VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Vishay Foil Resistors
Ultra High Precision Z-Foil Flip Chip Resistor with TCR
of ± 0.05 ppm/°C, 35 % Space Saving vs. Wraparound Design
and PCR of 5 ppm at Rated Power
•
Temperature coefficient of resistance (TCR):
± 0.05 ppm/°C typical (0 °C to + 60 °C)
± 0.2 ppm/°C typical (- 55 °C to + 125 °C,
+ 25 °C ref.)
•
Tolerance: to ± 0.01 % (100 ppm)
•
Power coefficient “ΔR due to self heating”
5 ppm at rated power
•
Load life stability (70 °C for 2000 h): ± 0.005 % (50 ppm)
•
Power rating to: 600 mW at + 70 °C
•
Electrostatic discharge (ESD) up to 25 000 V
•
Resistance range: 10
Ω
to 125 kΩ (for lower and higher
values, please contact us)
•
Vishay Foil resistors are not restricted to standard values;
specific “as required” values can be supplied at no extra
cost or delivery (e.g. 1K2345 vs. 1K)
•
Non-inductive, non-capacitive design
•
Short time overload
≤
0.005 % (50 ppm)
•
Non hot spot design
•
Rise time: 1 ns effectively no ringing
•
Current noise: - 40 dB
•
Voltage coefficient < 0.1 ppm/V
•
Non-inductive: < 0.08 µH
•
Terminal finishes available: lead (Pb)-free, tin/lead alloy
•
Compliant to RoHS directive 2002/95/EC
•
Matched sets are available per request
•
Prototype quantities available in just 5 working days
or sooner. For more information, please contact
foil@vishay.com
•
For better performances please contact us
FEATURES
Bottom View
INTRODUCTION
One of the most important parameters influencing stability is
the temperature coefficient of resistance (TCR). Although the
TCR of Bulk Metal
®
Foil resistors is considered extremely
low, this characteristic has been further refined over the
years.
The VFCP Series utilizes ultra precision Bulk Metal
®
Z-Foil.
The Z-Foil technology provides a significant reduction to the
resistive element’s sensitivity to ambient temperature
variations (TCR) and to self heating when power is applied
(power coefficient).
Along with the inherently low PCR and TCR, Z-Foil
technology also provides remarkably improved load life
stablility, low noise and availability of tight tolerance.
IM
PR
O
VE
D
The flip chip configuration provides a substantial PCB space
saving of more than 35 % vs. a surface mount chip with
wraparound terminations. The VFCP is available in any
value within the specified resistance range.
Our application engineering department is available to
advise and make recommendations. For non-standard
technical requirements and special applications, please
contact us.
TABLE 1 - TOLERANCE AND TCR VS.
RESISTANCE VALUE
RESISTANCE
VALUE
(Ω)
250 to 125K
TOLERANCE
(%)
± 0.01
TYPICAL TCR AND
MAX. SPREAD
(- 55 °C to + 125 °C,
+ 25 °C Ref.)
± 0.2 ± 1.6
Percent of Rated Power
100 to < 250
50 to < 100
25 to < 50
± 0.02
± 0.2 ± 1.6
± 0.05
± 0.1
± 0.2 ± 1.8
± 0.2 ± 2.8
10 to < 25
± 0.25
± 0.2 ± 2.8
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 63106
Revision: 07-Jul-09
For any questions, contact:
foil@vishay.com
www.vishay.com
1
PR
O
DU
CT
APPLICATIONS
•
•
•
•
•
•
•
•
•
Automatic test equipment (ATE)
High precision instrumentation
Laboratory, industrial and medical
Audio
EB applications (electron beam scanning and recording
equipment, electron microscopes)
Military and space
Airborne
Down hole instrumentation
Communication
FIGURE 1 - POWER DERATING CURVE
- 55 °C
100
75
50
25
0
- 75
+ 70 °C
- 50
- 25
0
+ 25
+ 50
+ 75 + 100 + 125 + 150 + 175
Ambient Temperature (°C)
VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Vishay Foil Resistors
FIGURE 2 - TRIMMING TO VALUES
(Conceptual Illustration)
Mutual Inductance
Reduction due
to Change in
Current Direction
Note:
Foil shown in
black,
etched spaces in
white
TABLE 2 - SPECIFICATIONS
CHIP
SIZE
0805
1206
1506
RATED
POWER
(mW)
at + 70 °C
100 mW
250 mW
300 mW
MAXIMUM
VOLTAGE
RATING
(≤
P
×
R
)
28 V
79 V
95 V
167 V
220 V
RESISTANCE
RANGE (Ω)
10 to 8K
10 to 25K
10 to 30K
10 to 70K
MAXIMUM
WEIGHT
(mg)
5.2
10.3
12
25
IM
PR
O
VE
D
2010
2512
400 mW
600 mW
10 to 125K
35
TABLE 4 - PERFORMANCES
TEST OR CONDITION
MIL-PRF-55342
CHARACTERISTIC E
ΔR
LIMITS
± 0.1 %
Thermal Shock
Low Temperature Operation
Short Time Overload
± 0.1 %
± 0.1 %
High Temperature Exposure
± 0.1 %
Resistance to Soldering Heat
Moisture Resistance
± 0.2 %
± 0.2 %
Load Life Stability + 70 °C for 2000 hours
at Rated Power
± 0.5 %
Note
(1)
As shown + 0.01 W to allow for measurement errors at low values.
www.vishay.com
2
For any questions, contact:
foil@vishay.com
PR
O
DU
CT
Current Path
After Trimming
Trimming Process
Removes this Material
from Shorting Strip Area
Changing Current Path
and Increasing
Resistance
Interloop Capacitance
Reduction in Series
Current Path
Before Trimming
TABLE 3 - LOAD LIFE STABILITY
(+ 70 °C for 2000 h)
CHIP SIZE
0805
1206
1506
2010
2512
MAXIMUM
ΔR
LIMITS
± 0.005 % at 50 mW
± 0.01 % at 100 mW
± 0.005 % at 150 mW
± 0.01 % at 250 mW
± 0.005 % at 150 mW
± 0.01 % at 300 mW
± 0.005 % at 200mW
± 0.01 % at 400 mW
± 0.005 % at 500 mW
± 0.01 % at 600 mW
TYPICAL
ΔR
LIMITS
± 0.005 % (50 ppm)
± 0.005 % (50 ppm)
± 0.005 % (50 ppm)
± 0.01 % (100 ppm)
± 0.005 % (50 ppm)
± 0.005 % (50 ppm)
± 0.005 % (50 ppm)
MAXIMUM
ΔR
LIMITS
(1)
± 0.01 % (100 ppm)
± 0.01 % (100 ppm)
± 0.01 % (100 ppm)
± 0.02 % (200 ppm)
± 0.015 % (150 ppm)
± 0.02 % (200 ppm)
± 0.01 % (100 ppm)
Document Number: 63106
Revision: 07-Jul-09
VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Vishay Foil Resistors
TABLE 5 - DIMENSIONS AND LAND PATTERN
in inches (millimeters)
BOTTOM VIEW (showing terminals for mounting)
D
Solder Terminals
LAND PATTERN
W
W1 [W - 0.003"]
L - 0.005 (0.13)
L
CHIP
SIZE
0805
1206
1506
2010
2512
Notes
•
•
•
L
± 0.005 (0.13)
0.079 (2.01)
0.126 (3.20)
0.150 (3.81)
0.200 (5.08)
0.250 (6.35)
W
± 0.005 (0.13)
0.049 (1.24)
0.062 (1.57)
0.062 (1.57)
0.100 (2.54)
0.126 (3.20)
THICKNESS
MAXIMUM
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
IM
PR
O
VE
D
Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction
Vacuum pick up is recommended for handling
Soldering iron is not applicable
FIGURE 3 - CHIP CONFIGURATION
High Purity Alumina Substrate
Resistive
Bulk
®
Metal Foil
Solder
Protective Coating
Document Number: 63106
Revision: 07-Jul-09
For any questions, contact:
foil@vishay.com
PR
O
DU
CT
G
X
Z
D
± 0.005 (0.13)
0.010 (0.25)
0.015 (0.38)
0.012 (0.30)
0.020 (0.51)
0.024 (0.61)
Z
G
X
0.078 (1.98)
0.125 (3.18)
0.150 (3.81)
0.199 (5.05)
0.250 (6.35)
0.053 (1.35)
0.090 (2.29)
0.120 (3.05)
0.153 (3.89)
0.196 (4.98)
0.049 (1.24)
0.062 (1.57)
0.062 (1.57)
0.100 (2.54)
0.126 (3.20)
FIGURE 4 - TYPICAL RESISTANCE/
TEMPERATURE CURVE
(For more details, see Table 1)
+ 500
+ 400
+ 300
+ 200
+ 100
ΔR
0
R
(ppm)
- 100
- 200
- 300
- 400
- 500
- 55
- 25
0
+ 25
+ 60 + 75
+ 100 + 125
- 0.16 ppm/°C
0.05 ppm/°C
- 0.1 ppm/°C
0.1 ppm/°C
0.14 ppm/°C
0.2 ppm/°C
Ambient Temperature (°C) and TCR Chord Slopes for
Differetn Termperature Ranges
Note
• The TCR values for < 100
Ω
are influenced by the termination
composition and result in deviation from this curve
www.vishay.com
3
VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Vishay Foil Resistors
TABLE 6 - GLOBAL PART NUMBER INFORMATION
(1)
NEW GLOBAL PART NUMBER: Y163010K0000T9W (preferred part number format)
DENOTES PRECISION
Y
VALUE
R
=
Ω
K
= kΩ
CHARACTERISTICS
0
= standard
9
= lead (Pb)-free
1 to 999
= custom
Y
1
6
3
0
1
0
PRODUCT CODE
1629
= VFCP0805
1630
= VFCP1206
1631
= VFCP1506
1632
= VFCP2010
1633
= VFCP2512
RESISTANCE TOLERANCE
T
= ± 0.01 %
Q
= ± 0.02 %
A
= ± 0.05 %
B
= ± 0.10 %
C
= ± 0.25 %
D
= ± 0.50 %
F
= ± 1.00 %
FOR EXAMPLE: ABOVE GLOBAL ORDER Y1630 10K0000 T 9 W:
TYPE: VFCP1206
VALUE: 10.0 kΩ
ABSOLUTE TOLERANCE: ± 0.01 %
TERMINATION: lead (Pb)-free
PACKAGING: waffle pack
HISTORICAL PART NUMBER: VFCP1206 10K000 TCR0.2 T S W (will continue to be used)
VFCP1206
MODEL
VFCP0805
VFCP1206
VFCP1506
VFCP2010
VFCP2512
10K000
OHMIC VALUE
10.0 kΩ
TCR0.2
TCR
Characteristic
T
IM
PR
O
VE
D
Note
(1)
For non-standard requests, please contact application engineering.
www.vishay.com
4
For any questions, contact:
foil@vishay.com
PR
O
DU
CT
K
0
0
0
0
T
9
W
PACKAGING
R
= tape and reel
W
= waffle pack
S
W
RESISTANCE
TOLERANCE
T
= ± 0.01 %
Q
= ± 0.02 %
A
= ± 0.05 %
B
= ± 0.10 %
C
= ± 0.25 %
D
= ± 0.50 %
F
= ± 1.00 %
TERMINATION
S
= lead (Pb)-free
B
= tin/lead
PACKAGING
T
= tape and reel
W
= waffle pack
Document Number: 63106
Revision: 07-Jul-09
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
1
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
