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AM29LV320DB90REI: 产品描述Flash, 2MX16, 90ns, PDSO48, MO-142DD, TSOP-48; 产品类别存储存储; 文件大小1MB，共57页; 制造商SPANSION; 官网地址http://www.spansion.com/

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AM29LV320DB90REI概述

Flash, 2MX16, 90ns, PDSO48, MO-142DD, TSOP-48

AM29LV320DB90REI规格参数

参数名称	属性值
是否Rohs认证	不符合
零件包装代码	TSOP1
包装说明	MO-142DD, TSOP-48
针数	48
Reach Compliance Code	not_compliant
ECCN代码	3A991.B.1.A
最长访问时间	90 ns
其他特性	BOTTOM BOOT BLOCK
备用内存宽度	8
启动块	BOTTOM
命令用户界面	YES
通用闪存接口	YES
数据轮询	YES
JESD-30 代码	R-PDSO-G48
JESD-609代码	e0
长度	18.4 mm
内存密度	33554432 bit
内存集成电路类型	FLASH
内存宽度	16
湿度敏感等级	3
功能数量	1
部门数/规模	8,63
端子数量	48
字数	2097152 words
字数代码	2000000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	2MX16
封装主体材料	PLASTIC/EPOXY
封装代码	TSOP1
封装等效代码	TSSOP48,.8,20
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE
并行/串行	PARALLEL
峰值回流温度（摄氏度）	240
电源	3.3 V
编程电压	3 V
认证状态	Not Qualified
就绪/忙碌	YES
座面最大高度	1.2 mm
部门规模	8K,64K
最大待机电流	0.000005 A
最大压摆率	0.03 mA
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	3 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	GULL WING
端子节距	0.5 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
切换位	YES
类型	NOR TYPE
宽度	12 mm
Base Number Matches	1

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Am29LV320D

Data Sheet

RETIRED

PRODUCT

This product has been retired and is not available for designs. For new and current designs,

S29AL032D supersedes Am29LV320D and is the factory-recommended migration path. Please refer

to the S29AL032D datasheet for specifications and ordering information. Availability of this docu-

ment is retained for reference and historical purposes only.

April 2005

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that

originally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appro-

priate, and changes will be noted in a revision summary.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number

23579

Revision

Amendment

Issue Date

December 14, 2005

D A T A S H E E T

TABLE OF CONTENTS

Continuity of Specifications ....................................................... i

For More Information ................................................................. i

Distinctive Characteristics . . . . . . . . . . . . . . . . . . 1

ARCHITECTURAL ADVANTAGES ...................................... 1

PERFORMANCE CHARACTERISTICS ............................... 1

SOFTWARE FEATURES ..................................................... 1

HARDWARE FEATURES .................................................... 1

General Description . . . . . . . . . . . . . . . . . . . . . . . 2

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 6

Special Package Handling Instructions .................................... 7

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10

Table 1. Am29LV320D Device Bus Operations ..............................10

Reset Command ..................................................................... 25

Autoselect Command Sequence ............................................ 25

Table 13. Autoselect Codes ........................................................... 25

Enter Secured Silicon Sector/Exit Secured Silicon Sector

Command Sequence .............................................................. 25

Byte/Word Program Command Sequence ............................. 26

Unlock Bypass Command Sequence .................................. 26

Figure 4. Program Operation ......................................................... 27

Chip Erase Command Sequence ........................................... 27

Sector Erase Command Sequence ........................................ 27

Erase Suspend/Erase Resume Commands ........................... 28

Figure 5. Erase Operation.............................................................. 28

Command Definitions ............................................................. 29

Table 14. Am29LV320D Command Definitions ............................. 29

Write Operation Status . . . . . . . . . . . . . . . . . . . . 30

DQ7: Data# Polling ................................................................. 30

Figure 6. Data# Polling Algorithm .................................................. 30

Word/Byte Configuration ........................................................ 11

Requirements for Reading Array Data ................................... 11

Writing Commands/Command Sequences ............................ 11

Accelerated Program Operation .......................................... 11

Autoselect Functions ........................................................... 11

Standby Mode ........................................................................ 12

Automatic Sleep Mode ........................................................... 12

RESET#: Hardware Reset Pin ............................................... 12

Output Disable Mode .............................................................. 12

