电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C0603Y201K9RALTM

产品描述Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0002uF, Surface Mount, 0603, CHIP
产品类别无源元件    电容器   
文件大小567KB,共1页
制造商KEMET(基美)
官网地址http://www.kemet.com
下载文档 详细参数 全文预览

C0603Y201K9RALTM概述

Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.0002uF, Surface Mount, 0603, CHIP

C0603Y201K9RALTM规格参数

参数名称属性值
是否Rohs认证不符合
Objectid1238742695
包装说明, 0603
Reach Compliance Codecompliant
ECCN代码EAR99
YTEOL5.21
电容0.0002 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
JESD-609代码e0
制造商序列号C0603
安装特点SURFACE MOUNT
多层Yes
负容差10%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法TR, 7 INCH
正容差10%
额定(直流)电压(URdc)6.3 V
尺寸代码0603
表面贴装YES
温度特性代码X7R
温度系数15% ppm/°C
端子面层Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
端子形状WRAPAROUND

文档预览

下载PDF文档
SOLUTIONS
Flex Mitigation Multilayer
Ceramic Capacitors
Hybrid Technology
Programs Supported
• Commercial
• Automotive
Why Choose KEMET
KEMET applies world-class service and quality
to deliver industry-leading, high performance
capacitance solutions worldwide. With 95% of
possible dielectric solutions, KEMET offers the
world’s most complete line of surface mount
and through-hole capacitor technologies across
tantalum, ceramic, film, aluminum and paper
dielectrics. One world. One KEMET.
KEMET Electrical/Physical Characteristics
Dielectric
Case
Sizes
Tolerances
Temperature
Range
Voltage
Options
Capacitance
Values
Flexible Termination + Open Mode (FO-CAP)
X7R
0805 - 1812
± 5%, ±10%, ± 20%
- 55°C to +125°C
16 – 200 V
1,000 pF – 6.8 µF
Features & Benefits
• Fail open electrode designs
• Low to high capacitance flex mitigation
• Flex mitigation technology inside the chip
and in the termination area
• Provides protection against a low IR or short
circuit condition
• Superior flex performance (up to 5 mm)
• Pb-Free and RoHS compliant
Flexible Termination + Floating Electrode (FF-CAP)
X7R
0603 - 1812
± 5%, ± 10%, ± 20%
- 55°C to +125°C
6.3 – 250 V
180 pF – 0.22 µF
Product Checklist
• Is this a critical and safety relevant circuit?
• Is your circuit board subject to high levels
of board flexure during assembly, mounting
or depanelization?
• Are you placing MLCCs close to the edges
or corners of your board?
• Are MLCCs being placed near or around
connectors or heavy components?
• Do you require a case size smaller than
EIA 0603?
• Is mechanical or thermal stress a concern in
your application?
• Is your application commercial or automotive?
• What are your capacitance requirements?
Flexible Termination +
Open Mode (FO-CAP)
Flexible Termination +
Floating Electrode (FF-CAP)
Ordering Information
Ceramic Case Size Specification/ Capacitance Capacitance Rated Dielectric Failure Termination Packaging/Grade
(L” x W”)
Series
Code (pF) Tolerance Voltage
Rate/Design Finish
1
(C-Spec)
2
(VDC)
C
1210
0805
1206
1210
1812
F
J = Flexible
Termination
with Open
Mode
685
K
3
R
A
A = N/A
C
C = 100%
Matte Sn
L = SnPb
(5% min)
TU
Blank = Bulk
TU = 7” Reel
Unmarked
TM = 7” Reel
Marked
AUTO =
Automotive Grade
7”Reel Unmarked
TU
Blank = Bulk
TU = 7” Reel
Unmarked
TM = 7” Reel
Marked
2 Significant K = ±10%
Digits +
M = ±20%
Number of
Zeros
4 = 16 V R = X7R
3 = 25 V
5 = 50 V
1 = 100 V
2 = 200 V
C
0805
0603
0805
1206
1210
1812
Y
Y=
Flexible
Termination
with
Floating
Electrode
104
2 Signicant
Digits +
Number of
Zeros
K
5
R
A
A = N/A
C
C = 100%
Matte Sn
L = SnPb
(5% min)
For more information, samples
and engineering kits,
please visit us at www.kemet.com
or call 1.877.myKEMET.
SA0612
J = ±5% 9 = 6.3 V R = X7R
K = ±10% 8 = 10 V
M = ±20% 4 = 16 V
3 = 25 V
5 = 50 V
1 = 100 V
2 = 200 V
A = 250 V
Additional termination finish options may be available. Contact KEMET for details.
SnPb termination finish option is not available on Automotive Grade product.
2
Additional reeling or packaging options may be available. Contact KEMET for details.
1
1,2
Copyright © 2012 KEMET
关于si446x无线模块
请问大家有没有用过si4463这款无线模块,发完上电命令(POWER_UP)后 , 发设备信息的命令(PART_INFO),为什么返回的都是0xff, 是我少了哪个步骤了么 帮我看看么? 下面是部分子程序, ......
yumin1058882119 无线连接
silicon labs新推无线通信模块si1000系列资料
最近刚申请下芯科实验室的一款集MCU和无线通信模块的芯片SI1000评估板,不知道大家有没有用过,可以一起交流一下...
huochaobin 无线连接
嵌入式系统的双CPU通讯协议设计
我是应届的本科毕业生,学软件工程的。签到东软IA事业部。给我出的毕业设计课题为《嵌入式系统的双CPU通讯协议设计》。可我可以说基本没有接触过,有点无从下手的感觉。有没有哪位牛人,给我点 ......
轩辕情伤 嵌入式系统
视频: 第六部视频CC2538之Contiki3.0CoAP协议例程(使用边界路由器,Firefox)
http://v.youku.com/v_show/id_XMTQwMDYwMzg5Ng==.html?from=y1.7-1.2 视频采用两个zigbee(cc2538)实现ping6(无线节点),有条件可以多加几个节点 路由协议为roll 应用层协议CoAP 以及Firefo ......
dan158185 无线连接
为什么在示波器上可以看到2V信号,但是ADC却无法采集
本帖最后由 frily 于 2020-8-26 18:30 编辑 在淘宝上买了一个 AD7606的ADC模块(https://detail.tmall.com/item.htm?id=609093475396&spm=a1z09.2.0.0.700f2e8dErgCtZ&_u=q8a0n597141) ......
frily 模拟电子
STM8的SWIM极限性能
最近需要做一下SWIM的性能分析,所以想了解一下STM8的SWIM下载Flash时的极限性能,这个极限性能是否是19kb/s? 19kB/s是我自己按照我认为的方式计算得出的,计算方法如下: 3.3ms擦除+3 ......
mef575 stm32/stm8

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 704  1352  905  2009  1508  15  28  19  41  31 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved