5962-8868101XX概述

Standard SRAM, 64KX4, 35ns, CMOS, CQCC28, CERAMIC, LCC-28

5962-8868101XX规格参数

参数名称	属性值
零件包装代码	QLCC
包装说明	QCCN,
针数	28
Reach Compliance Code	unknown
ECCN代码	3A001.A.2.C
最长访问时间	35 ns
JESD-30 代码	R-CQCC-N28
内存密度	262144 bit
内存集成电路类型	STANDARD SRAM
内存宽度	4
功能数量	1
端子数量	28
字数	65536 words
字数代码	64000
工作模式	ASYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	64KX4
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCN
封装形状	RECTANGULAR
封装形式	CHIP CARRIER
并行/串行	PARALLEL
认证状态	Not Qualified
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	NO LEAD
端子位置	QUAD
Base Number Matches	1

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5962-8868101XX相似产品对比

	5962-8868101XX	5962-8868101LA	5962-8868105XX	5962-8952406XA	5962-8868106XX	5962-8868101XC	5962-8952404XA
描述	Standard SRAM, 64KX4, 35ns, CMOS, CQCC28, CERAMIC, LCC-28	Standard SRAM, 64KX4, 35ns, CMOS, CDIP24, CERAMIC, DIP-24	Standard SRAM, 64KX4, 25ns, CMOS, CQCC28	Standard SRAM, 64KX4, 20ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24	Standard SRAM, 64KX4, 20ns, CMOS, CQCC28	Standard SRAM, 64KX4, 35ns, CMOS, CQCC28, CERAMIC, LCC-28	Standard SRAM, 64KX4, 35ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24
包装说明	QCCN,	DIP,	QCCN,	DIP, DIP28,.3	QCCN,	QCCN, LCC28,.35X.55	DIP, DIP28,.3
Reach Compliance Code	unknown	unknow	unknown	unknown	unknown	unknown	unknown
ECCN代码	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
最长访问时间	35 ns	35 ns	25 ns	20 ns	20 ns	35 ns	35 ns
JESD-30 代码	R-CQCC-N28	R-GDIP-T24	R-CQCC-N28	R-GDIP-T24	R-CQCC-N28	R-CQCC-N28	R-GDIP-T24
内存密度	262144 bit	262144 bi	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	4	4	4	4	4	4	4
功能数量	1	1	1	1	1	1	1
端子数量	28	24	28	24	28	28	24
字数	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
字数代码	64000	64000	64000	64000	64000	64000	64000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
组织	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
封装代码	QCCN	DIP	QCCN	DIP	QCCN	QCCN	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	NO	YES	NO	YES	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
端子形式	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE
端子位置	QUAD	DUAL	QUAD	DUAL	QUAD	QUAD	DUAL
Base Number Matches	1	1	1	1	1	1	1
零件包装代码	QLCC	DIP	-	DIP	-	DIP	DIP
针数	28	24	-	24	-	24	24
其他特性	-	AUTOMATIC POWER-DOWN	TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY	-	TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY	AUTOMATIC POWER-DOWN	-
JESD-609代码	-	e0	-	e0	-	e4	e0
长度	-	31.75 mm	13.97 mm	31.75 mm	13.97 mm	13.97 mm	31.75 mm
端口数量	-	1	-	1	-	1	1
输出特性	-	3-STATE	-	3-STATE	-	3-STATE	3-STATE
可输出	-	NO	-	YES	-	NO	YES
筛选级别	-	MIL-STD-883	-	38535Q/M;38534H;883B	-	38535Q/M;38534H;883B	38535Q/M;38534H;883B
座面最大高度	-	5.08 mm	3.048 mm	5.08 mm	3.048 mm	2.03 mm	5.08 mm
最小待机电流	-	2 V	-	2 V	-	2 V	2 V
端子面层	-	TIN LEAD	-	Tin/Lead (Sn/Pb) - hot dipped	-	Gold (Au)	Tin/Lead (Sn/Pb) - hot dipped
端子节距	-	2.54 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm
宽度	-	7.62 mm	8.89 mm	7.62 mm	8.89 mm	8.89 mm	7.62 mm
厂商名称	-	-	-	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices

5962-8868101XX

5962-8868101XX概述

5962-8868101XX规格参数

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5962-8868101XX相似产品对比

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