RCL e3
www.vishay.com
Vishay Draloric
Long Side Termination Thick Film Chip Resistors
FEATURES
• Enhanced power rating
• Long side terminations
• Enhanced thermo cycling performance in 0406
size
• Pure tin solder contacts on Ni barrier layer,
provides compatibility with lead (Pb)-free and lead
containing soldering processes
• AEC-Q200 qualified
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
CASE
SIZE
INCH
CASE
SIZE
METRIC
POWER
RATING
P
70
W
LIMITING
ELEMENT
VOLTAGE
U
max.
AC
RMS
/DC
V
50
TEMPERATURE
COEFFICIENT
ppm/K
RESISTANCE
RANGE
MODEL
TOLERANCE
%
SERIES
RCL0406 e3
0406
RR 1016M
0.25
± 100
± 200
±1
±5
1R0 to 1M
E24; E96
E24
Zero-Ohm-Resistor:
R
max.
= 10 m,
I
max.
at 70°C = 4.0 A
RCL0612 e3
0612
RR 1632M
0.5
75
± 100
± 200
±1
±5
1R0 to 1M
E24; E96
E24
Zero-Ohm-Resistor:
R
max.
= 10 m,
I
max.
at 70°C = 6.0 A
RCL1218 e3
1218
RR 3246M
1.0
200
± 100
± 200
±1
±5
1R0 to 2.2M
E24; E96
E24
Zero-Ohm-Resistor:
R
max.
= 20 m,
I
max.
at 70°C = 7.0 A
RCL1225 e3
1225
RR 3263M
2.0
(1)
200
± 100
± 200
±1
±5
1R0 to 1M
E24; E96
E24
Zero-Ohm-Resistor:
R
max.
= 10 m,
I
max.
at 70°C = 12 A
Notes
• These resistors do not feature a lifetime limitation when operated within the limits of rated dissipation, permissible operating voltage and
permissible film temperature. However, the resistance typically increases due to the resistor’s film temperature over operating time, generally
known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional lifetime.
• Marking and packaging: See datasheet “Surface Mount Resistor Marking” (www.vishay.com/doc?20020). No marking for 0406 size.
• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
(1)
Specified power rating requires dedicated mounting conditions to achieve the required thermal resistance.
TECHNICAL SPECIFICATIONS
PARAMETER
Rated Dissipation at
P
70 (2)
Operating Voltage
U
max.
AC
RMS
/DC
Insulation Voltage
U
ins
(1 min)
Insulation Resistance
Operating Temperature Range
Weight
(2)
UNIT
W
V
V
°C
mg
RCL0406
0.25
50
100
RCL0612
0.5
75
100
> 10
9
RCL1218
1.0
200
300
RCL1225
2.0
(3)
200
300
- 55 to + 155
3.5
11
29.5
55
Notes
The power dissipation on the resistors generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
(3)
Specified power rating requires dedicated mounting conditions to achieve the required thermal resistance.
Revision: 15-Apr-13
Document Number: 20046
1
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCL e3
www.vishay.com
Vishay Draloric
PART NUMBER AND PRODUCT DESCRIPTION
PART NUMBER: RCL061210K0FKEA
R
C
L
0
6
1
2
1
0
K
0
F
K
E
A
MODEL
RCL0406
RCL0612
RCL1218
RCL1225
RESISTANCE
R
= Decimal
K
= Thousand
M
= Million
0000
= 0
Jumper
TOLERANCE
F
=±1%
J
=±5%
Z
= Jumper
TCR
K
= ± 100 ppm/K
N
= ± 200 ppm/K
0
= Jumper
PACKAGING
EA
EB
EC
EK
EG
PRODUCT DESCRIPTION: RCL0612 100 10K 1 % ET1 e3
RCL0612
MODEL
RCL0406
RCL0612
RCL1218
RCL1225
100
TCR
± 100
ppm/K
± 200
ppm/K
10K
RESISTANCE
10R
= 10
10K
= 10 k
1M
= 1 M
0R0
= Jumper
1%
TOLERANCE
±1%
±5%
ET1
PACKAGING
ET1
ET5
ET6
ET9
E67
e3
LEAD (Pb)-FREE
e3
= Pure tin
termination
finish
PACKAGING
MODEL
CODE
EA = ET1
RCL0406
EB = ET5
EC = ET6
EA = ET1
RCL0612
EB = ET5
EC = ET6
RCL1218
RCL1225
EK = ET9
EG = E67
QUANTITY
5000
10 000
20 000
5000
10 000
20 000
4000
2000
Blister tape acc. to
IEC 60068-3
Type II
12 mm
12 mm
4 mm
8 mm
Paper tape acc. to
IEC 60068-3
Type I
8 mm
4 mm
8 mm
4 mm
CARRIER TAPE
WIDTH
PITCH
REEL DIAMETER
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
285 mm/11.25"
330 mm/13"
180 mm/7"
180 mm/7"
DIMENSIONS
in millimeters
T2
L
H
l
W
T1
b
a
SIZE
INCH METRIC
0406
0612
1218
1225
1016
1608
3246
3263
L
1.0 ± 0.1
1.6 ± 0.2
3.2
+ 0.10
- 0.20
DIMENSIONS
W
1.6 ± 0.1
3.2 ± 0.2
4.6 ± 0.15
6.3 ± 0.2
H
0.25 ± 0.1
0.55 ± 0.1
0.55 ± 0.05
0.75 ± 0.15
T1
0.2
+ 0.10
- 0.15
SOLDER PAD DIMENSIONS
REFLOW SOLDERING
T2
0.2 ± 0.1
a
0.55
0.6
1.1
1.9
b
1.75
3.2
4.9
7.6
l
0.35
1.0
1.9
1.2
WAVE SOLDERING
a
0.75
1.1
1.25
1.9
b
1.8
3.2
4.8
7.6
l
0.35
1.0
1.9
1.2
0.35 ± 0.15 0.25 ± 0.15
0.45 ± 0.2
0.8 ± 0.2
0.4 ± 0.2
0.4 ± 0.2
3.2 ± 0.2
Revision: 15-Apr-13
Document Number: 20046
2
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCL e3
www.vishay.com
FUNCTIONAL PERFORMANCE
Single Pulse
Pulse Load
P
max.
(W)
Vishay Draloric
1000
1225
1218
0612
0406
100
10
1
0.1
0.01
-6
10
10
-5
10
-4
10
-3
10
-2
10
-1
1
10
100
Pulse Duration
t
i
(s)
Maximum pulse load, single pulse; applicable if
P
0 and n < 1000 and
Û
≤
Û
max.
;
for permissible resistance change equivalent to 8000 h operation
Continuous Pulse
Continuous Pulse Load
P
max.
(W)
1000
1225
1218
0612
0406
100
10
1
0.1
0.01
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
1
10
100
Pulse Duration
t
i
(s)
Maximum pulse load, continuous pulses; applicable if
P
≤
P
(ϑ
amb
) and
Û
≤
Û
max.
;
for permissible resistance change equivalent to 8000 h operation
Pulse Voltage
Pulse Voltage
Û
max.
(V)
800
1225, 1218
700
600
500
400
300
200
100
0
-6
10
10
- 5
10
- 4
10
- 3
10
- 2
10
- 1
1
10
0612
0406
Pulse Duration
t
i
(s)
Maximum pulse voltage, single and continuous pulses; applicable if
P
≤
P
max.
; for permissible resistance change equivalent to 8000 h operation
Revision: 15-Apr-13
Document Number: 20046
3
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCL e3
www.vishay.com
Vishay Draloric
Derating
Fraction of Rated Dissipation
P
70
in %
100
50
0
- 50
0
50
100
150
70
Ambient Temperature
ϑ
amb
in °C
TEST PROCEDURES AND REQUIREMENTS
IEC
EN 60115-1 60068-2
CLAUSE
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 2 OR BETTER
1 to 2.2 M
±1%
±5%
Stability for product types:
RCL e3
4.5
4.7
4.13
-
-
-
Resistance
Voltage proof
Short time overload
-
U
= 1.4 x
U
ins
; 60 s
U
= 2.5 x
P
70
x
R
2 x
U
max.;
Duration acc. to style
Solder bath method;
Sn60Pb40
non-activated flux;
(235 ± 5) °C
(2 ± 0.2) s
4.17.2
58 (Td)
Solderability
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5) °C
(3 ± 0.3) s
4.8.4.2
4.32
4.33
-
21 (Uu
3
)
21 (Uu
1
)
Temperature
coefficient
Shear
(adhesion)
Substrate bending
(20/- 55/20) °C and
(20/125/20) °C
45 N
Depth 2 mm;
3 times
30 min at - 55 °C;
30 min at 125 °C
5 cycles
1000 cycles
No flashover or breakdown
± (0.25 %
R
+ 0.05
)
± (0.5 %
R
+ 0.05
)
Good tinning ( 95 % covered)
no visible damage
Good tinning ( 95 % covered)
no visible damage
± 100 ppm/K
± 200 ppm/K
No visible damage
No visible damage, no open circuit in bent position
± (0.25 %
R
+ 0.05
)
4.19
14 (Na)
Rapid change of
temperature
± (0.25 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
± (0.5 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
Revision: 15-Apr-13
Document Number: 20046
4
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCL e3
www.vishay.com
Vishay Draloric
TEST PROCEDURES AND REQUIREMENTS
IEC
EN 60115-1 60068-2
CLAUSE
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 2 OR BETTER
1 to 2.2 M
Stability for product types:
RCL e3
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
-
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
-
Climatic sequence:
Dry heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
DC load
-
125 °C; 16 h
55 °C;
90 % RH;
24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C;
90 % RH;
24 h; 5 cycles
U
=
P
70
x
R
U
=
P
70
x
R
U
max.;
1.5 h on; 0.5 h off;
4.25.1
-
Endurance at 70 °C
70 °C; 1000 h
70 °C; 8000 h
4.18.2
58 (Td)
Resistance to
soldering heat
Flamability,
needle flame test
Damp heat,
steady state
Endurance at
upper category
temperature
Electrostatic
discharge
(human body model)
Component solvent
resistance
Solvent resistance
of marking
Vibration, endurance
by sweeping
Solder bath method
(260 ± 5) °C;
(10 ± 1) s
IEC 60695-11-5;
10 s
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
155 °C, 1000 h
IEC 61340-3-1;
3 pos. + 3 neg. discharges;
ESD voltage: 1000 V
Isopropyl alcohol;
50 °C; method 2
Isopropyl alcohol;
50 °C; method 1,
toothbrush
f = 10 Hz to 2000 Hz;
x, y, z
1.5 mm;
A
200 m/s
2
;
10 sweeps per axis
U
=
4.37
-
Periodic electric
overload
Single pulse high
voltage overload,
10 μs/700 μs
15 x
P
70
x
R
2 x
U
max.;
0.1 s on; 2.5 s off;
1000 cycles
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
± (0.5 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
± (0.25 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
± (4 %
R
+ 0.1
)
± (0.5 %
R
+ 0.05
)
4.35
-
No burning after 30 s
± (1 %
R
+ 0.05
)
4.24
78 (Cab)
4.25.3
-
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
4.40
4.29
4.30
-
45 (XA)
45 (XA)
± (1 %
R
+ 0.05
)
No visible damage
Marking legible,
no visible damage
4.22
6 (Fc)
± (0.25 %
R
+ 0.05
)
± (0.5 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
4.27
-
Û
= 10 x
P
70
x
R
2 x
U
max.;
10 pulses
± (1 %
R
+ 0.05
)
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2, environmental test procedures
Packaging of components is done in paper tapes according to IEC 60286-3.
Revision: 15-Apr-13
Document Number: 20046
5
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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