toshiba mos memory products
| TC55257AFL | TC55257APL-10 | TC55257AFL-10 | TC55257AFL-12 | TC55257APL-12 | TC55257APL | TC55257APL-85 | |
|---|---|---|---|---|---|---|---|
| 描述 | toshiba mos memory products | toshiba mos memory products | toshiba mos memory products | toshiba mos memory products | toshiba mos memory products | toshiba mos memory products | toshiba mos memory products |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | - | Toshiba(东芝) | Toshiba(东芝) | - | Toshiba(东芝) | - | Toshiba(东芝) |
| 零件包装代码 | - | DIP | SOIC | SOIC | DIP | - | DIP |
| 包装说明 | - | DIP, | SOP, SOP28,.5 | SOP, SOP28,.5 | DIP, DIP28,.6 | - | DIP, DIP28,.6 |
| 针数 | - | 28 | 28 | 28 | 28 | - | 28 |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow | - | unknow |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 |
| 最长访问时间 | - | 100 ns | 100 ns | 120 ns | 120 ns | - | 85 ns |
| 其他特性 | - | LOW POWER STANDBY MODE; POWER DOWN FEATURE | LOW POWER STANDBY MODE; POWER DOWN FEATURE | LOW POWER STANDBY MODE; POWER DOWN FEATURE | LOW POWER STANDBY MODE; POWER DOWN FEATURE | - | LOW POWER STANDBY MODE; POWER DOWN FEATURE |
| JESD-30 代码 | - | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | - | R-PDIP-T28 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | - | e0 |
| 内存密度 | - | 262144 bi | 262144 bi | 262144 bi | 262144 bi | - | 262144 bi |
| 内存集成电路类型 | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | - | STANDARD SRAM |
| 内存宽度 | - | 8 | 8 | 8 | 8 | - | 8 |
| 功能数量 | - | 1 | 1 | 1 | 1 | - | 1 |
| 端子数量 | - | 28 | 28 | 28 | 28 | - | 28 |
| 字数 | - | 32768 words | 32768 words | 32768 words | 32768 words | - | 32768 words |
| 字数代码 | - | 32000 | 32000 | 32000 | 32000 | - | 32000 |
| 工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS |
| 最高工作温度 | - | 70 °C | 70 °C | 70 °C | 70 °C | - | 70 °C |
| 组织 | - | 32KX8 | 32KX8 | 32KX8 | 32KX8 | - | 32KX8 |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | - | DIP | SOP | SOP | DIP | - | DIP |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | - | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | - | IN-LINE |
| 并行/串行 | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | 240 | 240 | 240 | - | 240 |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | - | 5.2 mm | 2.5 mm | 2.5 mm | 5.2 mm | - | 5.2 mm |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | - | NO | YES | YES | NO | - | NO |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | COMMERCIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | - | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | - | THROUGH-HOLE |
| 端子节距 | - | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | - | 2.54 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 是否无铅 | - | - | 含铅 | 含铅 | 含铅 | - | 含铅 |
| I/O 类型 | - | - | COMMON | COMMON | COMMON | - | COMMON |
| 输出特性 | - | - | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
| 封装等效代码 | - | - | SOP28,.5 | SOP28,.5 | DIP28,.6 | - | DIP28,.6 |
| 电源 | - | - | 5 V | 5 V | 5 V | - | 5 V |
| 最大待机电流 | - | - | 0.0001 A | 0.0001 A | 0.0001 A | - | 0.0001 A |
| 最小待机电流 | - | - | 2 V | 2 V | 2 V | - | 2 V |
| 最大压摆率 | - | - | 0.07 mA | 0.07 mA | 0.07 mA | - | 0.07 mA |
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