board demo 16bit 160msps ltc2209
| DC1282A-A | LTC2209CUP#TRPBF | LTC2209IUP#PBF | LTC2209CUP#PBF | DC1281A-A | LTC2209IUP#TRPBF | DC1281A-B | |
|---|---|---|---|---|---|---|---|
| 描述 | board demo 16bit 160msps ltc2209 | IC adc 16bit 160msps 64-qfn | IC adc 16bit 160msps 64-qfn | IC adc 16bit 160msps 64-qfn | board demo 16bit 160msps ltc2209 | IC adc 16bit 160msps 64-qfn | board demo 16bit 160msps ltc2209 |
| Brand Name | - | Linear Technology | Linear Technology | Linear Technology | - | Linear Technology | - |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | - | 符合 | - |
| 厂商名称 | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | - | Linear ( ADI ) | - |
| 零件包装代码 | - | QFN | QFN | QFN | - | QFN | - |
| 包装说明 | - | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, LCC64,.35SQ,20 | - | HVQCCN, LCC64,.35SQ,20 | - |
| 针数 | - | 64 | 64 | 64 | - | 64 | - |
| 制造商包装代码 | - | UP | UP | UP | - | UP | - |
| Reach Compliance Code | - | compliant | compliant | compliant | - | compliant | - |
| ECCN代码 | - | 3A001.A.5.A.5 | 3A001.A.5.A.5 | 3A001.A.5.A.5 | - | 3A001.A.5.A.5 | - |
| 最大模拟输入电压 | - | 1.5 V | 1.5 V | 1.5 V | - | 1.5 V | - |
| 最小模拟输入电压 | - | 1 V | 1 V | 1 V | - | 1 V | - |
| 转换器类型 | - | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | - | ADC, PROPRIETARY METHOD | - |
| JESD-30 代码 | - | S-PQCC-N64 | S-PQCC-N64 | S-PQCC-N64 | - | S-PQCC-N64 | - |
| JESD-609代码 | - | e3 | e3 | e3 | - | e3 | - |
| 长度 | - | 9 mm | 9 mm | 9 mm | - | 9 mm | - |
| 最大线性误差 (EL) | - | 0.0084% | 0.0084% | 0.0084% | - | 0.0084% | - |
| 湿度敏感等级 | - | 1 | 1 | 1 | - | 1 | - |
| 模拟输入通道数量 | - | 1 | 1 | 1 | - | 1 | - |
| 位数 | - | 16 | 16 | 16 | - | 16 | - |
| 功能数量 | - | 1 | 1 | 1 | - | 1 | - |
| 端子数量 | - | 64 | 64 | 64 | - | 64 | - |
| 最高工作温度 | - | 70 °C | 85 °C | 70 °C | - | 85 °C | - |
| 输出位码 | - | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | - | OFFSET BINARY, 2\'S COMPLEMENT BINARY | - |
| 输出格式 | - | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | - | PARALLEL, WORD | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - |
| 封装代码 | - | HVQCCN | HVQCCN | HVQCCN | - | HVQCCN | - |
| 封装等效代码 | - | LCC64,.35SQ,20 | LCC64,.35SQ,20 | LCC64,.35SQ,20 | - | LCC64,.35SQ,20 | - |
| 封装形状 | - | SQUARE | SQUARE | SQUARE | - | SQUARE | - |
| 封装形式 | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | - | 260 | - |
| 电源 | - | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - |
| 采样速率 | - | 160 MHz | 160 MHz | 160 MHz | - | 160 MHz | - |
| 采样并保持/跟踪并保持 | - | SAMPLE | SAMPLE | SAMPLE | - | SAMPLE | - |
| 座面最大高度 | - | 0.8 mm | 0.8 mm | 0.8 mm | - | 0.8 mm | - |
| 标称供电电压 | - | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | - |
| 表面贴装 | - | YES | YES | YES | - | YES | - |
| 技术 | - | CMOS | CMOS | CMOS | - | CMOS | - |
| 温度等级 | - | COMMERCIAL | INDUSTRIAL | COMMERCIAL | - | INDUSTRIAL | - |
| 端子面层 | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) | - |
| 端子形式 | - | NO LEAD | NO LEAD | NO LEAD | - | NO LEAD | - |
| 端子节距 | - | 0.5 mm | 0.5 mm | 0.5 mm | - | 0.5 mm | - |
| 端子位置 | - | QUAD | QUAD | QUAD | - | QUAD | - |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | - | 30 | - |
| 宽度 | - | 9 mm | 9 mm | 9 mm | - | 9 mm | - |
嵌入式系统
模拟与混合信号
微控制器 MCU
RF/无线
单片机
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