Digital Media Processor 529-FCBGA -40 to 105
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | BGA |
包装说明 | BGA, BGA529,23X23,32 |
针数 | 529 |
Reach Compliance Code | compliant |
Factory Lead Time | 6 weeks |
地址总线宽度 | 14 |
桶式移位器 | NO |
位大小 | 32 |
边界扫描 | YES |
最大时钟频率 | 800 MHz |
外部数据总线宽度 | 32 |
格式 | FIXED POINT |
集成缓存 | YES |
内部总线架构 | MULTIPLE |
JESD-30 代码 | S-PBGA-B520 |
JESD-609代码 | e1 |
长度 | 19 mm |
低功率模式 | YES |
湿度敏感等级 | 4 |
DMA 通道数量 | 64 |
端子数量 | 520 |
计时器数量 | 8 |
片上数据RAM宽度 | 8 |
片上程序ROM宽度 | 8 |
最高工作温度 | 105 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装等效代码 | BGA529,23X23,32 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
峰值回流温度(摄氏度) | 245 |
电源 | 1.2,1.8,3.3 V |
认证状态 | Not Qualified |
RAM(字数) | 8192 |
ROM可编程性 | MROM |
最大供电电压 | 1.26 V |
最小供电电压 | 1.14 V |
标称供电电压 | 1.2 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 19 mm |
uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
TMS320DM648CUTA8 | TMS320DM648ZUTA6 | TMS320DM647CUT9 | TMS320DM647CUTA8 | TMS320DM647CUTD7 | TMS320DM648CUT9 | TMS320DM648CUTA6 | TMS320DM648CUTD9 | |
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描述 | Digital Media Processor 529-FCBGA -40 to 105 | Digital Signal Processors & Controllers - DSP, DSC Digital Media Proc | Digital Media Processor 529-FCBGA 0 to 90 | Digital Media Processor 529-FCBGA -40 to 105 | Digital Media Processor 529-FCBGA -40 to 90 | Digital Media Processor 529-FCBGA 0 to 90 | Digital Media Processor 529-FCBGA -40 to 105 | Digital Media Processor 529-FCBGA -40 to 90 |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
是否Rohs认证 | 符合 | 符合 | 符合 | 不符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | BGA, BGA529,23X23,32 | HFBGA, BGA529,23X23,32 | BGA, BGA529,23X23,32 | BGA, BGA529,23X23,32 | BGA, BGA529,23X23,32 | BGA, BGA529,23X23,32 | BGA, BGA529,23X23,32 | BGA, BGA529,23X23,32 |
针数 | 529 | 529 | 529 | 529 | 529 | 529 | 529 | 529 |
Reach Compliance Code | compliant | compliant | compliant | unknown | compliant | compliant | compliant | compliant |
地址总线宽度 | 14 | 32 | 14 | 14 | 14 | 14 | 14 | 14 |
桶式移位器 | NO | NO | NO | NO | NO | NO | NO | NO |
位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
边界扫描 | YES | YES | YES | YES | YES | YES | YES | YES |
外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
JESD-30 代码 | S-PBGA-B520 | S-PBGA-B529 | S-PBGA-B520 | S-PBGA-B520 | S-PBGA-B520 | S-PBGA-B520 | S-PBGA-B520 | S-PBGA-B520 |
低功率模式 | YES | YES | YES | YES | YES | YES | YES | YES |
端子数量 | 520 | 529 | 520 | 520 | 520 | 520 | 520 | 520 |
最高工作温度 | 105 °C | 105 °C | 90 °C | 90 °C | 90 °C | 90 °C | 105 °C | 90 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | HFBGA | BGA | BGA | BGA | BGA | BGA | BGA |
封装等效代码 | BGA529,23X23,32 | BGA529,23X23,32 | BGA529,23X23,32 | BGA529,23X23,32 | BGA529,23X23,32 | BGA529,23X23,32 | BGA529,23X23,32 | BGA529,23X23,32 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
电源 | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V | 1.2,1.8,3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字数) | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
最大供电电压 | 1.26 V | 1.26 V | 1.26 V | 1.26 V | 1.26 V | 1.26 V | 1.26 V | 1.26 V |
最小供电电压 | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V | 1.14 V |
标称供电电压 | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | OTHER | OTHER | OTHER | OTHER | INDUSTRIAL | INDUSTRIAL |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
最大时钟频率 | 800 MHz | 66 MHz | 900 MHz | 800 MHz | 720 MHz | 900 MHz | - | 900 MHz |
集成缓存 | YES | - | YES | YES | YES | YES | YES | YES |
JESD-609代码 | e1 | e1 | e1 | - | e1 | e1 | e1 | e1 |
长度 | 19 mm | 19 mm | - | - | - | 19 mm | 19 mm | 19 mm |
湿度敏感等级 | 4 | 4 | 4 | - | 4 | 4 | 4 | 4 |
DMA 通道数量 | 64 | - | 64 | 64 | 64 | 64 | 64 | 64 |
计时器数量 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 |
片上数据RAM宽度 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 |
片上程序ROM宽度 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 |
峰值回流温度(摄氏度) | 245 | 245 | 245 | - | 245 | 245 | 245 | 245 |
ROM可编程性 | MROM | - | MROM | MROM | MROM | MROM | MROM | MROM |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 19 mm | 19 mm | - | - | - | 19 mm | 19 mm | 19 mm |
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