1KX8 OTPROM, 200ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | 0.600 INCH, CERAMIC, DIP-24 |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 200 ns |
| JESD-30 代码 | R-GDIP-T24 |
| 长度 | 32.07 mm |
| 内存密度 | 8192 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 字数 | 1024 words |
| 字数代码 | 1000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 1KX8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.7 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| Base Number Matches | 1 |
| TBP28L86AMJW | TBP28L166NW | TBP28L22N | TBP28L42N | TBP28L86AJW | TBP28L22MJ | TBP28L22J | TBP28L46MJW | TBP28LA22J | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 1KX8 OTPROM, 200ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24 | 2KX8 OTPROM, 125ns, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | 256X8 OTPROM, 70ns, PDIP20, DIP-20 | 512X8 OTPROM, 95ns, PDIP20, DIP-20 | 1KX8 OTPROM, 110ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24 | 256X8 OTPROM, 75ns, CDIP20, CERAMIC, DIP-20 | 256X8 OTPROM, 70ns, CDIP20, CERAMIC, DIP-20 | 512X8 OTPROM, 110ns, CDIP24, 0.600 INCH, CERAMIC, DIP-24 | 256X8 OTPROM, 75ns, CDIP20, CERAMIC, DIP-20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | 0.600 INCH, CERAMIC, DIP-24 | DIP, DIP24,.6 | DIP, DIP20,.3 | DIP-20 | 0.600 INCH, CERAMIC, DIP-24 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP24,.6 | DIP, DIP20,.3 |
| 针数 | 24 | 24 | 20 | 20 | 24 | 20 | 20 | 24 | 20 |
| Reach Compliance Code | not_compliant | _compli | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 200 ns | 125 ns | 70 ns | 95 ns | 110 ns | 75 ns | 70 ns | 110 ns | 75 ns |
| JESD-30 代码 | R-GDIP-T24 | R-PDIP-T24 | R-PDIP-T20 | R-PDIP-T20 | R-GDIP-T24 | R-GDIP-T20 | R-GDIP-T20 | R-GDIP-T24 | R-GDIP-T20 |
| 长度 | 32.07 mm | 31.75 mm | 24.325 mm | 24.325 mm | 32.07 mm | 24.195 mm | 24.195 mm | 32.07 mm | 24.195 mm |
| 内存密度 | 8192 bit | 16384 bi | 2048 bi | 4096 bit | 8192 bit | 2048 bit | 2048 bit | 4096 bit | 2048 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 20 | 20 | 24 | 20 | 20 | 24 | 20 |
| 字数 | 1024 words | 2048 words | 256 words | 512 words | 1024 words | 256 words | 256 words | 512 words | 256 words |
| 字数代码 | 1000 | 2000 | 256 | 512 | 1000 | 256 | 256 | 512 | 256 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C |
| 组织 | 1KX8 | 2KX8 | 256X8 | 512X8 | 1KX8 | 256X8 | 256X8 | 512X8 | 256X8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP24,.6 | DIP24,.6 | DIP20,.3 | DIP20,.3 | DIP24,.6 | DIP20,.3 | DIP20,.3 | DIP24,.6 | DIP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.7 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.7 mm | 5.08 mm | 5.08 mm | 5.7 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15.24 mm | 15.24 mm | 7.62 mm | 7.62 mm | 15.24 mm | 7.62 mm | 7.62 mm | 15.24 mm | 7.62 mm |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | - | Texas Instruments(德州仪器) |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
