Pipeline Register, 8-Bit, CMOS, 0.300 INCH, CERDIP-24
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ |
| 边界扫描 | NO |
| 外部数据总线宽度 | 8 |
| JESD-609代码 | e0 |
| 长度 | 32.004 mm |
| 低功率模式 | NO |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出数据总线宽度 | 8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, PIPELINE REGISTER |
| Base Number Matches | 1 |
| 5962-8873603LX | 5962-8873603KX | 5962-88736033X | 5962-8873601LX | 5962-8873601KX | 5962-88736013X | |
|---|---|---|---|---|---|---|
| 描述 | Pipeline Register, 8-Bit, CMOS, 0.300 INCH, CERDIP-24 | Pipeline Register, 8-Bit, CMOS, CERPACK-24 | Pipeline Register, 8-Bit, CMOS, LCC-28 | Pipeline Register, 8-Bit, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Pipeline Register, 8-Bit, CMOS, CERPACK-24 | Pipeline Register, 8-Bit, CMOS, LCC-28 |
| 零件包装代码 | DIP | DFP | QLCC | DIP | DFP | QLCC |
| 包装说明 | DIP, | DFP, | QCCN, | DIP, | DFP, | QCCN, |
| 针数 | 24 | 24 | 28 | 24 | 24 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 其他特性 | MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ | MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ | MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ | MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ | MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ | MULTIPLEXED OUTPUT; ICC SPECIFIED @ 5MHZ |
| 边界扫描 | NO | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 低功率模式 | NO | NO | NO | NO | NO | NO |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DFP | QCCN | DIP | DFP | QCCN |
| 封装形式 | IN-LINE | FLATPACK | CHIP CARRIER | IN-LINE | FLATPACK | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.286 mm | 2.54 mm | 5.08 mm | 2.286 mm | 2.54 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | FLAT | NO LEAD | THROUGH-HOLE | FLAT | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD |
| 宽度 | 7.62 mm | 9.144 mm | 11.4554 mm | 7.62 mm | 9.144 mm | 11.4554 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER | DSP PERIPHERAL, PIPELINE REGISTER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 长度 | 32.004 mm | - | 11.4554 mm | 32.004 mm | - | 11.4554 mm |
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