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HIP2101IBT

产品描述IC driver half-bridge 8-soic
产品类别半导体    电源管理   
文件大小315KB,共12页
制造商Intersil ( Renesas )
官网地址http://www.intersil.com/cda/home/
下载文档 详细参数 选型对比 全文预览

HIP2101IBT概述

IC driver half-bridge 8-soic

HIP2101IBT规格参数

参数名称属性值
Datasheets
HIP2101
Product Photos
8-SOIC,M8
Standard Package2,500
CategoryIntegrated Circuits (ICs)
FamilyPMIC - MOSFET, Bridge Drivers - External Switch
系列
Packaging
Tape & Reel (TR)
ConfiguratiHalf Bridge
Input TypePWM
Delay Time25ns
Current - Peak2A
Number of Configurations1
Number of Outputs2
High Side Voltage - Max (Bootstrap)100V
Voltage - Supply9 V ~ 14 V
Operating Temperature-40°C ~ 125°C
Mounting TypeSurface Mou
封装 / 箱体
Package / Case
8-SOIC (0.154", 3.90mm Width)
Supplier Device Package8-SOIC

文档预览

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®
HIP2101
Data Sheet
October 21, 2004
FN9025.8
100V/2A Peak, Low Cost, High Frequency
Half Bridge Driver
The HIP2101 is a high frequency, 100V Half Bridge
N-Channel power MOSFET driver IC. It is equivalent to the
HIP2100 with the added advantage of full TTL/CMOS
compatible logic input pins. The low-side and high-side gate
drivers are independently controlled and matched to 13ns.
This gives users total control over dead-time for specific
power circuit topologies. Undervoltage protection on both
the low-side and high-side supplies force the outputs low. An
on-chip diode eliminates the discrete diode required with
other driver ICs. A new level-shifter topology yields the low-
power benefits of pulsed operation with the safety of DC
operation. Unlike some competitors, the high-side output
returns to its correct state after a momentary undervoltage of
the high-side supply.
Features
• Drives N-Channel MOSFET Half Bridge
• SOIC, EPSOIC, QFN and DFN Package Options
• SOIC, EPSOIC and DFN Packages Compliant with 100V
Conductor Spacing Guidelines of IPC-2221
• Pb-free Product Available
(RoHS Compliant)
• Bootstrap Supply Max Voltage to 114VDC
• On-Chip 1Ω Bootstrap Diode
• Fast Propagation Times for Multi-MHz Circuits
• Drives 1000pF Load with Rise and Fall Times Typ. 10ns
• TTL/CMOS Input Thresholds Increase Flexibility
• Independent Inputs for Non-Half Bridge Topologies
• No Start-Up Problems
Ordering Information
PART NUMBER
HIP2101IB
HIP2101IBZ (Note 1)
HIP2101EIB
HIP2101EIBZ
(Note 1)
HIP2101IR
HIP2101IRZ (Note 1)
HIP2101IR4
HIP2101IR4Z
(Note 1)
NOTES:
1.
Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin
plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020C.
2. Add “T” suffix for Tape and Reel packing option.
TEMP.
RANGE (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
PACKAGE
8 Ld SOIC
PKG.
DWG. #
M8.15
• Outputs Unaffected by Supply Glitches, HS Ringing Below
Ground, or HS Slewing at High dv/dt
• Low Power Consumption
• Wide Supply Range
• Supply Undervoltage Protection
• 3Ω Output Driver Resistance
• QFN/DFN Package:
- Compliant to JEDEC PUB95 MO-220
QFN - Quad Flat No Leads - Package Outline
- Near Chip Scale Package footprint, which improves
PCB efficiency and has a thinner profile
8 Ld SOIC (Pb-free) M8.15
8 Ld EPSOIC
8 Ld EPSOIC
(Pb-free)
16 Ld 5x5 QFN
16 Ld 5x5 QFN
(Pb-free)
12 Ld 4x4 DFN
12 Ld 4x4 DFN
(Pb-free)
M8.15C
M8.15C
L16.5x5
L16.5x5
L12.4x4A
L12.4x4A
Applications
• Telecom Half Bridge Power Supplies
• Avionics DC-DC Converters
• Two-Switch Forward Converters
• Active Clamp Forward Converters
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
|
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2004. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.

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