Microcontroller, 16-Bit, UVPROM, H8/500 CPU, 8MHz, CMOS, PQCC84
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Hitachi （Renesas ） |
| 包装说明 | QCCJ, LDCC84,1.2SQ |
| Reach Compliance Code | unknown |
| 位大小 | 16 |
| CPU系列 | H8/500 |
| JESD-30 代码 | S-PQCC-J84 |
| JESD-609代码 | e0 |
| 端子数量 | 84 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC84,1.2SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 2048 |
| ROM（单词） | 16384 |
| ROM可编程性 | UVPROM |
| 速度 | 8 MHz |
| 最大压摆率 | 50 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| HD6475348CP8 | HD6475348CP10 | HD6475348F6 | HD6475348CP6 | HD6435368F10 | HD6435368F8 | HD6435368F6 | HD6435368CP6 | HD6435368CP10 | HD6435368CP8 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 16-Bit, UVPROM, H8/500 CPU, 8MHz, CMOS, PQCC84 | Microcontroller, 16-Bit, UVPROM, H8/500 CPU, 10MHz, CMOS, PQCC84 | Microcontroller, 16-Bit, UVPROM, H8/500 CPU, 6MHz, CMOS, PQFP80 | Microcontroller, 16-Bit, UVPROM, H8/500 CPU, 6MHz, CMOS, PQCC84 | Microcontroller, 16-Bit, MROM, H8/500 CPU, 10MHz, CMOS, PQFP80 | Microcontroller, 16-Bit, MROM, H8/500 CPU, 8MHz, CMOS, PQFP80 | Microcontroller, 16-Bit, MROM, H8/500 CPU, 6MHz, CMOS, PQFP80 | Microcontroller, 16-Bit, MROM, H8/500 CPU, 6MHz, CMOS, PQCC84 | Microcontroller, 16-Bit, MROM, H8/500 CPU, 10MHz, CMOS, PQCC84 | Microcontroller, 16-Bit, MROM, H8/500 CPU, 8MHz, CMOS, PQCC84 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） |
| 包装说明 | QCCJ, LDCC84,1.2SQ | QCCJ, LDCC84,1.2SQ | QFP, QFP80,.7SQ | QCCJ, LDCC84,1.2SQ | QFP, QFP80,.7SQ | QFP, QFP80,.7SQ | QFP, QFP80,.7SQ | QCCJ, LDCC84,1.2SQ | QCCJ, LDCC84,1.2SQ | QCCJ, LDCC84,1.2SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| CPU系列 | H8/500 | H8/500 | H8/500 | H8/500 | H8/500 | H8/500 | H8/500 | H8/500 | H8/500 | H8/500 |
| JESD-30 代码 | S-PQCC-J84 | S-PQCC-J84 | S-PQFP-G80 | S-PQCC-J84 | S-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 | S-PQCC-J84 | S-PQCC-J84 | S-PQCC-J84 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 84 | 84 | 80 | 84 | 80 | 80 | 80 | 84 | 84 | 84 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | QFP | QCCJ | QFP | QFP | QFP | QCCJ | QCCJ | QCCJ |
| 封装等效代码 | LDCC84,1.2SQ | LDCC84,1.2SQ | QFP80,.7SQ | LDCC84,1.2SQ | QFP80,.7SQ | QFP80,.7SQ | QFP80,.7SQ | LDCC84,1.2SQ | LDCC84,1.2SQ | LDCC84,1.2SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | FLATPACK | CHIP CARRIER | FLATPACK | FLATPACK | FLATPACK | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 |
| ROM（单词） | 16384 | 16384 | 16384 | 16384 | 32768 | 32768 | 32768 | 32768 | 32768 | 32768 |
| ROM可编程性 | UVPROM | UVPROM | UVPROM | UVPROM | MROM | MROM | MROM | MROM | MROM | MROM |
| 速度 | 8 MHz | 10 MHz | 6 MHz | 6 MHz | 10 MHz | 8 MHz | 6 MHz | 6 MHz | 10 MHz | 8 MHz |
| 最大压摆率 | 50 mA | 60 mA | 40 mA | 40 mA | 60 mA | 50 mA | 40 mA | 40 mA | 60 mA | 50 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | J BEND | GULL WING | J BEND | GULL WING | GULL WING | GULL WING | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 0.635 mm | 1.27 mm | 0.635 mm | 0.635 mm | 0.635 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Is Samacsys | - | - | - | - | N | N | N | N | N | N |
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