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C1210C180J2GACTM: 产品描述CAPACITOR, CERAMIC, MULTILAYER, 200V, C0G, 0.000018uF, SURFACE MOUNT, 1210, CHIP, ROHS COMPLIANT; 产品类别无源元件电容器; 文件大小1MB，共9页; 制造商KEMET(基美); 官网地址http://www.kemet.com; 标准

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C1210C180J2GACTM概述

CAPACITOR, CERAMIC, MULTILAYER, 200V, C0G, 0.000018uF, SURFACE MOUNT, 1210, CHIP, ROHS COMPLIANT

C1210C180J2GACTM规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
Objectid	1597849962
包装说明	, 1210
Reach Compliance Code	compliant
ECCN代码	EAR99
电容	0.000018 µF
电容器类型	CERAMIC CAPACITOR
介电材料	CERAMIC
高度	0.78 mm
JESD-609代码	e3
长度	3.2 mm
安装特点	SURFACE MOUNT
多层	Yes
负容差	5%
端子数量	2
最高工作温度	125 °C
最低工作温度	-55 °C
封装形状	RECTANGULAR PACKAGE
封装形式	SMT
包装方法	TR, EMBOSSED PLASTIC, 7 INCH
正容差	5%
额定（直流）电压（URdc）	200 V
尺寸代码	1210
表面贴装	YES
温度特性代码	C0G
温度系数	30ppm/Cel ppm/°C
端子面层	Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状	WRAPAROUND
宽度	2.5 mm

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CERAMIC CHIP CAPACITORS

FEATURES

• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics

• 10, 16, 25, 50, 100 and 200 Volts

• Standard End Metalization: Tin-plate over nickel

barrier

• Available Capacitance Tolerances: ±0.10 pF; ±0.25

pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and

+80%-20%

• Tape and reel packaging per EIA481-1. (See page

92 for specific tape and reel information.) Bulk

Cassette packaging (0402, 0603, 0805 only) per

IEC60286-6 and EIAJ 7201.

• RoHS Compliant

CAPACITOR OUTLINE DRAWINGS

ELECTRODES

TIN PLATE

NICKEL PLATE

CONDUCTIVE

METALLIZATION

DIMENSIONS—MILLIMETERS AND (INCHES)

EIA SIZE

CODE

0201*

0402*

0603

0805*

1206*

1210*

1808

1812

1825*

2220

2225

METRIC

SIZE CODE

0603

1005

1608

2012

3216

3225

4520

4532

4564

5650

5664

L - LENGTH

0.6 (.024) ± .03 (.001)

1.0 (.04) ± .05 (.002)

1.6 (.063) ± .15 (.006)

2.0 (.079) ± .20 (.008)

3.2 (.126) ± .20 (.008)

4.5 (.177) ± .30 (.012)

5.6 (.220) ± .40 (.016)

W - WIDTH

0.3 ± (.012) ± .03 (.001)

0.5 (.02) ± .05 (.002)

0.8 (.032) ± .15 (.006)

1.25 (.049) ± .20 (.008)

1.6 (.063) ± .20 (.008)

2.5 (.098) ± .20 (.008)

2.0 (.079) ± .20 (.008)

3.2 (.126) ± .30 (.012)

6.4 (.252) ± .40 (.016)

5.0 (.197) ± .40 (.016)

6.3 (.248) ± .40 (.016)

See page 78

for thickness

dimensions.

THICKNESS

B - BANDWIDTH

0.15 (.006) ± .05 (.002)

0.20 (.008) -.40 (.016)

0.35 (.014) ± .15 (.006)

0.50 (.02) ± .25 (.010)

0.60 (.024) ± .35 (.014)

SEPARATION

minimum

N/A

0.3 (.012)

0.7 (.028)

0.75 (.030)

N/A

Solder Reflow

Solder Wave +

Solder Reflow

MOUNTING

TECHNIQUE

Solder Reflow

* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)

+ For extended value 1210 case size - solder reflow only.

CAPACITOR ORDERING INFORMATION

(Standard Chips - For

C 0805 C 103 K 5 R A C*

CERAMIC

SIZE CODE

SPECIFICATION

C - Standard

CAPACITANCE CODE

Expressed in Picofarads (pF)

First two digits represent significant figures.

Third digit specifies number of zeros. (Use 9

for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)

(Example: 2.2pF = 229 or 0.50 pF = 508)

CAPACITANCE TOLERANCE

B – ±0.10pF J – ±5%

C – ±0.25pF K – ±10%

D – ±0.5pF

M – ±20%

F – ±1%

P – (GMV) – special order only

G – ±2%

Z – +80%, -20%

Military see page

87)

END METALLIZATION

C-Standard (Tin-plated nickel barrier)

FAILURE RATE LEVEL

A- Not Applicable

TEMPERATURE CHARACTERISTIC

Designated by Capacitance

Change Over Temperature Range

G – C0G (NP0) (±30 PPM/°C)

R – X7R (±15%) (-55°C + 125°C)

P– X5R (±15%) (-55°C + 85°C)

U – Z5U (+22%, -56%) (+10°C + 85°C)

V – Y5V (+22%, -82%) (-30°C + 85°C)

VOLTAGE

- 100V

- 100V 3 - 25V

25V

2 - 200V 4 - 16V

- 50V 8 - 10V

16V

- 200V

- 35V 9 - 6.3V

10V

- 50V

* Part Number Example: C0805C103K5RAC (14 digits - no spaces)

7 - 4V

- 6.3V

7 - 4V

Ceramic Surface Mount

C1210C180J2GACTM

C1210C180J2GACTM概述

C1210C180J2GACTM规格参数

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