电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

Y1633100R000Q0W

产品描述res 100 ohm .6W .02% 2512
产品类别无源元件    电阻器   
文件大小225KB,共4页
制造商Vishay(威世)
官网地址http://www.vishay.com
下载文档 详细参数 全文预览

Y1633100R000Q0W概述

res 100 ohm .6W .02% 2512

Y1633100R000Q0W规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Vishay(威世)
Reach Compliance Codeunknown
构造Chip
JESD-609代码e0
端子数量2
最高工作温度150 °C
最低工作温度-55 °C
封装高度0.64 mm
封装长度6.35 mm
封装形式SMT
封装宽度3.2 mm
包装方法Waffle Pack
额定功率耗散 (P)0.6 W
电阻100 Ω
电阻器类型FIXED RESISTOR
系列VFCP2512 (Z FOIL)
尺寸代码2512
技术METAL FOIL
温度系数-.2,.2 ppm/°C
端子面层Tin/Lead (Sn/Pb)
容差0.02%
工作电压220 V

文档预览

下载PDF文档
VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Vishay Foil Resistors
UltraUltra High-Precision with ofFlip Chip Resistorng W TCR of gn
High-Pr sion Flip p stor TCR ±0.05
eci Z-Foil Chi Resi Z-Foil
ppm/°C, Space with ound
35%
Savi vs. rapar Desi
±0.05 ppm/°C, 35% Space Saving vs. Wraparound Design
and PCR of 5 ppm at Rated Power
FEATURES
• Temperature coefficient of resistance (TCR):
± 0.05 ppm/°C nominal (0°C to + 60°C)
± 0.2 ppm/°C nominal (–55°C to +125°C, +25°C ref.)
(see Table 1 and Figure 2)
• Tolerance: to ±0.01% (100 ppm)
• Power coefficient “∆R due to self heating” 5 ppm at
rated power
• Load-life stability (70°C for 2000 h): ±0.005% (50 ppm)
• Power rating to: 600 mW at +70°C
• Electrostatic discharge (ESD): at least to 25 kV
• Resistance range: 5 Ω to 125 kΩ (for lower and higher
values, please contact us)
• Foil resistors are not restricted to standard values;
specific “as required” values can be supplied at no
extra cost or delivery (e.g., 1K2345 vs. 1K)
• Non-inductive, non-capacitive design
• Thermal stabilization time: <1 s (within 10 ppm of
steady state value)
• Short time overload: ≤0.005% (50 ppm)
• Non hot spot design
• Rise time: 1 ns effectively no ringing
• Current noise: <0.010 μV
rms
/ V of applied voltage
(<–40 dB)
• Voltage coefficient: <0.1 ppm/V
• Non-inductive: <0.08 μH
• Terminal finishes available: lead (Pb)-free, tin/lead alloy
• Compliant to RoHS directive 2002/95/EC*
• Matched sets are available per request
• Prototype quantities available in just 5 working days or
sooner. For more information, please contact us.
in the most critical applications by eliminating the need for
corrective circuitry and reducing the large land patterns
needed for a wrap-around configuration. The device’s flip-
chip configuration saves up to 35% PCB space compared
with a surface-mount chip with wraparound terminations
while also providing better strain relief to eliminate
cracked substrates and board delamination.
In addition to its remarkably improved load-life stability,
the VFCP Series is noise-free and provides ESD
protection of 25 kV or more for increased reliability. The
device’s solid element alloy is matched to the substrate,
forming a single entity with balanced resistance versus
temperature characteristics for an unusually low and
predictable TCR over a wide temperature range from
–55°C to more than +125°C. The adhesive that holds the
foil to the flat substrate withstands high temperatures,
pulsing power, moisture incursions, shock and vibration,
and low-temperature exposure while still holding securely
to the foil element. Resistance patterns are photo-etched
into the element to permit the trimming of resistance
values to very tight tolerances as low as 0.01%.
The Flip Chips devices are qualified as anti-sulfurated
resistors for use in environments with high levels of
contamination. Such environments include alternative
energy applications, industrial control systems,
sensors, RTDs, electric instrumentation, weather and
communication base stations, and any electronic
appliance used in high concentrations of sulfur. The
combination of flip-chip terminations and Z-Foil
construction and materials results in the most stable
resistors available, requiring the lowest error allowance.
This means that more error allowance can be transferred
to active devices—resulting in lower costs—or applied
to the foil resistors themselves, allowing for looser initial
tolerances than would be required for other resistor
technologies.
INTRODUCTION
Based on VFR’s next-generation Bulk Metal
®
Z-Foil
technology, the VFCP Series (foil resistor flip-chip)
excels over all previous stability standards for precision
resistors with an order of magnitude improvement in
high-temperature stability, load-life stability, and moisture
resistance. These new benchmark levels of performance
provide design engineers with the tools to build circuits
not previously achievable while reducing costs and space
RELATED VIDEO
Refer to
Bulk Metal® Foil Resistor TCR Performance
(Product Demo).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document No.: 63106
Revision: 16-Sep-2013
For questions, contact
foil@vishaypg.com
www.vishayfoilresistors.com
1
C8051F版数字湿度计调试5---OLED显示圆形时钟
OLED显示圆形时钟 52339 52341 ...
sdjntl DIY/开源硬件专区
2007智多微电子集成设计考题
digital的题1,asic流程2,两级寄存器的design,中间有加一些组合逻辑延时,还有输入输出延时什么的,要求画时序和求最大时钟。3,一段verilog代码,要求找出错误和修改。4,一个序列检测状态机( ......
hongqi FPGA/CPLD
基于VHDL的八路抢答器的实现
技术要求: (1) 抢答器具有8路定时抢答功能,抢答时间设定为30s,主持人按下“开始”后,定时器立即倒计时,并显示,同时扬声器发出短暂的声响约0.5s; (2) 选手在设定时间 ......
maidi0018 嵌入式系统
为DIY大赛加把油:LaunchPad超多代码分享
同事分享的:>>TI TEMBOO Temboo支持7种编程语言,其平台相当于为程序员提供了一个基于云系统的图书馆,拥有超过2000个的代码和代码编排,供程序员直接取用。当你的App希望支持将文件同步到D ......
soso 微控制器 MCU
单片机PI算法
大家谁有开关电源 PI算法程序,单片机实现!!能不能参考一下!!! ...
735978414a 电子竞赛
如果让你设计一个控制电机的上位机软件,你会选择什么工具呢
如果让你设计一个控制电机的上位机软件,你会选择什么工具呢?采用什么通讯协议比较好呢?...
Study_Stellaris 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1389  1370  2349  2923  53  1  52  34  8  55 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved