Surface Mount QSOP
Resistor Networks
QSOP Series
•
Reliable, no internal cavity
•
High resistor density - .025” lead spacing
•
Standard JEDEC 16, 20, and 24 pin packages
•
Ultra-stable TaNSil
®
resistors on silicon substrates
•
Standard Sn/Pb and Pb-free terminations available
IRC Advanced Film Division
IRC’s TaNSil
®
QSOP resistor networks are the perfect solution for high volume applications that demand a
small wiring board footprint. The .025” lead spacing provides higher lead density, increased component count,
lower resistor cost, and high reliability.
The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking, low cost
and miniature package. Excellent performance in harsh, humid environments is a trademark of IRC’s self-pas-
sivating TaNSil
®
resistor film.
The QSOP series is ideally suited for the latest surface mount assembly techniques and each lead can be
100% visually inspected. The compliant gull wing leads relieve thermal expansion and contraction stresses
created by soldering and temperature excursions.
For applications requiring high performance resistor networks in a low cost, surface mount package, specify
IRC QSOP resistor networks.
Electrical Data
Resistance Range
Absolute Tolerance
Ratio Tolerance to R1
Absolute TCR
Tracking TCR
Element Power Rating @ 70°C
Isolated Schematic
Bussed Schematic
Package Power Rating @ 70°C
10
−
250KΩ
To ±0.1%
To ±0.05%
To ±25ppm/°C
To ±5ppm/°C
100mW
50mW
16-Pin
20-Pin
24-Pin
750mW
1.0W
1.0W
Environmental Data
Test Per
MIL-PRF-83401
Thermal Shock
Power
Conditioning
High Temperature
Exposure
Short-time
Overload
Low Temperature
Storage
Life
Typical
Delta R
±0.02%
±0.03%
±0.03%
±0.02%
±0.03%
±0.05%
Max
Delta R
±0.1%
±0.1%
±0.05%
±0.05%
±0.05%
±0.1%
Rated Operating Voltage
________________
Operating Temperature
Noise
(not to exceed
√
Power X Resistance)
100 Volts
-55°C to +125°C
<-30dB
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
A subsidiary of
TT electronics plc
QSOP Series Issue February 2005
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
Surface Mount QSOP
Resistor Networks
Manufacturing Capability Data
ISOLATED SCHEMATIC A
Absolute
TCR
(ppm/°C)
Ohmic
Range
(Ω)
Ω
10 - 25
26 - 50
51 - 200
250
201 - 250K
BCDFGJ
ABCDFG
5
101 - 200
201 - 500
501 - 100K
26 - 50
51 - 200
100
201 - 250K
DFGJ
CDFGJ
BCDFGJ
CDFG
CDFG
ABFG
10
5
5
26 - 50
51 - 100
101 - 200
201 - 500
501 - 100K
26 - 50
51 - 200
50
201 - 250K
BCDFGJ
ABFG
5
201 - 500
501 - 100K
51 - 200
25
201 - 250K
BCDFGJ
ABFG
5
501 - 100K
CDFGJ
CDFG
5
201 - 500
DFGJ
CDFGJ
CDFG
CDFG
10
5
51 - 100
101 - 200
Available
Ratio
Tolerances
FG
CDFG
CDFG
Best TCR
Tracking
(±ppm/°C)
50
10
5
Ohmic
Range
(Ω)
Ω
10 - 25
26 - 50
51 - 100
IRC Advanced Film Division
BUSSED SCHEMATIC B
Available
Ratio
Tolerances
FG
DFG
CDFG
BCDFG
BCDFG
ABCDFG
DFG
CDFG
BCDFG
BCDFG
ABCDFG
CDFG
BCDFG
BCDFG
ABCDFG
BCDFG
ABCDFG
Best TCR
Tracking
(ppm/°C)
200
100
50
25
20
5
100
50
25
20
5
50
25
20
5
20
5
Available
Tolerances
FGJ
DFGJ
CDFGJ
Available
Tolerances
FGJ
FGJ
DFGJ
DFGJ
BCDFGJ
BCDFGJ
FGJ
DFGJ
DFGJ
BCDFGJ
BCDFGJ
DFGJ
DFGJ
BCDFGJ
BCDFGJ
BCDFGJ
BCDFGJ
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
QSOP Series Issue February 2005
Surface Mount QSOP
Resistor Networks
Physical Data
N
IRC Advanced Film Division
N
R1
1
2
3
0.154" ±.003"
0.236" ±.008"
N
Schematic A
Isolated
R1
1
0.025" Typ
L
1
2
3
Schematic B
Bussed
0.064" ±.003"
0.010" ±.002"
0.006" ±.002"
Note: N = number of pins (16, 20, 24)
# OF PINS
16
20
24
DIMENSION "L"
0.193" ±0.004"
0.341" ±0.004"
0.341" ±0.004"
Note: All dimesions exclude mold flash and
end flash which shall not exceed 0.006” per side.
Power Derating Data
100
Ordering Data
Prefix
Style
QS8 = 16-pin Network
QS0 = 20-pin Network
QSC = 24-pin Network
GUS - QS8
A - 01 - 1002 - F
B
% Of Rated Power
Schematic and Termination
50
A = Isolated network w/ standard Sn/Pb terminations
ALF= Isolated network w/ Pb-free terminations
B = Bussed network w/ standard Sn/Pb terminations
BLF= Bussed network w/ Pb-free terminations
Absolute TCR Code
10
25°
70°
125°
00 = ±250ppm/°C; 01 = ±100ppm/°C
02 = ±50ppm/°C; 03 = ±25ppm/°C
Resistance Code
4-Digit Resistance Code
Ex: 1002 = 10KΩ, 50R1 = 50.1Ω
Temperature in °C
Absolute Tolerance Code
J = ±5%; G = ±2%; F = ±1%; D = ±0.5%
C = ±0.25%; B = ±0.1%
Ratio Tolerance Code (optional)
G = ±2%; F = ±1%; D = ±0.5%;
C = ±0.25%; B = ±0.1%; A = ±0.05%
Packaging
Specify tubes or tape & reel.
For additional information or to discuss your specific requirements,
please contact our Applications Team using the contact details below.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
QSOP Series Issue February 2005
International Resistive Company
Advanced Film Division
4222 South Staples Street
Corpus Christi, Texas 78411, USA
Lead Free Certification & RoHS Compliance
Rev: 10-Apr-2006
Telephone: +1(361)992-7900
Facsimile: +1(361)992-3377
Email:
ircafd@irctt.com
Website: www.irctt.com
Information Matrix by Family
LR / LRF
CURRENT
SENSE
RESISTORS
LR2512LF-
LRF2512LF-
LR2010LF-
LRF2010LF-
LR1206LF-
LRF1206LF-
SC3-LRF 3W
CURRENT
SENSE /
POWER
RESISTORS
PFC THIN
FILM CHIP
RESISTORS
PFC-W0603LF-
PFC-W0805LF-
PFC-W1206LF-
PFC-D1206LF-
PWC THICK
WCR THICK FILM PULSE
FILM CHIP
CHIP
RESISTORS
RESISTOR
WCR0402LF-
WCR0603LF-
WCR0805LF-
WCR1206LF-
WCR1210LF-
WCR2010LF-
WCR2512LF-
PWC0805LF-
PWC1206LF-
PWC2010LF-
PWC2512LF-
WCA - WCC
THICK FILM
CHIP ARRAY
PRECISION
CHIP
RESISTORS-
NICHROME
PCF-W0402LF-
PCF-W0603LF-
PCF-W0805LF-
PCF-W1206LF-
PCF-W1210LF-
SOIC SILICON
RESISTOR
NETWORKS
(SOIC)
SS4ALF- SS4BLF-
SS7ALF- SS7BLF-
SS8ALF- SS8BLF-
SL8ALF- SL8BLF-
SL0ALF- SL0BLF-
QSOP SILICON
RESISTOR
NETWORKS
TSSSOP
SILICON
RESISTOR
NETWORKS
SOT23 &
SOT143
SILICON
RESISTOR
NETWORKS
WIRE-
BONDABLE
CHIP
RESISTORS
SON CERAMIC
PRECISION
R-NETS
NS4ALB- NS4BLF-
NS7ALF- NS7BLF-
NS8ALF- NS8BLF-
N959LF- N954LF-
N989LF- N987LF-
N999LF- N998LF-
SIP-DIP-FLAT PACK
CERAMIC
R-NETS
4769LF- 4761LF- 4789LF-
4781LF- 4709LF- 4701LF-
1989LF- 1987LF- 1999LF-
1998LF- 8989LF- 8987LF-
8999LF- 8998LF-
New Part Numbers for Lead Free Components
SC3LF-
LRF3WLF-
WCA0804LF-
WCC0804LF-
QS8ALF- QS8BLF-
QS0ALF- QS0BLF-
QSCALF- QSCBLF-
TS8ALF- TS8BLF-
TS0ALF- TS0BLF-
TSCALF- TSCBLF-
SOT23LF-
SOT143LF-
R0202-
T0303-
TIMELINE
Scheduled Transition Date Code (YYWW) (Date that
manufacturing will shift to lead free.)
