AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown |
| 系列 | AC |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 8.89 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Sup | 75000000 Hz |
| 最大I（ol） | 0.012 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3/5 V |
| 传播延迟（tpd） | 16 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 1.905 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 8.89 mm |
| 最小 fmax | 95 MHz |
| Base Number Matches | 1 |
| 5962-87756012A | 54AC273LMQB | 54AC273WG-QML/NOPB | 54AC273FMQB | 54AC273WG-QML | 54AC273DMQB | 5962-8775601SA | 5962-8775601RA | |
|---|---|---|---|---|---|---|---|---|
| 描述 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDSO20, GULL WING, CERPACK-20 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP20, CERPACK-20 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDSO20, GULL WING, CERPACK-20 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 |
| 包装说明 | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | SOP, | DFP, FL20,.3 | SOP, SOP20,.4 | DIP, DIP20,.3 | DFP, FL20,.3 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown | unknown | compliant | unknown | compliant | unknown | unknown | unknown |
| 系列 | AC | AC | AC | AC | AC | AC | AC | AC |
| JESD-30 代码 | S-CQCC-N20 | S-CQCC-N20 | R-GDSO-G20 | R-GDFP-F20 | R-GDSO-G20 | R-GDIP-T20 | R-GDFP-F20 | R-GDIP-T20 |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | QCCN | SOP | DFP | SOP | DIP | DFP | DIP |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE | FLATPACK | SMALL OUTLINE | IN-LINE | FLATPACK | IN-LINE |
| 传播延迟（tpd） | 16 ns | 16 ns | 16 ns | 16 ns | 16 ns | 16 ns | 16 ns | 16 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 Class B | MIL-PRF-38535 | MIL-STD-883 Class B | MIL-PRF-38535 | MIL-STD-883 Class B | MIL-STD-883 | MIL-STD-883 |
| 座面最大高度 | 1.905 mm | 1.905 mm | 2.59 mm | 2.286 mm | 2.59 mm | 5.08 mm | 2.286 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | NO LEAD | GULL WING | FLAT | GULL WING | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 最小 fmax | 95 MHz | 95 MHz | 95 MHz | 95 MHz | 95 MHz | 95 MHz | 95 MHz | 95 MHz |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | - | - |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 | e0 | e0 |
| 负载电容（CL） | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 最大频率@ Nom-Sup | 75000000 Hz | 75000000 Hz | - | 75000000 Hz | 75000000 Hz | 75000000 Hz | 75000000 Hz | 75000000 Hz |
| 最大I（ol） | 0.012 A | 0.012 A | - | 0.012 A | 0.012 A | 0.012 A | 0.012 A | 0.012 A |
| 封装等效代码 | LCC20,.35SQ | LCC20,.35SQ | - | FL20,.3 | SOP20,.4 | DIP20,.3 | FL20,.3 | DIP20,.3 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | - | - |
| 电源 | 3.3/5 V | 3.3/5 V | - | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 宽度 | 8.89 mm | 8.89 mm | - | 6.731 mm | - | 7.62 mm | 6.731 mm | 7.62 mm |
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