TAZ Series
CWR29 - MIL-PRF-55365/11
A low ESR version of CWR09 and
CWR19 that is fully qualified to MIL-
PRF-55365/11, this series represents
the most flexible of surface mount form
factors, offering nine case sizes. The
molded construction is compatible
with a wide range of SMT board
assembly processes including wave or
reflow solder, conductive epoxy or
compression bonding techniques. The
five smaller cases are characterized by
their low profile construction; with the
A case being the world’s smallest
molded military tantalum. There are
three termination finishes available:
fused solder plated (“K” per MIL-PRF-
55365), hot solder dipped (“C”) and
gold plated (“B”). In addition, the mold-
ing compound has been selected to
meet the requirements of UL94V-0
(Flame Retardancy) and requirements
of NASA SP-R-0022A (Outgassing).
CASE DIMENSIONS:
Case Length (L)
Width (W)
Height (H)
Code ±0.38 (0.015) ±0.38 (0.015) ±0.38 (0.015)
A
B
2.54 (0.100)
3.81 (0.150)
5.08 (0.200)
3.81 (0.150)
5.08 (0.200)
5.59 (0.220)
6.73 (0.265)
7.24 (0.285)
6.93 Max
(0.273)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
2.54 (0.100)
2.54 (0.100)
3.43 (0.135)
2.79 (0.110)
3.81 (0.150)
5.41 Max
(0.213)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.78 (0.070)
Term. Width (W
1
)
1.27±0.13
(0.050±0.005)
1.27±0.13
(0.050±0.005)
1.27±0.13
(0.050±0.005)
2.41+0.13/-0.25
(0.095+0.005/-0.010)
2.41+0.13/-0.25
(0.095+0.005/-0.010)
millimeters (inches)
Term. Length (A)
±0.13 (0.005)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
1.27 (0.050)
1.27 (0.050)
1.19 (0.047)
S min
1.80 (0.071)
1.65 (0.065)
2.92 (0.115)
1.65 (0.065)
2.92 (0.115)
3.43 (0.135)
3.56 (0.140)
0.70 (0.028)
N/A
MARKING
(White marking on black body)
Polarity Stripe (+)
C
D
E
F
Capacitance Code
Rated Voltage
G
H
X
3.30±0.13
(0.130±0.005)
2.67±0.13
2.79 (0.110)
(0.105±0.005)
3.68+0.13/-0.51
2.79 (0.110) (0.145+0.005/-0.020)
2.74 Max
(0.108)
3.05±0.13
(0.120±0.005)
HOW TO ORDER
CWR29
Type
J
Voltage
Code
C = 4Vdc
D = 6Vdc
F = 10Vdc
H = 15Vdc
J = 20Vdc
K = 25Vdc
M = 35Vdc
N = 50Vdc
–
Termination
Finish
K = Fused Solder
Plated
C = Hot Solder
Dipped
B = Gold Plated
225
Capacitance
Code
pF code:
1st two digits
represent
significant
figures 3rd digit
represents
multiplier
(number of zeros
to follow)
*
Capacitance
Tolerance
M = ±20%
K = ±10%
J = ±5%
@
Reliability
Grade
Weibull: B =
0.1%/1000 Hrs.
(90% C =
0.01%/1000
Hrs. conf.)
Comm: Z =
Non ER
D
Case
Size
+
Surge Test
Option
A = 10 cycles, +25°C
B = 10 cycles, -55°C
& +85°C
C = 10 cycles, -55°C
& +85°C
before Weibull
Z = None required
Packaging
Bulk = Standard
\TR = 7" T&R
\TR13 = 13" T&R
\W = Waffle
TECHNICAL SPECIFICATIONS
Technical Data:
Capacitance Range:
Capacitance Tolerance:
Rated Voltage: (V
R
)
Category Voltage: (V
C
)
Surge Voltage: (V
S
)
Temperature Range:
Unless otherwise specified, all technical
0.33 μF to 330 μF
±5%; ±10%; ±20%
4
6
10
15
2.7
4
7
10
5.2
8
13
20
3.4
5
8
13
-55°C to +125°C
data relate to an ambient temperature of 25°C
85°C:
125°C:
85°C:
125°C:
20
13
26
16
25
17
32
20
35
23
46
28
50
33
65
40
66
NXP MCU
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