Microcontroller, 16-Bit, MROM, H8/500 CPU, 8MHz, CMOS, PQFP80
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Hitachi (Renesas ) |
包装说明 | QFP, QFP80,.7SQ |
Reach Compliance Code | unknown |
Is Samacsys | N |
位大小 | 16 |
CPU系列 | H8/500 |
JESD-30 代码 | S-PQFP-G80 |
JESD-609代码 | e0 |
端子数量 | 80 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装等效代码 | QFP80,.7SQ |
封装形状 | SQUARE |
封装形式 | FLATPACK |
电源 | 5 V |
认证状态 | Not Qualified |
RAM(字节) | 2048 |
ROM(单词) | 32768 |
ROM可编程性 | MROM |
速度 | 8 MHz |
最大压摆率 | 50 mA |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | QUAD |
Base Number Matches | 1 |
HD6435368F8 | HD6475348CP8 | HD6475348CP10 | HD6475348F6 | HD6475348CP6 | HD6435368F10 | HD6435368F6 | HD6435368CP6 | HD6435368CP10 | HD6435368CP8 | |
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描述 | Microcontroller, 16-Bit, MROM, H8/500 CPU, 8MHz, CMOS, PQFP80 | Microcontroller, 16-Bit, UVPROM, H8/500 CPU, 8MHz, CMOS, PQCC84 | Microcontroller, 16-Bit, UVPROM, H8/500 CPU, 10MHz, CMOS, PQCC84 | Microcontroller, 16-Bit, UVPROM, H8/500 CPU, 6MHz, CMOS, PQFP80 | Microcontroller, 16-Bit, UVPROM, H8/500 CPU, 6MHz, CMOS, PQCC84 | Microcontroller, 16-Bit, MROM, H8/500 CPU, 10MHz, CMOS, PQFP80 | Microcontroller, 16-Bit, MROM, H8/500 CPU, 6MHz, CMOS, PQFP80 | Microcontroller, 16-Bit, MROM, H8/500 CPU, 6MHz, CMOS, PQCC84 | Microcontroller, 16-Bit, MROM, H8/500 CPU, 10MHz, CMOS, PQCC84 | Microcontroller, 16-Bit, MROM, H8/500 CPU, 8MHz, CMOS, PQCC84 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
包装说明 | QFP, QFP80,.7SQ | QCCJ, LDCC84,1.2SQ | QCCJ, LDCC84,1.2SQ | QFP, QFP80,.7SQ | QCCJ, LDCC84,1.2SQ | QFP, QFP80,.7SQ | QFP, QFP80,.7SQ | QCCJ, LDCC84,1.2SQ | QCCJ, LDCC84,1.2SQ | QCCJ, LDCC84,1.2SQ |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
位大小 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
CPU系列 | H8/500 | H8/500 | H8/500 | H8/500 | H8/500 | H8/500 | H8/500 | H8/500 | H8/500 | H8/500 |
JESD-30 代码 | S-PQFP-G80 | S-PQCC-J84 | S-PQCC-J84 | S-PQFP-G80 | S-PQCC-J84 | S-PQFP-G80 | S-PQFP-G80 | S-PQCC-J84 | S-PQCC-J84 | S-PQCC-J84 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 80 | 84 | 84 | 80 | 84 | 80 | 80 | 84 | 84 | 84 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QCCJ | QCCJ | QFP | QCCJ | QFP | QFP | QCCJ | QCCJ | QCCJ |
封装等效代码 | QFP80,.7SQ | LDCC84,1.2SQ | LDCC84,1.2SQ | QFP80,.7SQ | LDCC84,1.2SQ | QFP80,.7SQ | QFP80,.7SQ | LDCC84,1.2SQ | LDCC84,1.2SQ | LDCC84,1.2SQ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | CHIP CARRIER | CHIP CARRIER | FLATPACK | CHIP CARRIER | FLATPACK | FLATPACK | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 | 2048 |
ROM(单词) | 32768 | 16384 | 16384 | 16384 | 16384 | 32768 | 32768 | 32768 | 32768 | 32768 |
ROM可编程性 | MROM | UVPROM | UVPROM | UVPROM | UVPROM | MROM | MROM | MROM | MROM | MROM |
速度 | 8 MHz | 8 MHz | 10 MHz | 6 MHz | 6 MHz | 10 MHz | 6 MHz | 6 MHz | 10 MHz | 8 MHz |
最大压摆率 | 50 mA | 50 mA | 60 mA | 40 mA | 40 mA | 60 mA | 40 mA | 40 mA | 60 mA | 50 mA |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | J BEND | J BEND | GULL WING | J BEND | GULL WING | GULL WING | J BEND | J BEND | J BEND |
端子节距 | 0.635 mm | 1.27 mm | 1.27 mm | 0.635 mm | 1.27 mm | 0.635 mm | 0.635 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Is Samacsys | N | - | - | - | - | N | N | N | N | N |
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