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2198339-6

产品描述zSFP+ STACKED 2X6 RECEPTACLE ASSEMBLY
产品类别连接器    连接器   
文件大小225KB,共2页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
标准
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2198339-6概述

zSFP+ STACKED 2X6 RECEPTACLE ASSEMBLY

2198339-6规格参数

参数名称属性值
Brand NameTE Connectivity
是否Rohs认证符合
厂商名称TE Connectivity(泰科)
Reach Compliance Codeunknow
ECCN代码EAR99
Samacsys DescriptizSFP+ STACKED 2X6 RECEPTACLE ASSEMBLY
连接器类型TELECOM AND DATACOM CONNECTOR
联系完成配合NOT SPECIFIED
触点材料NOT SPECIFIED
制造商序列号2198339

文档预览

下载PDF文档
4
THIS DRAWING IS UNPUBLISHED.
RELEASED FOR PUBLICATION
BY -
ALL RIGHTS RESERVED.
20
3
2
LOC
DIST
1
C
COPYRIGHT
20
-
-
REVISIONS
P
LTR
DESCRIPTION
DATE
DWN
APVD
A
RELEASED
21NOV2013
JW
SH
D
D
1
MATERIAL:
CONTACT:COPPER ALLOY
HOUSING:THERMOPLASTIC
FINISH :
CONTACT AREA:GOLD FLASH OVER PALLADIUM-NICKEL
OR GOLD PLATING,0.76um MIN TOTAL
SOLDER AREA: GOLD FLASH
UNDERPLATING:2.54um MIN NICKEL OVER ALL
2
3
C
4
11.00
9.35
0.08
( 7.87 )
FINISH :
CONTACT AREA:GOLD FLASH OVER PALLADIUM-NICKEL
OR GOLD PLATING,0.38um MIN TOTAL
SOLDER AREA: GOLD FLASH
UNDERPLATING:2.54um MIN NICKEL OVER ALL
PART NUMBER AND DATE CODE APPROXIMATELY
MARKED IN THIS AREA.
C
4
1.16
2.92
5.33
5.35
1.10
0.90
0.80
TYP.
0.40
9.60
0.80
TYP
1.40
0.05
B
4.24
B
1.40
0.05
0.71
SECTION
7.87
3
2
2170088-2
2170088-1
TE PART NO.
TE Connectivity
B-B
DWN
CHK
THIS DRAWING IS A CONTROLLED DOCUMENT.
A
DIMENSIONS:
mm
TOLERANCES UNLESS
OTHERWISE SPECIFIED:
MATERIAL
0 PLC
1 PLC
2 PLC
3 PLC
4 PLC
ANGLES
FINISH
-
0.25
0.13
-
-
28MAR2011
MANQIAN WANG
APVD
28MAR2011
MANQIAN WANG
PRODUCT SPEC
APPLICATION SPEC
ALEX SHOAL
28MAR2011
NAME
FINISH
A
108-60099
114-13120
-
-
1
1471-9 (3/11)
-
2
3
WEIGHT
-
Customer Drawing
A2
00779
SIZE
CAGE CODE
ASSEMBLY DRAWING
SMT,20POS,ZSFP+
-
DRAWING NO
RESTRICTED TO
2170088
SCALE
8:1
SHEET
1
OF
2
REV
-
A

2198339-6相似产品对比

2198339-6 2170088-2 2170088-1 VS-720-LPC-CBD-622.080 2198339-2 2198318-6 2180324-6 2180324-2
描述 zSFP+ STACKED 2X6 RECEPTACLE ASSEMBLY (2170088-2) ZSFP+ Connector,15u" (2170088-1) ZSFP+ Connector,30u" SAW Oscillator, 622.08MHz Nom zSFP+ STACKED 2X6 RECEPTACLE ASSEMBLY Telecom and Datacom Connector, 40 Contact(s), Press Fit Terminal Telecom and Datacom Connector, 160 Contact(s), Press Fit Terminal (2180324-2) zSFP+ STACKED 2X4 RECEPTACLE ASSEMBLY
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合
Reach Compliance Code unknow compliant compliant compliant unknow compliant compliant compliant
Brand Name TE Connectivity TE Connectivity TE Connectivity - TE Connectivity - - TE Connectivity
连接器类型 TELECOM AND DATACOM CONNECTOR - TELECOM AND DATACOM CONNECTOR - TELECOM AND DATACOM CONNECTOR TELECOM AND DATACOM CONNECTOR TELECOM AND DATACOM CONNECTOR TELECOM AND DATACOM CONNECTOR
联系完成配合 NOT SPECIFIED - NOT APPLICABLE - NOT SPECIFIED NOT SPECIFIED NOT APPLICABLE NOT APPLICABLE
触点材料 NOT SPECIFIED - NOT APPLICABLE - NOT SPECIFIED NOT SPECIFIED NOT APPLICABLE NOT APPLICABLE
Objectid - 1424906863 1424906862 7400622587 - 1474147168 8003528812 8003528808
Samacsys Description - TE CONNECTIVITY - 2170088-2 - Pluggable I/O Connector, zSFP+, 20 Contacts, 1 x 1 (Single), Surface Mount SFP, SFP+ & zSFP+, Connector, Data Rate (Max) 32 Gb/s, SFP+, Surface Mount Mount, Cable-to-Board, 20 Position, .031 in [.8 mm] Centerline - - 40 (20 x 2) Position zSFP+ Receptacle with Cage, Ganged (2x1) Connector Press-Fit Through Hole, Right Angle Configuration Features: Number of Positions 160 | Port Matrix Configuration 2 x 4 | Number of Ports 8 | Lightpipe Style Standard | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 Configuration Features: Lightpipe Style Standard | Port Matrix Configuration 2 x 4 | Number of Positions 160 | Number of Ports 8 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32
Samacsys Manufacturer - TE Connectivity TE Connectivity - - TE Connectivity TE Connectivity TE Connectivity
Samacsys Modified On - 2020-10-07 00:36:05 2022-05-20 06:27:17 - - 2023-12-26 08:58:54 2024-04-03 11:24:51 2024-04-03 11:24:51
最高工作温度 - 85 °C 85 °C 70 °C - 105 °C 105 °C 105 °C
最低工作温度 - -55 °C -55 °C - - -55 °C -55 °C -55 °C
YTEOL - - 7.75 4.5 - 7.97 7.78 7.78

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