IC voiceband codec 3V 32-qfn
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 包装说明 | QFN-32 |
| Reach Compliance Code | compliant |
| 压伸定律 | MU-LAW |
| 滤波器 | YES |
| 最大增益公差 | 0.2 dB |
| JESD-30 代码 | R-XQCC-N32 |
| 长度 | 6.2 mm |
| 线性编码 | 13-BIT |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | VQCCN |
| 封装等效代码 | LCC32,.2X.24,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大压摆率 | 0.0047 mA |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 电信集成电路类型 | PCM CODEC |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 5.2 mm |
| Base Number Matches | 1 |
| W681360YG | W681360RG TR | W681360SG TR | W681360SG | W681360WG | W681360ES | W681360DK | W681360W | W681360R | W681360S | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC voiceband codec 3V 32-qfn | IC voiceband codec 3V 1ch 20ssop | IC voiceband codec 3V 1ch 20sop | IC voiceband codec 3V 1ch 20sop | IC voicebnd codec 3V 1ch 20tssop | kit eval for w681360 | KIT DEVELOPMENT FOR W681360 | PCM Codec, MU-Law, 1-Func, PDSO20, | PCM Codec, MU-Law, 1-Func, PDSO20, | PCM Codec, MU-Law, 1-Func, PDSO20, |
| 是否Rohs认证 | 符合 | - | - | 符合 | 符合 | - | - | 不符合 | 不符合 | 不符合 |
| 包装说明 | QFN-32 | - | - | SOP-20 | TSSOP-20 | - | - | TSSOP, TSSOP20,.25 | SSOP, SSOP20,.3 | SOP, SOP20,.4 |
| Reach Compliance Code | compliant | - | - | compliant | compliant | - | - | compliant | compliant | compliant |
| 压伸定律 | MU-LAW | - | - | MU-LAW | MU-LAW | - | - | MU-LAW | MU-LAW | MU-LAW |
| 滤波器 | YES | - | - | YES | YES | - | - | YES | YES | YES |
| 最大增益公差 | 0.2 dB | - | - | 0.2 dB | 0.2 dB | - | - | 0.2 dB | 0.2 dB | 0.2 dB |
| JESD-30 代码 | R-XQCC-N32 | - | - | R-PDSO-G20 | R-PDSO-G20 | - | - | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| 线性编码 | 13-BIT | - | - | 13-BIT | 13-BIT | - | - | 13-BIT | 13-BIT | 13-BIT |
| 功能数量 | 1 | - | - | 1 | 1 | - | - | 1 | 1 | 1 |
| 端子数量 | 32 | - | - | 20 | 20 | - | - | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | - | - | 85 °C | 85 °C | - | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VQCCN | - | - | SOP | TSSOP | - | - | TSSOP | SSOP | SOP |
| 封装等效代码 | LCC32,.2X.24,20 | - | - | SOP20,.4 | TSSOP20,.25 | - | - | TSSOP20,.25 | SSOP20,.3 | SOP20,.4 |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | - | - | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE |
| 电源 | 3/5 V | - | - | 3/5 V | 3/5 V | - | - | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 0.0047 mA | - | - | 0.0047 mA | 0.0047 mA | - | - | 4.7 mA | 4.7 mA | 4.7 mA |
| 表面贴装 | YES | - | - | YES | YES | - | - | YES | YES | YES |
| 电信集成电路类型 | PCM CODEC | - | - | PCM CODEC | PCM CODEC | - | - | PCM CODEC | PCM CODEC | PCM CODEC |
| 温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | - | - | GULL WING | GULL WING | - | - | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | - | - | 1.27 mm | 0.65 mm | - | - | 0.635 mm | 0.635 mm | 1.27 mm |
| 端子位置 | QUAD | - | - | DUAL | DUAL | - | - | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | - | - | 1 | 1 | - | - | 1 | 1 | 1 |
ARM技术
ADI参考电路
Microchip MCU
DIY/开源硬件专区
PCB设计
Microchip MCU
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