Soldering Process:
1. Apply the soldering iron tip to the work surface. The iron
tip should contact both the base material and the lead at
the same time to heat both surfaces properly. It should
take no more than a fraction of a second to heat both
surfaces adequately.
2. Apply C400 flux cored wire to a part of the joint surface
away from the soldering iron and allow to form a joint
fillet. This will be virtually instantaneous. Do not apply
excessive solder to the joint as this will not improve joint
integrity and it will leave excess flux residues on the
surface.
3. Remove solder from the work piece and then remove the
iron tip.
4. The total process will be very rapid, depending upon
thermal mass, tip temperature, tip configuration and the
solderability of the surfaces to be joined.
5. The resin and flux systems are designed to leave
relatively low residues and to minimize residual activity.
This is achieved by ensuring some decomposition and
volatilization takes place during the soldering process
Cleaning:
C400 flux cored solder wire has been formulated to leave
amber flux residues and resist spitting and fuming. In most
industrial and consumer electronics applications, cleaning will
not be required. The product may, therefore, be used to
complement a no-clean wave soldering or reflow process or to
allow repairs to cleaned boards without the need for a second
cleaning process. In high-reliability applications, the residues
should be removed.
Should cleaning be required, this is best achieved using
SC-01™ cleaner.
C400 cored solder wire has been specially formulated to
complement no clean wave and reflow soldering processes.
C400 wires provide fast soldering on copper, brass, and solder
coated materials.
TYPICAL PROPERTIES
Solder Cored Wire
Alloys - Tin/lead
• SN63
• SN60
• SN62
• 97SC (SAC305)
• 96SC (SAC387)
• 99C (SnCu)
• 95A (SnSb)
• 96S (SnAg)
205 to 220 mg KOH/g
Zero
2.2
Alloys - Lead Free
Acid Value
Halide content
Flux Content (%)
ALLOYS:
The alloys used in C400 cored solder wires conform to the
purity requirements of the common national and international
standards.
FLUX:
C400 solid flux is based on modified rosin and carefully
selected activators. In practice they exhibit a mild rosin odor
and leave a small quantity of clear residue.
DIRECTIONS FOR USE
Soldering with C400 does not require any special methods or
deviation from standard hand soldering practices.

 
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