Digital Signal Processors & Controllers - DSP, DSC Fix/Floating-Pt DSP
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | FBGA, BGA256,16X16,40 |
| 针数 | 256 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.3 |
| 地址总线宽度 | 13 |
| 桶式移位器 | NO |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 50 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FLOATING POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B256 |
| JESD-609代码 | e1 |
| 长度 | 17 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 3 |
| 端子数量 | 256 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装等效代码 | BGA256,16X16,40 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.2,1.8,3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 8192 |
| 座面最大高度 | 2.05 mm |
| 最大供电电压 | 1.35 V |
| 最小供电电压 | 1.25 V |
| 标称供电电压 | 1.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 17 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| TMS320C6747CZKB4 | TMX320C6747DZKBA3 | TMX320C6747BZKB3 | TMS320C6747AZKB3 | TMS320C6745CPTPD4 | TMS320C6745CPTP3 | TMS320C6745CPTPT3 | TMS320C6747CZKB3 | TMS320C6747CZKBA3 | TMS320C6745CPTP4 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Digital Signal Processors & Controllers - DSP, DSC Fix/Floating-Pt DSP | Digital Signal Processors & Controllers - DSP, DSC Fixed/Floating-Point DSP | Digital Signal Processors & Controllers - DSP, DSC PRIMUS 2 | Digital Signal Processors & Controllers - DSP, DSC TMS320C674X LOW POWER DSPS - FLOATING-POINT DIGITAL SIGNAL PROCESSOR | Digital Signal Processors & Controllers - DSP, DSC Fix/Floating-Pt DSP | Digital Signal Processors & Controllers - DSP, DSC Fix/Floating-Pt DSP | Digital Signal Processors & Controllers - DSP, DSC Fix/Floating-Pt DSP | Digital Signal Processors & Controllers - DSP, DSC Fix/Floating-Pt DSP | Digital Signal Processors & Controllers - DSP, DSC Fix/Floating-Pt DSP | Digital Signal Processors & Controllers - DSP, DSC Fix/Floating-Pt DSP |
| 是否无铅 | 含铅 | - | - | 含铅 | - | 不含铅 | 含铅 | 含铅 | 含铅 | - |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 | - |
| 零件包装代码 | BGA | - | BGA | BGA | - | QFP | QFP | BGA | BGA | - |
| 包装说明 | FBGA, BGA256,16X16,40 | - | BGA, BGA256,16X16,40 | BGA, BGA256,16X16,40 | - | HLFQFP, QFP176,1.0SQ,20 | HLFQFP, QFP176,1.0SQ,20 | FBGA, BGA256,16X16,40 | FBGA, BGA256,16X16,40 | - |
| 针数 | 256 | - | 256 | 256 | - | 176 | 176 | 256 | 256 | - |
| Reach Compliance Code | compliant | - | compliant | unknown | - | compliant | compliant | compliant | compliant | - |
| 位大小 | 32 | - | 32 | 32 | - | 32 | 32 | 32 | 32 | - |
| 格式 | FLOATING POINT | - | FLOATING POINT | FLOATING POINT | - | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | - |
| JESD-30 代码 | S-PBGA-B256 | - | S-PBGA-B256 | S-PBGA-B256 | - | S-PQFP-G176 | S-PQFP-G176 | S-PBGA-B256 | S-PBGA-B256 | - |
| 端子数量 | 256 | - | 256 | 256 | - | 176 | 176 | 256 | 256 | - |
| 最高工作温度 | 70 °C | - | 70 °C | 70 °C | - | 70 °C | 105 °C | 70 °C | 85 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | FBGA | - | BGA | BGA | - | HLFQFP | HLFQFP | FBGA | FBGA | - |
| 封装等效代码 | BGA256,16X16,40 | - | BGA256,16X16,40 | BGA256,16X16,40 | - | QFP176,1.0SQ,20 | QFP176,1.0SQ,20 | BGA256,16X16,40 | BGA256,16X16,40 | - |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | - |
| 封装形式 | GRID ARRAY, FINE PITCH | - | GRID ARRAY | GRID ARRAY | - | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | - |
| 峰值回流温度（摄氏度） | 260 | - | NOT SPECIFIED | - | - | 260 | 260 | 260 | 260 | - |
| 电源 | 1.2,1.8,3.3 V | - | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | - | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| RAM（字数） | 8192 | - | 8192 | 8192 | - | 8192 | 8192 | 8192 | 8192 | - |
| 表面贴装 | YES | - | YES | YES | - | YES | YES | YES | YES | - |
| 技术 | CMOS | - | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | - |
| 端子形式 | BALL | - | BALL | BALL | - | GULL WING | GULL WING | BALL | BALL | - |
| 端子节距 | 0.5 mm | - | 1 mm | 1 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - |
| 端子位置 | BOTTOM | - | BOTTOM | BOTTOM | - | QUAD | QUAD | BOTTOM | BOTTOM | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | - | DIGITAL SIGNAL PROCESSOR, OTHER | - | - | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | - |
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