ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 包装说明 | DIP, |
| Reach Compliance Code | compliant |
| 其他特性 | BROADSIDE VERSION OF 374 |
| 系列 | ACT |
| JESD-30 代码 | R-GDIP-T20 |
| 长度 | 24.51 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 11 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 54ACTQ574DMQB/NOPB | 54ACTQ574DMQB | 54ACTQ574FMQB/NOPB | 54ACTQ574LMQB | 54ACTQ574FMQB | |
|---|---|---|---|---|---|
| 描述 | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20 | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20 | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, LCC-20 | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 |
| 是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 不符合 |
| 包装说明 | DIP, | DIP, DIP20,.3 | DFP, | QCCN, LCC20,.35SQ | DFP, FL20,.3 |
| Reach Compliance Code | compliant | compli | compliant | unknown | compliant |
| 其他特性 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 |
| 系列 | ACT | ACT | ACT | ACT | ACT |
| JESD-30 代码 | R-GDIP-T20 | R-GDIP-T20 | R-GDFP-F20 | S-CQCC-N20 | R-GDFP-F20 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DFP | QCCN | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER | FLATPACK |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | NOT SPECIFIED | 260 |
| 传播延迟（tpd） | 11 ns | 11 ns | 11 ns | 11 ns | 11 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B |
| 座面最大高度 | 5.08 mm | 5.08 mm | 2.286 mm | 1.905 mm | 2.286 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD | FLAT |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 6.731 mm | 8.89 mm | 6.731 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 长度 | 24.51 mm | 24.51 mm | - | 8.89 mm | - |
| 湿度敏感等级 | 1 | 1 | 1 | - | 1 |
| JESD-609代码 | - | e0 | - | e0 | e0 |
| 最大I（ol） | - | 0.024 A | - | 0.024 A | 0.024 A |
| 封装等效代码 | - | DIP20,.3 | - | LCC20,.35SQ | FL20,.3 |
| 包装方法 | - | RAIL | - | RAIL | RAIL |
| 电源 | - | 5 V | - | 5 V | 5 V |
| 端子面层 | - | Tin/Lead (Sn63Pb37) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 触发器类型 | - | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE |
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