电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

06032200P560DQT

产品描述Ceramic Capacitor, Multilayer, Ceramic, 200V, 89.29% +Tol, 89.29% -Tol, C0G, 30ppm/Cel TC, 0.00000056uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT
产品类别无源元件    电容器   
文件大小197KB,共2页
制造商Knowles
官网地址http://www.knowles.com
标准
下载文档 详细参数 全文预览

06032200P560DQT概述

Ceramic Capacitor, Multilayer, Ceramic, 200V, 89.29% +Tol, 89.29% -Tol, C0G, 30ppm/Cel TC, 0.00000056uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT

06032200P560DQT规格参数

参数名称属性值
是否Rohs认证符合
Objectid1673943858
包装说明, 0603
Reach Compliance Codecompliant
Country Of OriginMainland China
ECCN代码EAR99
YTEOL8.08
电容5.6e-7 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
JESD-609代码e3
制造商序列号0603
安装特点SURFACE MOUNT
多层Yes
负容差89.29%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法TR, 7 INCH
正容差89.29%
额定(直流)电压(URdc)200 V
尺寸代码0603
表面贴装YES
温度特性代码C0G
温度系数30ppm/Cel ppm/°C
端子面层Matte Tin (Sn)
端子形状WRAPAROUND

文档预览

下载PDF文档
MLCCs
for Non-
magnetic
applications
C0G/NP0, High Q and X7R
Copper Barrier MLCCs
Multilayer ceramic capacitors
with silver/palladium (Ag/Pd)
terminations have often been
used in medical applications
where non-magnetic
components are required, for
example in MRI equipment.
The use of conventional nickel
barrier terminations is not
suitable due to nickel exhibiting
magnetic properties.
However, RoHS requirements
have dictated the use of
lead-free solders, and the
composition of these solders
has resulted in an increase in
soldering temperatures. This
has caused solder leaching
problems for the Ag/Pd
termination, and meant
alternative terminations have
had to be found.
Specification
Capacitance Values
C0G/NP0 & High Q
0.1pF - 15nF
X7R
47pF - 6.8µF
See overleaf for full list of values
Mechanical
Termination Material
See ordering information below
Solderability
IEC 60068-2-58. Passed 3 times reflow
profile defined in J-STD-020
Printing
Consult sales office
Lead Free Soldering
Termination codes 2 and 3 ranges are
fully compliant with the RoHS and WEEE
directives and parts are compatible with lead
free solders.
Climatic Category
55/125/56
Reeled Quantities
See Capacitance tables overleaf
Electrical
C0G/NP0
-55°C to
+125°C
High Q
-55°C to
+125°C
X7R
-55°C to
+125°C
Operating Temperature
Temperature Coefficient
(Typical)
0 ± 30
ppm/°C
0 ± 30
ppm/°C
±15%
Insulation Resistance
Time constant (Ri xCr) (whichever is the least)
100GΩ or
1000s
Ageing Rate
None
None
Typical 1% per
time decade
100GΩ or
1000s
100GΩ or
1000s
Ordering Information
1210
Chip
size
0402
0603
0505
0805
1206
1111
1210
1808
1812
2220
2225
3
Termination
2
(for C0G/NP0
& High Q only)
= Sintered
silver base with
copper barrier
(100% matte tin
plating). RoHS
compliant.
100
Voltage
0103
Capacitance in
picofarads (pF)
J
Capacitance
tolerance
X
Dielectric
T
Packaging
___
Suffix
As copper is non-magnetic,
one solution is to use a copper
barrier instead of a nickel
barrier, with a tin finish on top,
and this is the solution Syfer
has developed.
This copper barrier termination
is offered with selected non-
magnetic C0G/NP0, High Q
and X7R dielectrics, providing a
fully non-magnetic component.
To meet high temperature
260ºC soldering reflow profiles
as detailed in J-STD-020, C0G/
NP0 dielectrics are supplied
with sintered termination and
X7R dielectrics are supplied
with Syfer’s award winning
FlexiCap™ termination.
41/09
016 = 16V <10pF Insert a P for
C
= C0G/
T
= 178mm Used for
<4.7pF
the decimal point, H = ±0.05pF NP0 (1B)
025 = 25V
(7”) reel
specific
050 = 50V
eg P300 = 0.3pF,
customer
B = ±0.1pF
X
= X7R
R
= 330mm
8P20 = 8.2pF.
063 = 63V
C = ±0.25pF
(2R1)
(13”) reel requirements
100 = 100V
D = ±0.5pF
10pF 1st digit
Q
= High Q
B
= Bulk
150 = 150V
is 0. 2nd and
4.7pF &
pack - tubs
200 = 200V
3rd digits are
<10pF
250 = 250V significant figures
B = ±0.1pF
3
= FlexiCap™ 500 = 500V
of capacitance
C = ±0.25pF
630 = 630V code. The 4th digit D = ±0.5pF
base with
1K0 = 1000V is number of 0’s
copper barrier
10pF
(100% matte 1K2 = 1200V
following
F = ±1%
1K5 = 1500V
tin plating).
eg. 0103 =
G = ±2%
RoHS compliant. 2K0 = 2000V
10000pF
J = ±5%
3K0 = 3000V
K = ±10%
Values <1pF in
0.1pF steps, above
this values are E24
series
使用avr单片机io模拟usb接口
这是老外做的 http://www.recursion.jp/avrcdc/ 过段时间 我会推出这个电路板和学习资料的 欢迎大家学习交流...
njlianjian Microchip MCU
Arduino机器人权威指南
《Arduino机器人权威指南》可以教会你如何用Arduino来控制各式各样的机器人,同时提供了每一步的详细指导。你不仅可以学会Arduino的基本使用方法,还可以了解各种电机的特性。同样,你会掌握其 ......
arui1999 机器人开发
SAM4N Xplained Pro 开发板资源
本帖最后由 dcexpert 于 2015-5-8 23:03 编辑 SAM4N Xplained Pro网站 http://www.atmel.com/images/icon_pdf.gif 用户指南 http://www.atmel.com/images/icon_zip.gif 硬件文档 ......
dcexpert Microchip MCU
有没有人知道哪里有FPGA开发板可以申请
要用FPGA,貌似买的话比较贵,哎,作为学生一族。。。只有看看能不能申请到一块板子。。。。...
xiaominthere FPGA/CPLD
TPA3128D2EVM 评测(一):来自TI的D类音频放大器评估板开箱
本帖最后由 x1816 于 2017-9-16 21:54 编辑 说起音频功放,TDA2030这块经典的芯片想必能勾起各位音频老司机的回忆。2030问世已经超过20年(没找到具体时间,上世纪九十年代这个芯片已 ......
x1816 模拟与混合信号
Arrow&TI直播回顾: TI FPD-Link III 汽车芯片组,汽车视频传输理想解决方案
【9月22日直播回顾和相关资源整理】 直播主题:TI FPD-Link III 汽车芯片组,汽车视频传输理想解决方案 直播回放:点击观看 直播间问答列表: 序号 ......
EEWORLD社区 汽车电子

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1952  1226  871  2665  1869  40  25  18  54  38 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved