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TXB2P-019-028ND

产品描述thermal link press ON nickel TO-
产品类别热管理产品   
文件大小137KB,共2页
制造商CTS [CTS Corporation]
标准  
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TXB2P-019-028ND概述

thermal link press ON nickel TO-

TXB2P-019-028ND规格参数

参数名称属性值
Datasheets
Heatsinks, Thermal Links
Product Photos
TXB2P-019-028ND
Catalog Drawings
TX(B2)P Series
Standard Package100
CategoryFans, Thermal Manageme
FamilyThermal - Heat Sinks
类型
Type
Top Mou
Package CooledTO-18
Attachment MethodPress Fit, Bolt O
ShapeCylindrical
长度
Length
0.280" (7.11mm)
宽度
Width
0.220" (5.59mm)
Diamete0.220" (5.59mm) OD
Thermal Resistance @ Natural108°C/W
MaterialBrass
Material FinishDull Nickel
Other Names294-1141

文档预览

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CTS
®
iZIF
HEAT FRAME
GENERAL DESCRIPTION
The iZIF
is a custom aluminum heat frame that integrates
the PCB retainer for improved structural integrity and thermal
efficiency (.8°C-in./W). The iZIF
is a highly reliable patent-
pending design for rugged military and aerospace circuit card
applications. It features a quarter-turn lock, uniform clamping
pressure, and can be sized to fit small daughter cards up to
9U VME. A bottom plate may also be added for additional
cooling and structural integrity. The iZIF
features a 1/8”
stainless steel socket head cap rod with beryllium copper
spring. A variety of finishes are available such as chemical
film, black anodize, and electroless nickel.
THERMAL LINKS
GENERAL DESCRIPTION
CTS’s thermal links provide superior retention because
of the 6 to 8-segment fingers versus the 2 or 3-segment
fingers available from other manufacturers. These thermal
links are offered for TO-5s, TO-8s and TO-18s with or
without BeO washer and other appropriate hardware.
They provide an effective retainer and efficient thermal
path between semiconductor and heat sinks or chassis.
There is excellent transistor retention under high
vibration and shock loads. The thermal links can be
inserted and removed multiple times without loss of
retention or damage to the finish over the entire JEDEC
case diameter range. They can be installed with a rivet or
eyelet, soldered to a PC pad or heat sink, mounted with a
single screw or with a threaded stud and hex nut.
FAN TOP SERIES
A
B
Fan Tops
“A”
Dim.
.25
.25
.25
.25
.36
.33
.12
.12
“B” Semiconductor
Dim.
Case Type
*Ø °C/W
.50
.50
.75
.75
1.25
1.25
1.25
1.25
TO-18
TO-18
TO-5
TO-5
TO-5
TO-8
TO-5
TO-8
150.0
150.0
81.1
81.1
57.7
41.0
56.6
56.6
Unplated
Part Number
Black Cadmium
Black Chem.
Material
BeCu
Brass
BeCu
Brass
Brass Fan
BeCu Retainer
Brass Fan
BeCu Retainer
Brass
Brass
TXBF-019-025U TXBF-019-025B
N.A.
TXCF-019-025U
N.A.
TXCF-019-025CB
TXBF-032-025U TXBF-032-025B
N.A.
TXCF-032-025U
N.A.
TXCF-032-025CB
TXBF2-032-036U TXBF2-032-036B
N.A.
TXBF2-050-033U TXBF2-050-033B
TXCF-125-1U
TXCF-125-2U
TXCF-125-1CB
TXCF-125-2B
N.A.
N.A.
N.A.
*Natural convection, case-ambient mounted on G10 board
18

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