Multimedia Misc Dig Aud PWM Proc
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QFP |
| 包装说明 | TFQFP, |
| 针数 | 64 |
| Reach Compliance Code | unknow |
| 商用集成电路类型 | CONSUMER CIRCUIT |
| JESD-30 代码 | S-PQFP-G64 |
| JESD-609代码 | e4 |
| 长度 | 10 mm |
| 湿度敏感等级 | 4 |
| 功能数量 | 1 |
| 端子数量 | 64 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TFQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 10 mm |
| TAS5026IPAGG4 | TAS5026PAGR | TAS5026PAGRG4 | TAS5026APAGG4 | TAS5026PAGG4 | TAS5026IPAGR | TAS5026IPAG | TAS5026IPAGRG4 | TAS5026APAG | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Multimedia Misc Dig Aud PWM Proc | Multimedia Misc Dig Aud PWM Proc | Multimedia Misc Dig Aud PWM Proc | Audio DSPs 6Ch Dig Aud PWM Proc | Multimedia Misc Dig Aud PWM Proc | Multimedia Misc Dig Aud PWM Proc | Multimedia Misc Dig Aud PWM Proc | Multimedia Misc Dig Aud PWM Proc | Audio DSPs 6Ch Dig Aud PWM Proc |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | TFQFP, | TFQFP, | TFQFP, | TFQFP, TQFP64,.47SQ | TFQFP, | TFQFP, TQFP64,.47SQ | TFQFP, TQFP64,.47SQ | TFQFP, | TFQFP, TQFP64,.47SQ |
| 针数 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| Reach Compliance Code | unknow | compli | compli | unknown | compliant | compliant | unknown | compliant | unknown |
| 商用集成电路类型 | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
| JESD-30 代码 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 |
| 长度 | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFQFP | TFQFP | TFQFP | TFQFP | TFQFP | TFQFP | TFQFP | TFQFP | TFQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm |
| JESD-609代码 | e4 | e4 | e4 | - | e4 | - | e4 | e4 | - |
| 湿度敏感等级 | 4 | 4 | 4 | - | 4 | - | 4 | 4 | - |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - |
| 是否无铅 | - | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | - | 不含铅 | - |
模拟电子
嵌入式系统
嵌入式系统
FPGA/CPLD
模拟与混合信号
嵌入式系统
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
