2180324-2: 产品描述(2180324-2) zSFP+ STACKED 2X4 RECEPTACLE ASSEMBLY; 产品类别连接器连接器; 文件大小225KB，共2页; 制造商TE Connectivity(泰科); 官网地址http://www.te.com; 标准

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2180324-2概述

(2180324-2) zSFP+ STACKED 2X4 RECEPTACLE ASSEMBLY

2180324-2规格参数

参数名称	属性值
Brand Name	TE Connectivity
是否Rohs认证	符合
Objectid	8003528808
Reach Compliance Code	compliant
Samacsys Description	Configuration Features: Lightpipe Style Standard \| Port Matrix Configuration 2 x 4 \| Number of Positions 160 \| Number of Ports 8 \| Contact Features: Tail Plating Material Tin \| Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Contact Mating Area Plating Material Thickness .76 MICM \| Dimensions: PCB Thickness (Recommended) .059 INCH \| PCB Thickness (Recommended) 1.5 MM \| Electrical Characteristics: Data Rate (Max) 32
Samacsys Manufacturer	TE Connectivity
Samacsys Modified On	2024-04-03 11:24:51
YTEOL	7.78
连接器类型	TELECOM AND DATACOM CONNECTOR
联系完成配合	NOT APPLICABLE
触点材料	NOT APPLICABLE
DIN 符合性	NO
电磁干扰屏蔽	NO
空壳	YES
滤波功能	NO
IEC 符合性	NO
MIL 符合性	NO
电源连接器额定值	115/230VAC
混合触点	NO
安装类型	BOARD
连接器数	ONE
端口数量	8
最高工作温度	105 °C
最低工作温度	-55 °C
选件	GENERAL PURPOSE
面板安装	NO
电镀厚度	29.92u inch
参考标准	UL
端子长度	0.07 inch
端子节距	0.8 mm
端接类型	PRESS FIT
触点总数	160
UL 易燃性代码	94V-0

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THIS DRAWING IS UNPUBLISHED.

RELEASED FOR PUBLICATION

BY -

LOC

DIST

REVISIONS

LTR

DESCRIPTION

DATE

DWN

APVD

RELEASED

21NOV2013

MATERIAL:

CONTACT:COPPER ALLOY

HOUSING:THERMOPLASTIC

FINISH :

CONTACT AREA:GOLD FLASH OVER PALLADIUM-NICKEL

OR GOLD PLATING,0.76um MIN TOTAL

SOLDER AREA: GOLD FLASH

UNDERPLATING:2.54um MIN NICKEL OVER ALL

11.00

9.35

0.08

( 7.87 )

FINISH :

CONTACT AREA:GOLD FLASH OVER PALLADIUM-NICKEL

OR GOLD PLATING,0.38um MIN TOTAL

SOLDER AREA: GOLD FLASH

UNDERPLATING:2.54um MIN NICKEL OVER ALL

PART NUMBER AND DATE CODE APPROXIMATELY

MARKED IN THIS AREA.

1.16

2.92

5.33

5.35

1.10

0.90

0.80

TYP.

0.40

9.60

0.80

TYP

1.40

0.05

4.24

1.40

0.05

0.71

SECTION

7.87

2170088-2

2170088-1

TE PART NO.

TE Connectivity

B-B

DWN

CHK

THIS DRAWING IS A CONTROLLED DOCUMENT.

DIMENSIONS:

TOLERANCES UNLESS

OTHERWISE SPECIFIED:

MATERIAL

0 PLC

1 PLC

2 PLC

3 PLC

4 PLC

ANGLES

FINISH

0.25

0.13

28MAR2011

MANQIAN WANG

APVD

28MAR2011

MANQIAN WANG

PRODUCT SPEC

APPLICATION SPEC

ALEX SHOAL

28MAR2011

NAME

FINISH

108-60099

114-13120

1471-9 (3/11)

WEIGHT

Customer Drawing

00779

SIZE

CAGE CODE

ASSEMBLY DRAWING

SMT,20POS,ZSFP+

DRAWING NO

RESTRICTED TO

2170088

SCALE

8:1

SHEET

REV

2180324-2相似产品对比

	2180324-2	2170088-2	2170088-1	VS-720-LPC-CBD-622.080	2198339-2	2198318-6	2180324-6	2198339-6
描述	(2180324-2) zSFP+ STACKED 2X4 RECEPTACLE ASSEMBLY	(2170088-2) ZSFP+ Connector,15u"	(2170088-1) ZSFP+ Connector,30u"	SAW Oscillator, 622.08MHz Nom	zSFP+ STACKED 2X6 RECEPTACLE ASSEMBLY	Telecom and Datacom Connector, 40 Contact(s), Press Fit Terminal	Telecom and Datacom Connector, 160 Contact(s), Press Fit Terminal	zSFP+ STACKED 2X6 RECEPTACLE ASSEMBLY
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合
Reach Compliance Code	compliant	compliant	compliant	compliant	unknow	compliant	compliant	unknow
Brand Name	TE Connectivity	TE Connectivity	TE Connectivity	-	TE Connectivity	-	-	TE Connectivity
Objectid	8003528808	1424906863	1424906862	7400622587	-	1474147168	8003528812	-
Samacsys Description	Configuration Features: Lightpipe Style Standard \| Port Matrix Configuration 2 x 4 \| Number of Positions 160 \| Number of Ports 8 \| Contact Features: Tail Plating Material Tin \| Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Contact Mating Area Plating Material Thickness .76 MICM \| Dimensions: PCB Thickness (Recommended) .059 INCH \| PCB Thickness (Recommended) 1.5 MM \| Electrical Characteristics: Data Rate (Max) 32	TE CONNECTIVITY - 2170088-2 - Pluggable I/O Connector, zSFP+, 20 Contacts, 1 x 1 (Single), Surface Mount	SFP, SFP+ & zSFP+, Connector, Data Rate (Max) 32 Gb/s, SFP+, Surface Mount Mount, Cable-to-Board, 20 Position, .031 in [.8 mm] Centerline	-	-	40 (20 x 2) Position zSFP+ Receptacle with Cage, Ganged (2x1) Connector Press-Fit Through Hole, Right Angle	Configuration Features: Number of Positions 160 \| Port Matrix Configuration 2 x 4 \| Number of Ports 8 \| Lightpipe Style Standard \| Contact Features: Tail Plating Material Tin \| Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel \| Contact Mating Area Plating Material Thickness .76 MICM \| Contact Mating Area Plating Material Thickness 29.92 MICIN \| Dimensions: PCB Thickness (Recommended) 1.5 MM \| PCB Thickness (Recommended) .059 INCH \| Electrical Characteristics: Data Rate (Max) 32	-
Samacsys Manufacturer	TE Connectivity	TE Connectivity	TE Connectivity	-	-	TE Connectivity	TE Connectivity	-
Samacsys Modified On	2024-04-03 11:24:51	2020-10-07 00:36:05	2022-05-20 06:27:17	-	-	2023-12-26 08:58:54	2024-04-03 11:24:51	-
YTEOL	7.78	-	7.75	4.5	-	7.97	7.78	-
连接器类型	TELECOM AND DATACOM CONNECTOR	-	TELECOM AND DATACOM CONNECTOR	-	TELECOM AND DATACOM CONNECTOR	TELECOM AND DATACOM CONNECTOR	TELECOM AND DATACOM CONNECTOR	TELECOM AND DATACOM CONNECTOR
联系完成配合	NOT APPLICABLE	-	NOT APPLICABLE	-	NOT SPECIFIED	NOT SPECIFIED	NOT APPLICABLE	NOT SPECIFIED
触点材料	NOT APPLICABLE	-	NOT APPLICABLE	-	NOT SPECIFIED	NOT SPECIFIED	NOT APPLICABLE	NOT SPECIFIED
最高工作温度	105 °C	85 °C	85 °C	70 °C	-	105 °C	105 °C	-
最低工作温度	-55 °C	-55 °C	-55 °C	-	-	-55 °C	-55 °C	-

2180324-2

2180324-2在线购买

2180324-2概述

2180324-2规格参数

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