ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20
| 参数名称 | 属性值 |
| 包装说明 | DFP, |
| Reach Compliance Code | unknow |
| 系列 | ACT |
| JESD-30 代码 | R-GDFP-F20 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟（tpd） | 12.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.286 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 6.731 mm |
| Base Number Matches | 1 |
| 54ACT373FM | 54ACT373LM | 54AC373DM | 54ACT373DM | 54AC373FM | |
|---|---|---|---|---|---|
| 描述 | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 | AC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 |
| 包装说明 | DFP, | QCCN, | DIP, | DIP, | DFP, |
| Reach Compliance Code | unknow | unknow | unknown | unknown | unknown |
| 系列 | ACT | ACT | AC | ACT | AC |
| JESD-30 代码 | R-GDFP-F20 | S-CQCC-N20 | R-GDIP-T20 | R-GDIP-T20 | R-GDFP-F20 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | QCCN | DIP | DIP | DFP |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | CHIP CARRIER | IN-LINE | IN-LINE | FLATPACK |
| 传播延迟（tpd） | 12.5 ns | 12.5 ns | 16.5 ns | 12.5 ns | 16.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.286 mm | 1.905 mm | 5.08 mm | 5.08 mm | 2.286 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 6 V | 5.5 V | 6 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 2 V | 4.5 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 3.3 V | 5 V | 3.3 V |
| 表面贴装 | YES | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL |
| 宽度 | 6.731 mm | 8.89 mm | 7.62 mm | 7.62 mm | 6.731 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 长度 | - | 8.89 mm | 24.51 mm | 24.51 mm | - |
创意市集
无线连接
嵌入式系统
嵌入式系统
Microchip MCU
stm32/stm8
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
