电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HLE-125-02-G-DV-LC-P-TR

产品描述Board Connector, 50 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket,
产品类别连接器    连接器   
文件大小200KB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
下载文档 详细参数 全文预览

HLE-125-02-G-DV-LC-P-TR在线购买

供应商 器件名称 价格 最低购买 库存  
HLE-125-02-G-DV-LC-P-TR - - 点击查看 点击购买

HLE-125-02-G-DV-LC-P-TR概述

Board Connector, 50 Contact(s), 2 Row(s), Female, Straight, Surface Mount Terminal, Socket,

HLE-125-02-G-DV-LC-P-TR规格参数

参数名称属性值
是否Rohs认证符合
厂商名称SAMTEC
Reach Compliance Codecompliant
Factory Lead Time2 weeks
其他特性TIGER BEAM CONTACT
主体/外壳类型SOCKET
连接器类型BOARD CONNECTOR
联系完成配合GOLD (20)
联系完成终止Gold (Au) - with Nickel (Ni) barrier
触点性别FEMALE
触点材料BERYLLIUM COPPER
DIN 符合性NO
滤波功能NO
IEC 符合性NO
JESD-609代码e4
MIL 符合性NO
混合触点NO
安装方式STRAIGHT
安装类型BOARD
装载的行数2
选件GENERAL PURPOSE
端子节距2.54 mm
端接类型SURFACE MOUNT
触点总数50
Base Number Matches1

