Datasheet> 器件分类 > 无源元件> 电容器> NSWC332J400TRD1

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NSWC332J400TRD1: 产品描述CAPACITOR, METALLIZED FILM, POLYETHYLENE NAPHTHALATE, 400V, 0.0033uF, SURFACE MOUNT, 1913, CHIP; 产品类别无源元件电容器; 文件大小294KB，共4页; 制造商Nichicon(尼吉康); 官网地址http://www.nichicon.co.jp

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NSWC332J400TRD1概述

CAPACITOR, METALLIZED FILM, POLYETHYLENE NAPHTHALATE, 400V, 0.0033uF, SURFACE MOUNT, 1913, CHIP

NSWC332J400TRD1规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Nichicon(尼吉康)
包装说明	CHIP
Reach Compliance Code	compliant
ECCN代码	EAR99
电容	0.0033 µF
电容器类型	FILM CAPACITOR
介电材料	POLYETHYLENE NAPHTHALATE
高度	1.4 mm
JESD-609代码	e0
长度	4.8 mm
制造商序列号	NSWC
安装特点	SURFACE MOUNT
负容差	5%
端子数量	2
最高工作温度	85 °C
最低工作温度	-55 °C
封装形状	RECTANGULAR PACKAGE
封装形式	SMT
包装方法	TR, EMBOSSED PLASTIC, 13 INCH
正容差	5%
额定（直流）电压（URdc）	400 V
系列	NSWC(400V)
尺寸代码	1913
表面贴装	YES
温度系数	3% ppm/°C
端子面层	Tin/Lead (Sn/Pb)
端子形状	WRAPAROUND
宽度	3.3 mm
Base Number Matches	1

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Stacked Film Capacitor Chips

FEATURES

• STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM

• STANDARD EIA 1206, 1210, 1913, 2416, 2820, 3022 AND 3925 SIZES

• WIDE TEMPERATURE RANGE UP TO +105

C (16Vdc & 50Vdc)

• HIGH HEAT AND MOISTURE RESISTANT

• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND

nDIELECTRIC

ABSORPTION CHARACTERISTICS

NSWC IS

• SUITABLE FOR REFLOWSOLDERING

RECOMMENDED

• TAPE AND REEL PACKAGING

NSWC Series

NEW

FOR NEW DESIGNS

½½½½ ½½½½½

½½½½½½½½½½½½½½

½½

½½½½½½½½½ ½½½½½

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½½ ½½½½½

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½½½½½½½½½½ ½½½½½½½½½½½½ ½½½½½½½

½½½½½½½½½½½ ½½½½½½½½½½½½½½

½½½½½½½½½½ ½½½½½½½½½½

½½½½

½½½½½ ½ ½½½½½½

µ½

½½½½½½ ½ ½½½½

µ½

½½½½½ ½ ½½½½

µ½

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µ½

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µ½

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µ½

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µ½

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½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½

½½½½ ½ ½ ½½½½½ ½ ½½½½½½ ½½½ ½½½½½½½ ½½½½ ½ ½ ½½½½ ½ ½½½½½½½½

½½½½ ½½½ ½ ½ ½½½

½ ½½½½½½½ ½½ ½½½½

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½½½

½ ½½½½½½½ ½½½½ ½½½½½½½½½½½ ½½½½½

½½½½ ½ ½½½½½ ½½½½½½½

ENVIRONMENTAL CHARACTERISTICS

Life Test At +105°C

1000 Hours at 125% of Rated Voltage

(85°C for 100Vdc)

Resistance to Soldering Heat:

+240°C Peak for 5 Seconds

(+230°C for 100Vdc)

Humidity Load Life (90 ~ 95% RH)

(1) 1000 Hours, +40°C

(500 Hours for 100Vdc)

(2) 500 Hours, +60°C

Solderability with

10% Wt Rosin-Methanol Flux

Capacitance Change

Dissipation Factor

Insulation Resistance

Capacitance Change

Dissipation Factor

Insulation Resistance

Capacitance Change

Dissipation Factor

Insulation Resistance

Within ±1% /-6% of Initial Value

1.1% Maximum

1 Gig

Ω

Minimum or 300

Ω

/F whichever is lower

Within ±3% of Initial Value

1.1% Maximum

1 Gig

Ω

Minimum or 300

Ω

/F whichever is lower

(1) +8%/-5%, (2 )±10%

(1) ±1.5%, (2 ) ±2%

(1) 100 Meg

Ω

or 30

Ω

/F (2) 10Meg

Ω

or 3

Ω

whicher is lower

90% Minimum Coverage After 5 Second Dip into 235°C Solder Pot

RECOMMENDED SOLDERING PROFILES

REFLOW SOLDERING

300

Soldering

230°C Max.

(220°C for 100Vdc Parts)

Pre-Heat

150°C Max.

Cool

Down

RECOMMENDED LAND PATTERN (mm)

½½½ ½½½½

½½½½

½½½

½½½½

½½½

250

200

°C 150

100

5 Seconds Max.

2 1/2 Minutes Max.

Less than

15 Seconds

2 Minutes Min.

NIC COMPONENTS

www.niccomp.com

www.lowESR.com

www.RFpassives.com

175

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