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883/4402BF: 产品描述OR/NOR Gate, CMOS, CDFP16; 产品类别逻辑逻辑; 文件大小113KB，共2页; 制造商Solid State Scientific Inc

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883/4402BF概述

OR/NOR Gate, CMOS, CDFP16

883/4402BF规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Solid State Scientific Inc
包装说明	DFP, FL16,.3
Reach Compliance Code	unknown
JESD-30 代码	R-XDFP-F16
JESD-609代码	e0
逻辑集成电路类型	OR/NOR GATE
端子数量	16
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	CERAMIC
封装代码	DFP
封装等效代码	FL16,.3
封装形状	RECTANGULAR
封装形式	FLATPACK
认证状态	Not Qualified
施密特触发器	NO
筛选级别	38535Q/M;38534H;883B
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子面层	Tin/Lead (Sn/Pb)
端子形式	FLAT
端子节距	1.27 mm
端子位置	DUAL
Base Number Matches	1

883/4402BF相似产品对比

	883/4402BF	883/4402BD	SCL4412BC	SCL4412BC++	SCL4402BE	SCL4402BE+	SCL4402BE++	SCL4412BE	SCL4412BE++	SCL4412BE+
描述	OR/NOR Gate, CMOS, CDFP16	OR/NOR Gate, CMOS, CDIP16	AND/NAND Gate, CMOS, CDIP16	AND/NAND Gate, CMOS, CDIP16	OR/NOR Gate, CMOS, PDIP16	OR/NOR Gate, CMOS, PDIP16	OR/NOR Gate, CMOS, PDIP16	AND/NAND Gate, CMOS, PDIP16	AND/NAND Gate, CMOS, PDIP16	AND/NAND Gate, CMOS, PDIP16
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
包装说明	DFP, FL16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 代码	R-XDFP-F16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16	R-PDIP-T16
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
逻辑集成电路类型	OR/NOR GATE	OR/NOR GATE	AND/NAND GATE	AND/NAND GATE	OR/NOR GATE	OR/NOR GATE	OR/NOR GATE	AND/NAND GATE	AND/NAND GATE	AND/NAND GATE
端子数量	16	16	16	16	16	16	16	16	16	16
最高工作温度	125 °C	125 °C	125 °C	125 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
封装主体材料	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DFP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
封装等效代码	FL16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	FLATPACK	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
施密特触发器	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
表面贴装	YES	NO	NO	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子节距	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
厂商名称	Solid State Scientific Inc	Solid State Scientific Inc	-	-	Solid State Scientific Inc	Solid State Scientific Inc	Solid State Scientific Inc	Solid State Scientific Inc	Solid State Scientific Inc	Solid State Scientific Inc

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