Table 2. Top Boot Sector Addresses (Am29LV320DT) ..................13

Table 3. Top Boot Secured Silicon Sector Addresses ................... 14

Table 4. Bottom Boot Sector Addresses (Am29LV320DB) .............14

Table 5. Bottom Boot Secured Silicon Sector Addresses .............. 15

RY/BY#: Ready/Busy# ............................................................ 31

DQ6: Toggle Bit I .................................................................... 31

Figure 7. Toggle Bit Algorithm........................................................ 31

DQ2: Toggle Bit II ................................................................... 31

Reading Toggle Bits DQ6/DQ2 ............................................... 32

DQ5: Exceeded Timing Limits ................................................ 32

DQ3: Sector Erase Timer ....................................................... 32

Table 15. Write Operation Status ................................................... 33

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34

Figure 8. Maximum Negative Overshoot Waveform ...................... 34

Figure 9. Maximum Positive Overshoot Waveform........................ 34

Autoselect Mode ..................................................................... 16

Table 6. Autoselect Codes (High Voltage Method) ........................16

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 34

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35

CMOS Compatible .................................................................. 35

Zero-Power Flash ................................................................. 36

Figure 10. I

CC1

Current vs. Time (Showing Active and

Automatic Sleep Currents) ............................................................. 36

Figure 11. Typical I

CC1

vs. Frequency ............................................ 36

Sector/Sector Block Protection and Unprotection .................. 17

Table 7. Top Boot Sector/Sector Block Addresses

for Protection/Unprotection .............................................................17

Table 8. Bottom Boot Sector/Sector Block

Addresses for Protection/Unprotection ...........................................17

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Figure 12. Test Setup.................................................................... 37

Table 16. Test Specifications ......................................................... 37

Figure 13. Input Waveforms and Measurement Levels ................. 37

Write Protect (WP#) ................................................................ 18

Temporary Sector Unprotect .................................................. 18

Figure 1. Temporary Sector Unprotect Operation........................... 18

Figure 2. In-System Sector Protect/Unprotect Algorithms .............. 19

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38

Read-Only Operations ........................................................... 38

Figure 14. Read Operation Timings ............................................... 38

Secured Silicon Sector Flash Memory Region ....................... 20

Factory Locked: Secured Silicon Sector Programmed

and Protected at the Factory ............................................... 20

Customer Lockable: Secured Silicon Sector NOT Programmed

or Protected at the Factory .................................................. 20

Figure 3. Secured Silicon Sector Protect Verify .............................. 21

Hardware Reset (RESET#) .................................................... 39

Figure 15. Reset Timings ............................................................... 39

Word/Byte Configuration (BYTE#) ............................................. 40

Figure 16. BYTE# Timings for Read Operations............................ 40

Figure 17. BYTE# Timings for Write Operations............................ 40

Hardware Data Protection ...................................................... 21

Low VCC Write Inhibit ......................................................... 21

Write Pulse “Glitch” Protection ............................................ 21

Logical Inhibit ...................................................................... 21

Power-Up Write Inhibit ......................................................... 21

Common Flash Memory Interface (CFI) . . . . . . . 21

Table 9. CFI Query Identification String .......................................... 22

Table 10. System Interface String................................................... 22

Table 11. Device Geometry Definition ............................................ 23

Table 12. Primary Vendor-Specific Extended Query ...................... 24

Erase and Program Operations ................................................. 41

Figure 18. Program Operation Timings..........................................

Figure 19. Chip/Sector Erase Operation Timings ..........................

Figure 20. Data# Polling Timings (During Embedded Algorithms).

Figure 21. Toggle Bit Timings (During Embedded Algorithms)......

Figure 22. DQ2 vs. DQ6.................................................................

Temporary Sector Unprotect ..................................................... 46

Figure 23. Temporary Sector Unprotect Timing Diagram .............. 46

Figure 24. Accelerated Program Timing Diagram.......................... 46

Figure 25. Sector/Sector Block Protect and

Unprotect Timing Diagram ............................................................. 47

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 25

Reading Array Data ................................................................ 25

December 14, 2005

Alternate CE# Controlled Erase and Program Operations ........ 48

Figure 26. Alternate CE# Controlled Write

Am29LV320D

AM29LV320DB90REI

AM29LV320DB90REI概述

AM29LV320DB90REI规格参数

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