IC IC,D/A CONVERTER,SINGLE,12-BIT,CMOS,DIP,18PIN, Digital to Analog Converter
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | DIP |
| 针数 | 18 |
| Reach Compliance Code | not_compliant |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY |
| JESD-30 代码 | R-XDIP-T18 |
| 最大线性误差 (EL) | 0.012% |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP18,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 15 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 最大压摆率 | 2 mA |
| 标称供电电压 | 15 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 5962-01-309-9723 | 5962-01-221-3455 | 5962-01-354-0515 | AD7541ASD/883B | AD7541ATD/883B | |
|---|---|---|---|---|---|
| 描述 | IC IC,D/A CONVERTER,SINGLE,12-BIT,CMOS,DIP,18PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,SINGLE,12-BIT,CMOS,DIP,18PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,SINGLE,12-BIT,CMOS,DIP,18PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,SINGLE,12-BIT,CMOS,DIP,18PIN, Digital to Analog Converter | IC IC,D/A CONVERTER,SINGLE,12-BIT,CMOS,DIP,18PIN, Digital to Analog Converter |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | not_compliant | not_compliant | unknown | not_compliant | not_compliant |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY |
| JESD-30 代码 | R-XDIP-T18 | R-XDIP-T18 | R-PDIP-T18 | R-XDIP-T18 | R-CDIP-T18 |
| 最大线性误差 (EL) | 0.012% | 0.024% | 0.024% | 0.024% | 0.0122% |
| 位数 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 18 | 18 | 18 | 18 |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | - | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 15 V | 15 V | 15 V | 15 V | 15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA |
| 标称供电电压 | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | DIP | DIP | DIP | - | - |
| 针数 | 18 | 18 | 18 | - | - |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B | MIL-STD-883 Class B |
| 是否无铅 | - | - | 含铅 | 含铅 | 含铅 |
| 峰值回流温度(摄氏度) | - | - | 225 | NOT SPECIFIED | NOT SPECIFIED |
| 处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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