Bus Driver, LVT Series, 2-Func, 8-Bit, True Output, BICMOS, RAD PAK, FP-48
参数名称 | 属性值 |
厂商名称 | Maxwell_Technologies_Inc. |
零件包装代码 | DFP |
包装说明 | RAD PAK, FP-48 |
针数 | 48 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.2.C |
系列 | LVT |
JESD-30 代码 | R-XDFP-F48 |
长度 | 15.748 mm |
逻辑集成电路类型 | BUS DRIVER |
位数 | 8 |
功能数量 | 2 |
端口数量 | 2 |
端子数量 | 48 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | UNSPECIFIED |
封装代码 | DFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
传播延迟(tpd) | 6.5 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.4704 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 2.7 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | MILITARY |
端子形式 | FLAT |
端子节距 | 0.635 mm |
端子位置 | DUAL |
总剂量 | 100k Rad(Si) V |
宽度 | 9.652 mm |
Base Number Matches | 1 |
54LVTH162373RPFS | 54LVTH162373RPFI | 54LVTH162373RPFE | 54LVTH162373RPFB | |
---|---|---|---|---|
描述 | Bus Driver, LVT Series, 2-Func, 8-Bit, True Output, BICMOS, RAD PAK, FP-48 | Bus Driver, LVT Series, 2-Func, 8-Bit, True Output, BICMOS, RAD PAK, FP-48 | Bus Driver, LVT Series, 2-Func, 8-Bit, True Output, BICMOS, RAD PAK, FP-48 | Bus Driver, LVT Series, 2-Func, 8-Bit, True Output, BICMOS, RAD PAK, FP-48 |
厂商名称 | Maxwell_Technologies_Inc. | Maxwell_Technologies_Inc. | Maxwell_Technologies_Inc. | Maxwell_Technologies_Inc. |
零件包装代码 | DFP | DFP | DFP | DFP |
包装说明 | RAD PAK, FP-48 | RAD PAK, FP-48 | RAD PAK, FP-48 | RAD PAK, FP-48 |
针数 | 48 | 48 | 48 | 48 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
系列 | LVT | LVT | LVT | LVT |
JESD-30 代码 | R-XDFP-F48 | R-XDFP-F48 | R-XDFP-F48 | R-XDFP-F48 |
长度 | 15.748 mm | 15.748 mm | 15.748 mm | 15.748 mm |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
位数 | 8 | 8 | 8 | 8 |
功能数量 | 2 | 2 | 2 | 2 |
端口数量 | 2 | 2 | 2 | 2 |
端子数量 | 48 | 48 | 48 | 48 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DFP | DFP | DFP | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
传播延迟(tpd) | 6.5 ns | 6.5 ns | 6.5 ns | 6.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.4704 mm | 4.4704 mm | 4.4704 mm | 4.4704 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES |
技术 | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | FLAT | FLAT | FLAT | FLAT |
端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
总剂量 | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V |
宽度 | 9.652 mm | 9.652 mm | 9.652 mm | 9.652 mm |
Base Number Matches | 1 | 1 | 1 | 1 |
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