文档预览

下载PDF文档
REVISION AG
HLE-1XX-02-XXX-DV-XX-XX-XX
OPTION
DO NOT
SCALE FROM
THIS PRINT
FIG 5
-BE OPTION
(SAME AS FIG 1 UNLESS OTHERWISE STATED)
C1
No OF POSITIONS
-02 THRU -50
(PER ROW)
RHLE-50-DBE
LEAD STYLE
-02: SURFACE MOUNT
(USE C-132-12-X)
PLATING SPECIFICATION
-G: 20µ" GOLD IN CONTACT AREA
3µ" ON TAIL (USE C-132-12-G)
-S: 30µ" SELECTIVE GOLD IN CONTACT
AREA MATTE TIN ON TAIL
(USE C-132-12-S)
-F: 3µ" SELECTIVE FLASH GOLD IN CONTACT
AREA MATTE TIN ON TAIL
(USE C-132-12-F)
-L: 10µ" SELECTIVE LIGHT GOLD IN
CONTACT AREA MATTE TIN ON TAIL
(USE C-132-12-L)
.200 5.08
-H: 30µ" HEAVY GOLD IN CONTACT AREA
REF
3µ" ON TAIL (USE C-132-12-H)
-STL: 30µ" SELECTIVE GOLD IN CONTACT
AREA TIN/LEAD (90%/10 +/-5%)
(USE C-132-12-STL)
-SM: 30µ" SELECTIVE GOLD IN CONTACT
AREA MATTE TIN ON TAIL
(USE C-132-12-S)
-FM: 3µ" SELECTIVE FLASH GOLD IN CONTACT
AREA MATTE TIN ON TAIL (USE C-132-12-F)
-LM: 10µ" LIGHT GOLD IN CONTACT AREA
MATTE TIN ON TAIL (USE C-132-12-L)
C3
No OF POS x .100 [2.54]
+.008 [.20]
-.005 [.13]
-TR: TAPE & REEL
(2 - 29 POSITIONS ONLY)
OPTION
-P: PICK & PLACE PAD
(POS -03 THRU -50 ONLY)
-A: ALIGNMENT PIN (4 POS MIN)
-LC: LOCKING CLIP (2 POS MIN)
(SEE NOTE 9)
-K: POLYAMIDE FILM PAD (AVAILABLE
ON POS -03 THRU -50; .005 [.13]
THICKNESS WITH SILICONE ADHESIVE)
(SEE FIG 4)
.100 2.54
REF
({No of POS - 1} x .100 [2.54])
.005 [.13]
02
OPTION
-BE: BOTTOM ENTRY
(USE RHLE-50-DBE)(SEE FIG. 5)
(LEAVE BLANK FOR STANDARD)
01
ROW SPECIFICATION
-DV: DOUBLE VERTICAL
(USE RHLE-50-D)
2 MAX SWAY
(EITHER DIRECTION)
C-132-12-XXX
.020 0.51 REF
5713755 / 5961339
PATENT NUMBERS
RHLE-50-D
"A"
.259 6.57
90°±3°
C8
SEE TABLE 2
C7
"A"
.146 3.71
.144 3.66
FIG 1
HLE-116-02-XXX-DV SHOWN
SECTION "A"-"A"
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. ALL IDENTIFICATION MARKS MUST NOT STAND GREATER THAN .002 [.05]
OFF THE SURFACE OF THE PART.
3. PULL OUT FORCE FOR -LC, -A, & CONTACT IS 12 oz MIN.
4. COPLANARITY: SEE TABLE 2.
5. BURR ALLOWANCE: .003 [.08] MAX
6. CUT ASSEMBLIES AFTER FILL. CUT FLASH TO BE .010 MAX WITH NO FLASH
ALLOWED IN HOLES OR EXTENDING BELOW LEADS. WILL LOSE A POSITION
FOR EVERY CUT MADE ON A SOCKET STRIP.
7. TUBE POSITIONS 03 THRU 50. LAYER PACKAGE POSITION 02.
8. ENDWALL THICKNESS: .030+/-.005[.76+/-.13] TO BE MEASURED FROM BOTTOM VIEW.
9. DUE TO THE HIGH AMOUNT OF INSERTION FORCE NEEDED, THE –LC OPTION IS NOT
COMPATIBLE WITH AUTO PLACEMENT. SAMTEC RECOMMENDS MANUAL PLACEMENT
FOR ALL ASSEMBLIES WITH THE –LC OPTION.
-A & -LC OPTION
C4
FIG 2
(No OF POS -2) x.1000 [2.540]
C5
.050 1.27
.050 1.27
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.XX: .01 [.3]
.XXX: .005 [.13]
.XXXX: .0020 [.051]
ANGLES
3
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail: info@SAMTEC.com
code: 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
SM-A10H
.008 x .056 REF
[.20 x 1.42]
LC-08-TM-01
.0625 1.588
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
BODY: VECTRA E130i
CONTACT: BeCu
F:\DWG\MISC\MKTG\HLE-1XX-02-XXX-DV-XX-XX-XX-MKT.SLDDRW
[2.54] .100 TIGER BEAM SOCKET ASSEMBLY
HLE-1XX-02-XXX-DV-XX-XX-XX
ED MESSER 12/19/98
SHEET
1
OF
2
BY:
DLP ---- 将来会替代现行显示器件吗?
TI的DLP的优势真的太大了,一直想玩玩它,但其价格太高而搁置。然而随着应用的广泛,价格肯定会有大幅度下降。 大伙发表一下意见,谈你对DLP的看法- ...
dontium 模拟与混合信号
关于MSP430的时钟问题
单片机上电后,如果不对时钟系统进行设置,默认800 kHz的DCOCLK为MCLK和SMCLK的时钟源,LFXTl接32768 Hz晶体,工作在低频模式(XTS=O)作为ACLK的时钟源。CPU的指令周期由MCLK决定,所以默认的指 ......
yyxiaoyan 微控制器 MCU
全新STM32Cube功能包优化低功耗智能应用开发 FP-SNS-ALLMEMS2
STM32Cube最新的软件功能包FPS-SNS-ALLMEMS2,可将IoT节点通过BLE连接到智能手机,并使用相应的安卓或iOS应用程序,如BLUEMS,查看实时环境和运动传感器数据、数字麦克风和电池电量。 其功能类 ......
nmg ST传感器与低功耗无线技术论坛
嵌入式学习的点点滴滴(我的学习笔记-《鸟哥的linux私房菜》1)
(一)看完计算机概论,发现以前对计算机的了解只是皮毛 CPU种类的区别:精简指令集:每个指令的执行时间短,执行性能佳,但要做复杂的事情需由多个指令完成:复杂指令集:执行花费时间长,但 ......
lyyiqo Linux开发
ws2812b灯带的抗干扰问题
大概是由于中间有较长得连线,只有第一段灯带亮,我想中间用一对max485做转换,能达到抗干扰的效果吗?...
sgz10010010 嵌入式系统
晒货+记录我的开发之路
此内容由EEWORLD论坛网友范兴龙原创,如需转载或用于商业用途需征得作者同意并注明出处 从三年前点亮第一个发光二极管,开始了电子求学之路。 从51到NXP的ARM,再到以后ALTERA的FPGA ......
范兴龙 测评中心专版

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2168  661  2027  2544  496  12  24  29  39  31 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved