电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

177-710-2-21GP6J7-24SAN

产品描述Interconnection Device
产品类别连接器    连接器   
文件大小436KB,共4页
制造商Glenair
官网地址http://www.glenair.com/
标准
下载文档 详细参数 全文预览

177-710-2-21GP6J7-24SAN概述

Interconnection Device

177-710-2-21GP6J7-24SAN规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Reach Compliance Codecompli
连接器类型INTERCONNECTION DEVICE
Base Number Matches1

文档预览

下载PDF文档
MWDM Micro-D Shielded Cable Assemblies
Single-Ended or Double-Ended–These
easy-to-order cable
assemblies eliminate the need for expensive assembly
labor. 100% tested and ready for use.
Now With Twisted Pairs–No
need to create a procurement
specification for Micro-D cables with twisted pairs. Glenair
177-740 cables are furnished with a full complement of
white/blue twisted pair wires.
Integral Shield Termination–The
connector shell has a
platform to accept Band-It shield termination bands. The
cable shield braid is attached directly to the connector.
Save Labor, Reduce Weight and Improve EMI Shielding with
Glenair’s Micro-D Shielded Cable Assemblies
Aerospace electronics systems require higher and higher levels of protection from radiated emissions. Glenair’s fully
shielded Micro-D cable assemblies meet this need. The cable shield is attached directly onto the one-piece connector
shell and secured with a stainless steel
BAND-IT
® clamp. These pre-wired, 100% tested assemblies meet the
requirements of MIL-DTL-83513. An optional ground spring on the pin connector assures low shell-to-shell resistance.
Available with a variety of wire types and shields, Micro-D shielded assemblies can be ordered in any length, either
single-ended or “back-to-back”.
Ground Spring and EMI Shielding Effectiveness
– A gold-plated
stainless steel ground spring on the pin connector mating face offers
substantial improvement in EMI protection. The graphs compare
identical connectors tested with and without ground springs.
EMI Performance with Ground Spring
SHIELDING EFFECTIVENESS (DB)
SHIELDING EFFECTIVENESS (DB)
100
90
80
70
60
50
40
30
20
10
0
1.00E+03
100
90
80
70
60
50
40
30
20
10
0
1.00E+03
EMI Performance without Ground Spring
1.00E+04
1.00E+05
1.00E+06
1.00E+07
1.00E+08
1.00E+09
1.00E+04
1.00E+05
1.00E+06
1.00E+07
1.00E+08
1.00E+09
FREQUENCY (Hz)
FREQUENCY (Hz)
© 2006 Glenair, Inc.
CAGE Code 06324/0CA77
Printed in U.S.A.
GLENAIR, INC. • 1211 AIR WAY • GLENDALE, CA 91201-2497 • 818-247-6000 • FAX 818-500-9912
www.glenair.com
B-8
E-Mail: sales@glenair.com
TMS320F2812开发板应用问题
我现在刚开始用DSP的开发板,用IO口控制LED灯的闪烁,程序没有问题,但是实际电路就是led灯一直亮,而且,输出电压该是0的,但我用万用表检测,却是1.9,及其不稳定,想问问大家有没有这样的情 ......
yl2006443 DSP 与 ARM 处理器
基于C2000的永磁同步电机无传感器矢量控制
基于C2000的永磁同步电机无传感器矢量控制...
彧木 微控制器 MCU
HOHO,终于解决了彩信的集成问题了,散分!
花了大半年时间,终于解决了所有问题,把所有的协议都集成到硬件设备里面了,现在发彩信就像和发送短信一样,直接利用AT命令就可以了! 哈哈,好开心啊!...
yjdhr 嵌入式系统
FLASH高低4M读写重复
各位,小弟现在调试一款64Mb的FLASH,发现在读写时,高低4MB的数据同时被操作 即我操作0x1F8000时,0x3f8000也同时被操作了 请问有谁碰到过同样的问题呀?...
tanrui8765 嵌入式系统
LPC2000双机SPI通信
LPC2000双机SPI通信中,SPI从机是如何给主机发送数据的,何时发送?有没有例程?求救...
wydf0813 NXP MCU
u-boot中makefile如何判断因该编译哪些子目录?
如s3c44b0编译u-boot时,makefile要判断u-boot下哪些文件需要编译,哪些与s3c44b0无关,不需要编译。makefile是如何判断的呢?makefile中对应的代码为: $(obj)u-boot: depend $(SUBDIRS) $(OBJ ......
duanzhangshan 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1146  428  1523  812  601  24  9  31  17  13 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved