Digital Bus Switch ICs Lo-Vltg 10B FET Bus
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP24,.3 |
| 针数 | 24 |
| Reach Compliance Code | compliant |
| Base Number Matches | 1 |
| 74CBTLV3861NSRG4 | 74CBTLV3861DBQRE4 | 74CBTLV3861DBQRG4 | 74CBTLV3861DGVRE4 | BL24C64 | 74CBTLV3861DWRE4 | 74CBTLV3861DWRG4 | 74CBTLV3861PWRE4 | 74CBTLV3861PWRG4 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Digital Bus Switch ICs Lo-Vltg 10B FET Bus | Digital Bus Switch ICs Low-Voltage 10-Bit FET Bus Switch | Digital Bus Switch ICs Lo-Vltg 10B FET Bus | Digital Bus Switch ICs Low-Voltage 10-Bit FET Bus Switch | The device is optimized for use in many industrial and commercial applications | Digital Bus Switch ICs Lo-Vltg 10B FET Bus | Digital Bus Switch ICs Lo-Vltg 10B FET Bus | Digital Bus Switch ICs Lo-Vltg 10B FET Bus | Digital Bus Switch ICs Lo-Vltg 10B FET Bus |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | - | SOIC | SOIC | TSSOP | TSSOP |
| 包装说明 | SOP, SOP24,.3 | SSOP, SSOP24,.24 | SSOP, SSOP24,.24 | TSSOP, TSSOP24,.25,16 | - | SOP, SOP24,.4 | SOP, SOP24,.4 | TSSOP, TSSOP24,.25 | TSSOP, TSSOP24,.25 |
| 针数 | 24 | 24 | 24 | 24 | - | 24 | 24 | 24 | 24 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | - | compliant | compliant | compliant | compliant |
| Base Number Matches | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 其他特性 | - | - | - | TTL COMPATIBLE BUS SWITCH | - | TTL COMPATIBLE BUS SWITCH | TTL COMPATIBLE BUS SWITCH | TTL COMPATIBLE BUS SWITCH | TTL COMPATIBLE BUS SWITCH |
| 系列 | - | - | - | CBTLV/3B | - | CBTLV/3B | CBTLV/3B | CBTLV/3B | CBTLV/3B |
| JESD-30 代码 | - | - | - | R-PDSO-G24 | - | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
| JESD-609代码 | - | - | - | e4 | - | e4 | e4 | e4 | e4 |
| 长度 | - | - | - | 5 mm | - | 15.365 mm | 15.365 mm | 7.8 mm | 7.8 mm |
| 逻辑集成电路类型 | - | - | - | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 湿度敏感等级 | - | - | - | 1 | - | 1 | 1 | 1 | 1 |
| 位数 | - | - | - | 10 | - | 10 | 10 | 10 | 10 |
| 功能数量 | - | - | - | 1 | - | 1 | 1 | 1 | 1 |
| 端口数量 | - | - | - | 2 | - | 2 | 2 | 2 | 2 |
| 端子数量 | - | - | - | 24 | - | 24 | 24 | 24 | 24 |
| 最高工作温度 | - | - | - | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | - | - | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | - | - | - | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | - | - | - | TRUE | - | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | - | - | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | - | - | TSSOP | - | SOP | SOP | TSSOP | TSSOP |
| 封装等效代码 | - | - | - | TSSOP24,.25,16 | - | SOP24,.4 | SOP24,.4 | TSSOP24,.25 | TSSOP24,.25 |
| 封装形状 | - | - | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | - | - | - | 260 | - | 260 | 260 | 260 | 260 |
| 电源 | - | - | - | 2.5/3.3 V | - | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
| 传播延迟（tpd） | - | - | - | 0.25 ns | - | 0.25 ns | 0.25 ns | 0.25 ns | 0.25 ns |
| 认证状态 | - | - | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | - | - | 1.2 mm | - | 2.65 mm | 2.65 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | - | - | - | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | - | - | 2.3 V | - | 2.3 V | 2.3 V | 2.3 V | 2.3 V |
| 标称供电电压 (Vsup) | - | - | - | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | - | - | - | YES | - | YES | YES | YES | YES |
| 技术 | - | - | - | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | - | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | - | - | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | - | - | 0.4 mm | - | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm |
| 端子位置 | - | - | - | DUAL | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | - | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | - | - | 4.4 mm | - | 7.5 mm | 7.5 mm | 4.4 mm | 4.4 mm |
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