Bus Driver, F/FAST Series, 1-Func, 8-Bit, Inverted Output, TTL, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 零件包装代码 | QLCC |
| 包装说明 | CERAMIC, LCC-20 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 系列 | F/FAST |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 8.89 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.02 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 最大电源电流（ICC） | 61 mA |
| Prop。Delay @ Nom-Sup | 12 ns |
| 传播延迟（tpd） | 9 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 1.905 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| 54F533LMQB | 54F533FM | 54F533DM | 54F533DMQB | 54F533FMQB | 54F533LM | |
|---|---|---|---|---|---|---|
| 描述 | Bus Driver, F/FAST Series, 1-Func, 8-Bit, Inverted Output, TTL, CQCC20, CERAMIC, LCC-20 | Bus Driver, F/FAST Series, 1-Func, 8-Bit, Inverted Output, TTL, CDFP20, CERPACK-20 | Bus Driver, F/FAST Series, 1-Func, 8-Bit, Inverted Output, TTL, CDIP20, CERAMIC, DIP-20 | Bus Driver, F/FAST Series, 1-Func, 8-Bit, Inverted Output, TTL, CDIP20, CERAMIC, DIP-20 | Bus Driver, F/FAST Series, 1-Func, 8-Bit, Inverted Output, TTL, CDFP20, CERPACK-20 | Bus Driver, F/FAST Series, 1-Func, 8-Bit, Inverted Output, TTL, CQCC20, CERAMIC, LCC-20 |
| 零件包装代码 | QLCC | DFP | DIP | DIP | DFP | QLCC |
| 包装说明 | CERAMIC, LCC-20 | CERPACK-20 | DIP, DIP20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 | QCCN, |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | S-CQCC-N20 | R-GDFP-F20 | R-GDIP-T20 | R-GDIP-T20 | R-GDFP-F20 | S-CQCC-N20 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | DFP | DIP | DIP | DFP | QCCN |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | FLATPACK | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER |
| 传播延迟（tpd） | 9 ns | 9 ns | 9 ns | 9 ns | 9 ns | 9 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.905 mm | 2.286 mm | 5.08 mm | 5.08 mm | 2.286 mm | 1.905 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD |
| 宽度 | 8.89 mm | 6.731 mm | 7.62 mm | 7.62 mm | 6.731 mm | 8.89 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - |
| 封装等效代码 | LCC20,.35SQ | FL20,.3 | DIP20,.3 | DIP20,.3 | FL20,.3 | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
聊聊、笑笑、闹闹
ADI 工业技术
电源技术
DSP 与 ARM 处理器
嵌入式系统
嵌入式系统
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
