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SMBG5383AE3

产品描述Zener Diode, 150V V(Z), 10%, 1.38W, Silicon, Unidirectional, DO-215AA, ROHS COMPLIANT, PLASTIC, SMBG, 2 PIN
产品类别分立半导体    二极管   
文件大小427KB,共4页
制造商Microsemi
官网地址https://www.microsemi.com
标准  
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SMBG5383AE3概述

Zener Diode, 150V V(Z), 10%, 1.38W, Silicon, Unidirectional, DO-215AA, ROHS COMPLIANT, PLASTIC, SMBG, 2 PIN

SMBG5383AE3规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Microsemi
零件包装代码DO-215AA
包装说明R-PDSO-G2
针数2
Reach Compliance Codecompliant
ECCN代码EAR99
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
最大动态阻抗330 Ω
JEDEC-95代码DO-215AA
JESD-30 代码R-PDSO-G2
JESD-609代码e3
湿度敏感等级1
元件数量1
端子数量2
最高工作温度150 °C
最低工作温度-65 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.38 W
标称参考电压150 V
表面贴装YES
技术ZENER
端子面层MATTE TIN
端子形式GULL WING
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差10%
工作测试电流8 mA

文档预览

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SMBG5333 thru SMBG5388B, e3
SMBJ5333 thru SMBJ5388B, e3
SURFACE MOUNT 5.0 Watt ZENER DIODES
SCOTTSDALE DIVISION
DESCRIPTION
The SMBJ5333-5388B or SMBG5333-5388B series of surface mount 5.0
watt Zeners provides voltage regulation in a selection from 3.3 to 200 volts
with different tolerances as identified by suffix letter on the part number. It is
equivalent to the JEDEC registered 1N5333 thru 1N5388B with identical
electrical characteristics and testing as well as RoHS Compliant with an e3
suffix. It is available in J-bend design (SMBJ) with the DO-214AA package
for greater PC board mounting density or in Gull-wing design (SMBG) in the
DO-215AA for visible solder connections. These plastic encapsulated
Zeners have a moisture classification of Level 1 with no dry pack required
and are also available in military equivalent screening levels by adding a
prefix identifier as further described in the Features section. Microsemi also
offers numerous other Zener products to meet higher and lower power
applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
FEATURES
Surface mount equivalent to 1N5333 to 1N5388B
Ideal for high-density and low-profile mounting
Zener voltage available 3.3V to 200V
Standard voltage tolerances are plus/minus 5% with
B suffix and 10 % with A suffix identification
Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
Options for screening in accordance with MIL-PRF-19500
for JAN, JANTX, and JANTXV are available by adding
MQ, MX, or MV prefixes respectively to part numbers.
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating
current and temperature range
Wide selection from 3.3 to 200 V
Nonsensitive to ESD
Withstands high surge stresses
Minimal changes of voltage versus current as
specified by voltage regulation
(ΔV
Z
)
High specified maximum current (I
ZM
) when
adequately heat sinking
Moisture classification is Level 1 with no dry
pack required per IPC/JEDEC J-STD-020B
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
TERMINALS: Gull-wing or C-bend (modified J-
bend) tin-lead or RoHS compliant annealed
matte-Tin plating solderable per MIL-STD-750,
method 2026
POLARITY: Cathode indicated by band. Diode
to be operated with the banded end positive
with respect to the opposite end.
MARKING: Part number without SMBx prefix
(e.g. 5333B, 5333Be3, MX5348C, 5376D, etc.)
TAPE & REEL option: Standard per
EIA-481-1-
A
with 12 mm tape, 750 per 7 inch reel or 2500
per 13 inch reel (add “TR” suffix to part number)
WEIGHT: 0.1 grams
See package dimensions on last page
RoHS compliant devices available by adding an “e3” suffix
MAXIMUM RATINGS
Power dissipation at 25
º
C: 5.0 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to
+150
º
C
Thermal Resistance: 25
º
C/W junction to lead, or
90
º
C/W junction to ambient when mounted on FR4
PC board (1oz Cu) with recommended footprint (see
last page)
Steady-State Power: 5 watts at T
L
< 25
o
C, or 1.38
watts at T
A
= 25
º
C when mounted on FR4 PC board
with recommended footprint (also see Figure 1)
Forward voltage @1.0 A: 1.2 volts (maximum)
Solder Temperatures: 260
º
C for 10 s (maximum)
SMBG(J)533–5388B, e3
Copyright
©
2007
6-21-2007 REV E
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
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