Multiplexer, S Series, 1-Func, 8 Line Input, 1 Line Output, True Output, TTL, CDIP16, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 零件包装代码 | DIP |
| 包装说明 | CERAMIC, DIP-16 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 系列 | S |
| JESD-30 代码 | R-CDIP-T16 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 1 |
| 输入次数 | 8 |
| 输出次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 传播延迟（tpd） | 7.5 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| Base Number Matches | 1 |
| 54S257DMQB | 74S257DC | 74S257PC | 54LS257DM | 74S257FC | |
|---|---|---|---|---|---|
| 描述 | Multiplexer, S Series, 1-Func, 8 Line Input, 1 Line Output, True Output, TTL, CDIP16, CERAMIC, DIP-16 | Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16, | Multiplexer, 4-Func, 2 Line Input, TTL, PDIP16 | Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16, | Multiplexer, 4-Func, 2 Line Input, TTL, CDFP16, |
| 厂商名称 | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| 包装说明 | CERAMIC, DIP-16 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 |
| Reach Compliance Code | unknown | compliant | unknown | unknown | compliant |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 |
| JESD-30 代码 | R-CDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | - |
| JESD-609代码 | e0 | e0 | - | e0 | - |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | - |
| 功能数量 | 1 | 4 | 4 | 4 | - |
| 输入次数 | 8 | 2 | 2 | 2 | - |
| 端子数量 | 16 | 16 | 16 | 16 | - |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 125 °C | - |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC | PLASTIC/EPOXY | CERAMIC | - |
| 封装代码 | DIP | DIP | DIP | DIP | - |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | NO | NO | NO | NO | - |
| 技术 | TTL | TTL | TTL | TTL | - |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | - |
| Base Number Matches | 1 | 1 | 1 | - | - |
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