AND/NAND Gate, CMOS, PDIP16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Solid State Scientific Inc |
Objectid | 100771088 |
包装说明 | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
compound_id | 178538168 |
JESD-30 代码 | R-PDIP-T16 |
JESD-609代码 | e0 |
逻辑集成电路类型 | AND/NAND GATE |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
施密特触发器 | NO |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
SCL4412BE+ | 883/4402BD | 883/4402BF | SCL4412BC | SCL4412BC++ | SCL4402BE | SCL4402BE+ | SCL4402BE++ | SCL4412BE | SCL4412BE++ | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | AND/NAND Gate, CMOS, PDIP16 | OR/NOR Gate, CMOS, CDIP16 | OR/NOR Gate, CMOS, CDFP16 | AND/NAND Gate, CMOS, CDIP16 | AND/NAND Gate, CMOS, CDIP16 | OR/NOR Gate, CMOS, PDIP16 | OR/NOR Gate, CMOS, PDIP16 | OR/NOR Gate, CMOS, PDIP16 | AND/NAND Gate, CMOS, PDIP16 | AND/NAND Gate, CMOS, PDIP16 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDIP-T16 | R-XDIP-T16 | R-XDFP-F16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | AND/NAND GATE | OR/NOR GATE | OR/NOR GATE | AND/NAND GATE | AND/NAND GATE | OR/NOR GATE | OR/NOR GATE | OR/NOR GATE | AND/NAND GATE | AND/NAND GATE |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DFP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP16,.3 | DIP16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
施密特触发器 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
表面贴装 | NO | NO | YES | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc | - | - | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc |
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