
flash 1.65 to 1.95v 8mbit multi-purpose flash
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | DSBGA |
| 包装说明 | VFBGA, BGA48,6X11,20 |
| 针数 | 48 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.1.A |
| Factory Lead Time | 6 weeks |
| 最长访问时间 | 70 ns |
| 命令用户界面 | YES |
| 通用闪存接口 | YES |
| 数据轮询 | YES |
| JESD-30 代码 | R-PBGA-B48 |
| JESD-609代码 | e1 |
| 长度 | 6 mm |
| 内存密度 | 8388608 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 16 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 部门数/规模 | 256 |
| 端子数量 | 48 |
| 字数 | 524288 words |
| 字数代码 | 512000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 512KX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA48,6X11,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 1.8 V |
| 编程电压 | 1.8 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.73 mm |
| 部门规模 | 2K |
| 最大待机电流 | 0.00004 A |
| 最大压摆率 | 0.02 mA |
| 最大供电电压 (Vsup) | 1.95 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 |
| 切换位 | YES |
| 类型 | NOR TYPE |
| 宽度 | 4 mm |

| SST39WF800B-70-4I-MAQE | SST39WF800B-70-4I-B3KE-T | SST39WF800B-70-4C-EKE | SST39WF800B-70-4I-C2QE | SST39WF800B-70-4C-MAQE-T | SST39WF800B-70-4I-CAQE | SST39WF800B-70-4C-CAQE | SST39WF800B-70-4I-MAQE-T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | flash 1.65 to 1.95v 8mbit multi-purpose flash | flash 1.65 to 1.95v 8mbit multi-purpose flash | flash 1.65 to 1.95v 8mbit multi-purpose flash | IC flash 8mbit 70ns 48xflga | IC,EEPROM,NOR FLASH,512KX16,CMOS,BGA,48PIN,PLASTIC | 512K X 16 FLASH 1.8V PROM, 70 ns, PBGA48, 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CZB-4, FLGA-48 | 512K X 16 FLASH 1.8V PROM, 70 ns, PBGA48, 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CZB-4, FLGA-48 | IC,EEPROM,NOR FLASH,512KX16,CMOS,BGA,48PIN,PLASTIC |
| 是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | - | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 包装说明 | VFBGA, BGA48,6X11,20 | - | - | 5 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-222, FLGA-48 | FBGA, BGA48,6X11,20 | VFLGA, LGA48,6X11,20 | VFLGA, LGA48,6X11,20 | FBGA, BGA48,6X11,20 |
| Reach Compliance Code | compliant | compliant | - | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | - | EAR99 | - | EAR99 | EAR99 | - |
| 最长访问时间 | 70 ns | 70 ns | - | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns |
| 命令用户界面 | YES | YES | - | YES | YES | YES | YES | YES |
| 通用闪存接口 | YES | YES | - | YES | YES | YES | YES | YES |
| 数据轮询 | YES | YES | - | YES | YES | YES | YES | YES |
| JESD-30 代码 | R-PBGA-B48 | R-PBGA-B48 | - | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 | R-PBGA-B48 |
| JESD-609代码 | e1 | e3 | - | e1 | - | e3 | e3 | - |
| 内存密度 | 8388608 bit | 8388608 bit | - | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| 内存集成电路类型 | FLASH | FLASH | - | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 16 | 16 | - | 16 | 16 | 16 | 16 | 16 |
| 部门数/规模 | 256 | 256 | - | 256 | 256 | 256 | 256 | 256 |
| 端子数量 | 48 | 48 | - | 48 | 48 | 48 | 48 | 48 |
| 字数 | 524288 words | 524288 words | - | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | - | 512000 | 512000 | 512000 | 512000 | 512000 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | - | -40 °C | - | -40 °C |
| 组织 | 512KX16 | 512KX16 | - | 512KX16 | 512KX16 | 512KX16 | 512KX16 | 512KX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | FBGA | - | VFLGA | FBGA | VFLGA | VFLGA | FBGA |
| 封装等效代码 | BGA48,6X11,20 | BGA48,6X8,32 | - | LGA48,6X11,20 | BGA48,6X11,20 | LGA48,6X11,20 | LGA48,6X11,20 | BGA48,6X11,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, FINE PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | 260 | 260 | - | 260 | - | 260 | 260 | - |
| 电源 | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 部门规模 | 2K | 2K | - | 2K | 2K | 2K | 2K | 2K |
| 最大待机电流 | 0.00004 A | 0.00004 A | - | 0.00004 A | 0.00004 A | 0.00004 A | 0.00004 A | 0.00004 A |
| 最大压摆率 | 0.02 mA | 0.02 mA | - | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | - | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | MATTE TIN | MATTE TIN | - |
| 端子形式 | BALL | BALL | - | BUTT | BALL | BUTT | BUTT | BALL |
| 端子节距 | 0.5 mm | 0.8 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 | 40 | - | 40 | - | 40 | 40 | - |
| 切换位 | YES | YES | - | YES | YES | YES | YES | YES |
| 类型 | NOR TYPE | NOR TYPE | - | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
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