0501
0501
0501
0432
0501
0501
0501
0501
TBD (Note 1)
Matte tin over
copper alloy
TBD
TBD
No
Yes
0501
TBD (Note 1)
Matte tin over
copper alloy
TBD
TBD
No
Yes
0501
TBD (Note 1)
Matte tin over
copper alloy
TBD
TBD
No
Yes
0501
TBD (Note 1)
Matte tin over
copper alloy
TBD
TBD
No
Yes
always lead
free
always lead
free
Aluminum
TBD
N/A
No
Yes
0501
None planned
(Note 2)
Matte tin over
nickel
260°C
1
No
Yes
NONE
PLANNED
Discontinuation Date Code For Tin-Lead Finish (YYWW) None Planned
None planned
None Planned
TBD (Note 1)
0432
0501
(Date after which no tin-lead will be manufactured.)
(Note 2)
(Note 2)
(Note 2)
Lead-Free finish Matte tin over Matte tin over Matte tin over Matte tin over Matte tin over Matte tin over
nickel
nickel
nickel
nickel
nickel
nickel
REFLOW CONDITIONS
Peak Reflow Temperature (°C)
MSL in accordance with J-STD 020C
COMPONENT AND PACKAGE MARKING
Component Marking (Pb Free Indicator)
Packaging Marking (Pb Free Indicator on reel, tube, etc.)
RoHS Compliance including DIRECTIVE 2002/95/EC OF
THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of
27 January 2003 and DIRECTIVE 2003/11/EC OF THE
EUROPEAN PARLIAMENT AND OF THE COUNCIL of 6
February 2003
260°C
1
No
Yes
260°C
1
No
Yes
260°C
1
No
Yes
260°C
1
No
Yes
260°C
1
No
Yes
260°C
1
No
Yes
TBD
Matte tin over
nickel
260°C
1
No
Yes
None planned (Note 2)
Gold over nickel or
HSD with SAC alloy
260°C
1
No
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
RESTRICTED SUBSTANCES
Reference: EIA/EICTA/GPSSI JOINT INDUSTRY GUIDE-
MATERIAL COMPOSITION DECLARATION GUIDE (DRAFT
XX-XXXX, September 19, 2003)
LEVEL-A
LEVEL-B
IMDS REPORTABLE SUBSTANCES
Reference: IMDS International list of reportable
substances
IMDS (short)
none
none
none
none
none
none
none
lead
(Note 3)
none
lead
(Note 3)
none
lead
(Note 3)
none
none
none
none
none
none
none
none
none
none
none
none
none
none
none
none
nickel
nickel
nickel
nickel
bismuth
nickel
antimony
nickel
bismuth
antimony
nickel
SL = Antimony
none
none
none
none
nickel
nickel
Note 1- If a planned phaseout of tin-lead terminations is required, a PCN will be posted providing at least 6 months of notification.
Note 2- Tin-lead terminations will not be phased out unless a suitable replacement is approved by DSCC.
Note 3- Lead is in thick film glass and permitted under RoHS Directive, exemption 5.
QF008_IRC Lead Free Product Availability and Material Declaration Sheets_2006-04-10.xls
Microchip MCU
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