Rambus DRAM, 16MX16, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54
参数名称 | 属性值 |
零件包装代码 | BGA |
包装说明 | , |
针数 | 54 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | BLOCK ORIENTED PROTOCOL |
JESD-30 代码 | R-PBGA-B54 |
内存密度 | 268435456 bit |
内存集成电路类型 | RAMBUS DRAM |
内存宽度 | 16 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 54 |
字数 | 16777216 words |
字数代码 | 16000000 |
工作模式 | SYNCHRONOUS |
组织 | 16MX16 |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 2.63 V |
最小供电电压 (Vsup) | 2.37 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
端子形式 | BALL |
端子位置 | BOTTOM |
Base Number Matches | 1 |
256MD-40-800 | 256MD-45-711 | 256MD-45-800 | 256MD-50-711 | 256MD-53-600 | 288MD-40-800 | 288MD-50-711 | 288MD-45-711 | 288MD-45-800 | 288MD-53-600 | |
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描述 | Rambus DRAM, 16MX16, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX16, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX16, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX16, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX16, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX18, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX18, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX18, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX18, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 | Rambus DRAM, 16MX18, CMOS, PBGA54, 9 X 8 MM, CENTER BONDED, MICRO, BGA-54 |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
针数 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL | BLOCK ORIENTED PROTOCOL |
JESD-30 代码 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 | R-PBGA-B54 |
内存密度 | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 301989888 bit | 301989888 bit | 301989888 bit | 301989888 bit | 301989888 bit |
内存集成电路类型 | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM | RAMBUS DRAM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 18 | 18 | 18 | 18 | 18 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 | 54 |
字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
组织 | 16MX16 | 16MX16 | 16MX16 | 16MX16 | 16MX16 | 16MX18 | 16MX18 | 16MX18 | 16MX18 | 16MX18 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V | 2.63 V |
最小供电电压 (Vsup) | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V | 2.37 V |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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