电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C1210F473M4RACTM

产品描述Ceramic Capacitor, Multilayer, Ceramic, 16V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.047uF, Surface Mount, 1210, CHIP, ROHS COMPLIANT
产品类别无源元件    电容器   
文件大小567KB,共1页
制造商KEMET(基美)
官网地址http://www.kemet.com
标准  
下载文档 详细参数 全文预览

C1210F473M4RACTM概述

Ceramic Capacitor, Multilayer, Ceramic, 16V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.047uF, Surface Mount, 1210, CHIP, ROHS COMPLIANT

C1210F473M4RACTM规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Objectid1238675199
包装说明, 1210
Reach Compliance Codecompliant
ECCN代码EAR99
YTEOL2
电容0.047 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
JESD-609代码e3
制造商序列号C1210
安装特点SURFACE MOUNT
多层Yes
负容差20%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法TR, 7 INCH
正容差20%
额定(直流)电压(URdc)16 V
尺寸代码1210
表面贴装YES
温度特性代码X7R
温度系数15% ppm/°C
端子面层Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状WRAPAROUND

文档预览

下载PDF文档
SOLUTIONS
Flex Mitigation Multilayer
Ceramic Capacitors
Hybrid Technology
Programs Supported
• Commercial
• Automotive
Why Choose KEMET
KEMET applies world-class service and quality
to deliver industry-leading, high performance
capacitance solutions worldwide. With 95% of
possible dielectric solutions, KEMET offers the
world’s most complete line of surface mount
and through-hole capacitor technologies across
tantalum, ceramic, film, aluminum and paper
dielectrics. One world. One KEMET.
KEMET Electrical/Physical Characteristics
Dielectric
Case
Sizes
Tolerances
Temperature
Range
Voltage
Options
Capacitance
Values
Flexible Termination + Open Mode (FO-CAP)
X7R
0805 - 1812
± 5%, ±10%, ± 20%
- 55°C to +125°C
16 – 200 V
1,000 pF – 6.8 µF
Features & Benefits
• Fail open electrode designs
• Low to high capacitance flex mitigation
• Flex mitigation technology inside the chip
and in the termination area
• Provides protection against a low IR or short
circuit condition
• Superior flex performance (up to 5 mm)
• Pb-Free and RoHS compliant
Flexible Termination + Floating Electrode (FF-CAP)
X7R
0603 - 1812
± 5%, ± 10%, ± 20%
- 55°C to +125°C
6.3 – 250 V
180 pF – 0.22 µF
Product Checklist
• Is this a critical and safety relevant circuit?
• Is your circuit board subject to high levels
of board flexure during assembly, mounting
or depanelization?
• Are you placing MLCCs close to the edges
or corners of your board?
• Are MLCCs being placed near or around
connectors or heavy components?
• Do you require a case size smaller than
EIA 0603?
• Is mechanical or thermal stress a concern in
your application?
• Is your application commercial or automotive?
• What are your capacitance requirements?
Flexible Termination +
Open Mode (FO-CAP)
Flexible Termination +
Floating Electrode (FF-CAP)
Ordering Information
Ceramic Case Size Specification/ Capacitance Capacitance Rated Dielectric Failure Termination Packaging/Grade
(L” x W”)
Series
Code (pF) Tolerance Voltage
Rate/Design Finish
1
(C-Spec)
2
(VDC)
C
1210
0805
1206
1210
1812
F
J = Flexible
Termination
with Open
Mode
685
K
3
R
A
A = N/A
C
C = 100%
Matte Sn
L = SnPb
(5% min)
TU
Blank = Bulk
TU = 7” Reel
Unmarked
TM = 7” Reel
Marked
AUTO =
Automotive Grade
7”Reel Unmarked
TU
Blank = Bulk
TU = 7” Reel
Unmarked
TM = 7” Reel
Marked
2 Significant K = ±10%
Digits +
M = ±20%
Number of
Zeros
4 = 16 V R = X7R
3 = 25 V
5 = 50 V
1 = 100 V
2 = 200 V
C
0805
0603
0805
1206
1210
1812
Y
Y=
Flexible
Termination
with
Floating
Electrode
104
2 Signicant
Digits +
Number of
Zeros
K
5
R
A
A = N/A
C
C = 100%
Matte Sn
L = SnPb
(5% min)
For more information, samples
and engineering kits,
please visit us at www.kemet.com
or call 1.877.myKEMET.
SA0612
J = ±5% 9 = 6.3 V R = X7R
K = ±10% 8 = 10 V
M = ±20% 4 = 16 V
3 = 25 V
5 = 50 V
1 = 100 V
2 = 200 V
A = 250 V
Additional termination finish options may be available. Contact KEMET for details.
SnPb termination finish option is not available on Automotive Grade product.
2
Additional reeling or packaging options may be available. Contact KEMET for details.
1
1,2
Copyright © 2012 KEMET
芯片发烫了,是不是烧了??
用手一抹好烫,是不是烧坏了,就搞不清楚,3也能烧坏么??烧坏的芯片发烫还是没烧坏的发烫呀??...
zhouzhuzhu 微控制器 MCU
DSP C6000汇编,数据字节非对齐问题的处理
基础知识:读取1个Byte用LDB,读取2个Byte用LDH,读取4个Byte用LDW,读取8个Byte用LDDW,C6000的寄存器32是位,所以当使用LDDW时需要使用寄存器对(比如A5:A4)。 在处理数据时,字节是否对 ......
fish001 DSP 与 ARM 处理器
求助:怎样实现VB和GPIB的通信?
求助:怎样实现VB和GPIB的通信? 如果有懂得N88BASIC的人请联系我QQ:4270169 ...
heys 嵌入式系统
【TI技术文章】:选择指南:TI基于ARM®技术的处理器
德州仪器 (TI) 充分认识到低功耗、低成本解决方案的市场需求,并致力于采用各种基于 ARM 技术的解决方案来加强其嵌入式处理产品系列,从而全方位满足当今市场对高性价比和低功耗应用的需求。TI ......
德仪DSP新天地 DSP 与 ARM 处理器
STM32新手选那款比较好?给点建议,非常感谢。
项目需要用到STM32系列的单片机,不知道选那款MCU好,自己也要开始学习不知道选什么型号的STM32的开发版,希望有经验的大侠给点指点,不慎感激,有MSP430的开发经验,学这个不知道要多长时间。 ......
ly971021598 stm32/stm8
史上最全3.3V--5V电平转换方案
史上最全3.3V--5V电平转换方案 不喜勿喷!真诚奉献。...
aida66 模拟电子

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 556  1855  2771  667  100  12  38  56  14  3 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved