www.ddc-web.com
MIL-STD-1553 Terminals for
Space Applications:
MODEL:BU-63825(925) and BU-63705
FEATURES:
BU-63705:
•
Drop-in Replacement for BU-61582 (83)
•
Drop-in Replacement for BU-65142
•
Rad Tolerant & Rad Hard Versions*
•
Rad Tolerant & Rad Hard Versions*
•
Fully Integrated Remote Terminal
•
Fully Integrated 1553 - BC/RT/MT
Including:
•
Flexible Processor Interface
- Low-Power Transceivers
•
16K x 16 Internal RAM
- Complete RT Protocol
•
Intelligent RT Data Buffering
•
Direct Interface to Processorless
•
Multiple Ordering Options;
Systems
+5V (Only), +5V/-15V, +5V/-12V
•
High Reliability Screening
+5V/Transceiverless (Contact Factory for
•
Multiple Ordering Options;
Availability)
+5V (Only), +5V/-15V, and +5V/-12V
+5V (Only, with Transmit Inhibits)
BU-63825(925):
DESCRIPTION
The BU-63825/925 BC/RT/MT Sp’ACE-II and BU-63705 Space-RT-II series of MIL-STD-1553 terminals continues Data
Device Corporation’s (DDC’s) commitment to producing hybrids with enhanced processing and screening for space
borne, radiation and Hi-Rel applications. Both terminals are designed specifically to be hardware and software
compatible, direct drop-in replacements for the equivalent Sp’ACE and Space RT series.
The BU-63825/925 Sp’ACE-II is a complete integrated interface between a 1553 bus and a host processor, and
replaces the BU-61582/83 Sp’ACE ( Space Advanced Communication Engine) pin-for-pin with the same 1.9 square
inch package.
The BU-63705 Space RT-II is a terminal for simple, non-CPU based applications, and shares the same 3.78 square inch
package as BU-65142 Space RT, which it replaces.
APPLICATIONS
The new generation of Sp’ACE-II and Space-RT-II terminals are designed for applications requiring the highest levels
of reliability and radiation tolerance*, including such platforms as launch vehicles, satellites and the International
Space Station.
DESIGN
The manufacturing of hybrids for space applications involves enhancements in the area of layout design, processing
and screening. The principle goal of the hybrid mechanical design is to improve the ease of wire bonding and
inspection. All of DDC's space grade terminals utilize ceramic packaging. Ceramic packages eliminate the potential
hermeticity problems associated with the glass beads of KOVAR (metal) packages. In addition, ceramic packages
facilitate improved thermal properties and feature reduced weight and lower cost.
®
*Contact Factory For Radiation Reports and Test Conditions
All trademarks are the property of their respective owners
© 2006 Data Device Corporation
Make Sure the Next Card
You Purchase Has...
FIGURE 1 MECHANICAL OUTLINES
1.900 MAX
(48.26)
1.760 0.020
(44 70)
0.018 0.002 DIA TYP
(0.46 0.05)
CERAMIC BAR
(2 PLACES)
0.035 (TY
(0.89)
0.215 (5.46) MAX
INDEX DENOTES PIN 1
1.024 MAX
(26.0)
.596 MAX
(15.11)
0.405 MIN (TYP)
(10.29)
0.010 0.002 TYP
(0.254 0.061)
PIN NUMBERS
FOR REF ONLY
0.070 0.010
070
(1.78)
0.012 MAX
(0.31)
0.100 MAX
(2.5 )
.060 MIN (TYP)
(1.27)
34 EQSP @ 0.060 - 1.700
TOL NONCUM
1.DIMENSIONS ARE IN INCHES (MILLIMETERS)
2.PACKAGE MATERIAL: ALUMINA (AL2O3)
3. LEAD MATERIAL KOVAR PLATED BY 50 MINIMUM GOLD
BU-63825 (925)FX, 70-PIN CERAMIC FLAT PACK
MECHANICAL OUTLINE
BU-63705 FX, 78-PIN CERAMIC FLAT PACK
MECHANICAL OUTLINE
RADIATION HARDNESS*
In addition to the screening process, DDC pays
particular attention to the technologies used in the
design of space grade 1553 components. DDC's 1553
series of products combine Bipolar (-15V & -12V) and
BiCMOS (+5V) transceivers along with specially
designed ASICs (HX2000 Series, 0.65 micron RICMOS™ IV
SOI process) and SRAM (HX6256, 0.75 micron RICMOS™
IV SOI process) fabricated by Honeywell Solid-State
Electronics Center (HSSEC). This results in devices with a
minimum total dose of 100 KRAD (Si) with Latch-up
immunity to a maximum radiation hardened total dose
of 1 MRAD (Si). The Sp'ACE II (BU-63825/925) has a Single
Event Upset (SEU) rate of 2.56 x 10-5 errors/device-day
and Linear Energy Transfer (LET) threshold of 63
MeV/cm2/mg.
• Radiographic (X-ray) Inspection (Optional)
• 320-hour burn-in (Standard) {burn-in for Class
H devices is 160 hours}
• Destructive Physical Analysis (DPA) testing
(Optional)
DDC offers other optional services such as Pre-Cap Source
Inspection, One Lot Date Code, Solder Dip, Variables Test
Data, Element Evaluation/SEM Inspection, Configuration
Control, and Program Management. Both the Sp'ACE II
(BU-63825/925) and Space-RT-II (BU-63705) are available to
SMD (Standard Military Drawings), 5962-96887 and 5962-89798,
respectively.
THE TRUE HI-REL SOLUTION
By combining DDC’S long history of producing high reliability
microelectronics with its Class K DSCC Certification, DDC’S
MIL-STD-1553 space level products become the true Hi-Rel
solution. DDC’s ability to integrate a full MIL-STD-1553 space-
grade terminal into a single package results in cost-effective,
small size, low power, high performance and high reliability
solutions for all MIL-STD-1553 space level requirements. These
devices are suitable for space applications, including Launch
Vehicles, Military Satellites, Research Satellites, the
International Space Station, and the Commercial
Telecommunication Satellite arena.
*Contact Factory For Radiation Reports and Test Conditions
HYBRID SCREENING FOR HIGH RELIABILITY
Visual screening for space grade hybrids includes
rigorous inspection for damaged die and wires, stray parti-
cles, and contamination. Additional screening
procedures for space hybrids include:
• 100% Non-destructive wire bond pull (Standard)
• Condition "A" Visual Inspection (Standard)
• Particle Impact Noise Detection (PIND) testing
with the use of getter material (Optional)
Data Device Corporation
www.ddc-web.com
2
BU-63825(925)/BU-63705
REV CODE 2
Specifications
PARAMETER
POWER SUPPLY REQUIREMENTS
BU-63705 & BU-63825 (925)
+5 V Logic Power
BU-63705X1 & BU-63825 (925)X1
+5 V (Ch.A, Ch.B)
-15 V (VA,VB)
BU-63705X2 & BU-63825(925)X2
+5 V (Ch.A, Ch.B)
-12 V (VA,VB)
BU-63705X3 &
BU-63825(925)X3/X6(+5V Only)
+5V (Ch.A, Ch.B)
CURRENT DRAIN (TOTAL HYBRID)
BU-63705X1
+5 V (Logic Current Drain)
-15 V (Ch.A & Ch.B)
0%Transmit/Monitor
25% Transmitter Duty Cycle
50% Transmitter Duty Cycle
75% Transmitter Duty Cycle
BU-63705X2
+5 V (Logic Current Drain)
-12 V (Ch.A & Ch.B)
0%Transmit/Monitor
25% Transmitter Duty Cycle
50% Transmitter Duty Cycle
75% Transmitter DutyCycle
BU-63705X3
+5 V (Logic Current Drain)
+5 V (Ch.A & Ch.B)
0%Transmit/Monitor
25% Transmitter Duty Cycle
50% Transmitter Duty Cycle
75% Transmitter Duty Cycle
BU-63825 (925)X0
+5 V (Logic &
Current Drain)
BU-63825 (925)X1
+5 V (Logic & Transceiver
Current Drain)
-15 V (Ch.A & Ch.B)
0%Transmit/Monitor
25% Transmitter Duty Cycle
50% Transmitter Duty Cycle
75% Transmitter Duty Cycle
50
MIN TYP
MAX UNITS
PARAMETER
BU-63825 (925)X2
+5 V (Logic & Transceiver
Current Drain)
-12 V (Ch.A & Ch.B)
0% Transmit/Monitor
25% Transmitter Duty Cycle
50% Transmitter Duty Cycle
75% Transmitter Duty Cycle
BU-63825 (925)X3/X6
+5 V (Logic & Ch.A & Ch.B)
0% Transmit/Monitor
25% Transmitter Duty Cycle
50% Transmitter Duty Cycle
75% Transmitter Duty Cycle
CLOCK INPUTS
Frequency:
Nominal Value
Default Mode
Optional BU-63825 (925)
THERMAL
Thermal Resistance, Junction-to-
Case, Hottest Die (ThetaJC)
BU-63705
BU-63825(925)X0
BU-63825(925)X1/X2
BU-63825(925)X3/X6
Operating Junction Temperature
Storage Temperature
Lead Temperature
(soldering 10 sec.)
PHYSICAL CHARACTERISTICS
Size
78-Pin QIP (BU-63705D) ,
Flatpack (BU-63705F)
70-Pin DIP(BU-63825/925D) ,
Flat Pack(BU-63825/925F) ,
Gull Lead(BU-63825/925G)
Weight
78-Pin QIP (BU-63705D) ,
Flatpack (BU-63705F)
70-Pin DIP(BU-63825/925D) ,
Flat Pack(BU-63285/925F) ,
Gull Lead(BU-63825/925G)
MIN TYP
140
MAX UNITS
240
mA
4.5
5.0
5.5
V
4.5
5.0
5.5 V
-15.75 -15.0 14.25 V
4.5
-12.6
5.0
-12.0
5.5
-11.4
V
V
30
80
130
180
60
120
185
245
mA
mA
mA
mA
4.75
5.0
5.25
V
250
355
460
565
mA
mA
mA
mA
115
60
108
160
208
115
60
120
185
245
115
125
230
335
440
150
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
16
12
MHz
MHz
-55
-65
7.55
7.10
7.82
12
150
150
300
°C/W
°C/W
°C/W
°C/W
°C
°C
°C
1.80 x 2.10 x 0.21
(45.7 x 53.3 x 5.3)
in.
(mm)
1.9 x 1.0 x 0.215
in.
(48.26 x 25.4 x 5.46) (mm)
140
240
mA
1.7
(48.2)
0.6
(17)
oz.
(g)
oz.
(g)
30
68
105
143
60
108
160
208
mA
mA
mA
mA
3
BU-63825(925)/BU-63705
REV CODE 2
ORDERING INFORMATION
BU63XX5XX- X X X X
Supplemental Process Requirements:
S = Pre-Cap Source Inspection
L = 100% Pull Test (standard on this device)
Q = 100% Pull Test and Pre-Cap Source Inspection
K = One Lot Date Code
W = One Lot Date Code and Pre-Cap Source Inspection
Y = One Lot Date Code and 100% Pull Test
Z = One Lot Date Code, Pre-Cap Source Inspection and 100% Pull Test
Blank = None of the Above
Test Criteria:
0 = Standard Testing
1 = X-Ray
Process Requirements
0
1
2
3
4
5
6
7
8
9
1
2
3
4
5
8
0
1
2
3
6
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
Standard DDC Processing, no Burn-In
MIL-PRF-38534 Compliant (notes 1 and 3)
B (note 2)
MIL-PRF-38534 Compliant with PIND Testing (notes 1 and 3)
MIL-PRF-38534 Compliant with Solder Dip (notes 1, 3 and 4)
MIL-PRF-38534 Compliant with PIND Testing and Solder Dip (notes 1, 3 and 4)
B with PIND Testing (note 2)
B with Solder Dip (notes 2 and 4)
B with PIND Testing and Solder Dip (notes 2 and 4)
Standard DDC Processing with Solder Dip, no Burn-In (note 4)
-55°C to +125°C
-40°C to +85°C
0°C to +70°C
-55°C to +125°C with Variables Test Data
-40°C to +85°C with Variables Test Data
0°C to +70°C with Variables Test Data
No Transceiver (Space II Only, Contact Factory for Availability)
+5 Volts and -15 Volts
+5 Volts and -12 Volts
+5 Volts (Only)
+5 Volts (Only) with "TX_INHIBIT" (Transmit Inhibit) (Sp’ACE II Only)
Temperature Grade/Data Requirements:
Transceiver Voltage Option:
Package Options:
D = 70-pin DIP Package (Sp'ACE II Only); 78-pin QIP Package (Space-RT-II only)
F = 70-pin Flatpack (Sp'ACE II Only); 78-pin Flatpack (Space-RT-II only)
Product Type:
BU-63825 = Sp'ACE II: 70-Pin BC/RT/MT with 16K x 16 Internal RAM
BU-63925 = Sp'ACE II: 70-Pin BC/RT/MT with 16K x 16 Internal RAM and RT Address Latch
BU-63705 = Space-RT-II: 78-pin RT-Only
Notes:
1.
MIL-PRF-38534 Compliant products include 320 hours
of burn-in and 100% non-destruct pull-test.
2.
Standard DDC Processing with burn-in and full
temperature (-55°C to +125°C) test.
3.
MIL-PRF-38534 product grading is designated with
the following dash numbers:
Class H is a -11X, 13X, 14X, 15X, 41X, 43X, 44X, 45X
Class G is a -21X, 23X, 24X, 25X, 51X, 53X, 54X, 55X
Class D is a -31X, 33X, 34X, 35X, 81X, 83X, 84X, 85X
4.
The above products contain tin-lead solder finish as
applicable to solder dip requirements.
Direct Drop-In Replacements
Direct Drop-In Replacements
Original Series Replacement Series
BU-61582
BU-63825
BU-61583
BU-63925
BU-65142
BU-63705
The information in this
Product Brief
is believed to be accurate; however, no responsi-
bility is assumed by Data Device Corporation for its use,
and no license or rights are granted by implication or otherwise in
connection therewith. Specifications are subject to change without notice.
www.ddc-web.com
Call DDC or visit www.ddc-web.com for a quote today:
U
®
105 Wilbur Place, Bohemia, New York, U.S.A. 11716-2482
For Technical Support - 1-800-DDC-5757 ext. 7771
Headquarters, N.Y., U.S.A. -
Tel: (631) 567-5600, Fax: (631) 567-7358
United Kingdom -
Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264
Ireland -
Tel: +353-21-341065, Fax: +353-21-341568
France -
Tel: +33-(0)1-41-16-3424, Fax: +33-(0)1-41-16-
3425
Germany -
Tel: +49-(0)89-15 00 12-11, Fax: +49-(0)89-15 00 12-22
Japan -
Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689
REV CODE 2- 06/07-0
PRINTED IN THE U.S.A.
Microchip MCU
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