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24LC16B-I/PG: 产品描述eeprom 2kx8 - 2.5V lead free package; 产品类别存储存储; 文件大小333KB，共24页; 制造商Microchip(微芯科技); 官网地址https://www.microchip.com; 标准

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24LC16B-I/PG概述

eeprom 2kx8 - 2.5V lead free package

24LC16B-I/PG规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
零件包装代码	DIP
包装说明	0.300 INCH, ROHS COMPLIANT, PLASTIC, MS-001, DIP-8
针数	8
Reach Compliance Code	compli
ECCN代码	EAR99
其他特性	1000K ERASE/WRITE CYCLES; CAN BE ORGANIZED AS 8 BLOCKS OF 256 BYTES; DATA RETENTION >200 YEARS
最大时钟频率 (fCLK)	0.4 MHz
数据保留时间-最小值	200
耐久性	1000000 Write/Erase Cycles
I2C控制字节	1010MMMR
JESD-30 代码	R-PDIP-T8
JESD-609代码	e3
长度	9.46 mm
内存密度	16384 bi
内存集成电路类型	EEPROM
内存宽度	8
功能数量	1
端子数量	8
字数	2048 words
字数代码	2000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	2KX8
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装等效代码	DIP8,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
并行/串行	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	2/5 V
认证状态	Not Qualified
座面最大高度	4.32 mm
串行总线类型	I2C
最大待机电流	0.000001 A
最大压摆率	0.003 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	2.5 V
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Matte Tin (Sn)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	7.62 mm
最长写入周期时间 (tWC)	5 ms
写保护	HARDWARE
Base Number Matches	1

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24AA16/24LC16B

16K I

™

Serial EEPROM

Device Selection Table

Part

Number

24AA16

24LC16B

Note 1:

Vcc

Range

1.8-5.5

2.5-5.5

Max Clock

Frequency

400 kHz

(1)

400 kHz

Temp

Ranges

I, E

Description

The Microchip Technology Inc. 24AA16/24LC16B

(24XX16*) is a 16 Kbit Electrically Erasable PROM.

The device is organized as eight blocks of 256 x 8-bit

memory with a 2-wire serial interface. Low-voltage

design permits operation down to 1.8V with standby

and active currents of only 1

µA

and 1 mA,

respectively. The 24XX16 also has a page write

capability for up to 16 bytes of data. The 24XX16 is

available in the standard 8-pin PDIP, surface mount

SOIC, TSSOP and MSOP packages and is also avail-

able in the 5-lead SOT-23 package.

100 kHz for V

<2.5V

Features

• Single supply with operation down to 1.8V

• Low-power CMOS technology

- 1 mA active current typical

- 1

µA

standby current (max.) (I-temp)

• Organized as 8 blocks of 256 bytes (8 x 256 x 8)

• 2-wire serial interface bus, I

C™ compatible

• Schmitt Trigger inputs for noise suppression

• Output slope control to eliminate ground bounce

• 100 kHz (2.5V) and 400 kHz (≥2.5V) compatibility

• Self-timed write cycle (including auto-erase)

• Page write buffer for up to 16 bytes

• 2 ms typical write cycle time for page write

• Hardware write-protect for entire memory

• Can be operated as a serial ROM

• Factory programming (QTP) available

• ESD protection > 4,000V

• 1,000,000 erase/write cycles

• Data retention > 200 years

• 8-lead PDIP, SOIC, TSSOP and MSOP packages

• 5-lead SOT-23 package

• Standard and Pb-free finishes available

• Available temperature ranges:

- Industrial (I): -40°C to +85°C

- Automotive (E): -40°C to +125°C

Package Types

PDIP/SOIC/TSSOP/MSOP

Vss

Vcc

SCL

Vss

SOT-23-5

24XX16

SDA SDA

Vcc

Note:

Pins A0, A1 and A2 are not used by the

24LC16B. (No internal connections).

Block Diagram

Generator

I/O

Control

Logic

Memory

Control

Logic

XDEC

EEPROM

Array

Page

Latches

I/O

SDA

SCL

YDEC

Sense Amp.

R/W Control

*24XX16 is used in this document as a generic part number for the 24AA16/24LC16B devices.



2003 Microchip Technology Inc.

DS21703D-page 1

24LC16B-I/PG相似产品对比

	24LC16B-I/PG	24AA16/SN	24AA16-I/SNG	24AA16T-I/SNG	24LC16BT-I/STG	24AA16-I/PG	24AA16-I/MSG	24LC16BT-I/SNG	24AA16/ST	24LC16BT-I/MSG
描述	eeprom 2kx8 - 2.5V lead free package	eeprom 2kx8 - 1.8V	eeprom 2kx8 - 1.8V lead free package	eeprom 2kx8 - 1.8V lead free package	eeprom 2kx8 - 2.5V lead free package	eeprom 2kx8 - 1.8V lead free package	eeprom 2kx8 - 1.8V lead free package	eeprom 2kx8 - 2.5V lead free package	eeprom 2kx8 - 1.8V	eeprom 2kx8 - 2.5V lead free package
组织	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	8Block x 256 x 8	2KX8
是否无铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	-	不含铅
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	-	符合
零件包装代码	DIP	SOIC	SOIC	SOIC	TSSOP	DIP	TSSOP	SOIC	-	TSSOP
包装说明	0.300 INCH, ROHS COMPLIANT, PLASTIC, MS-001, DIP-8	SOP, SOP8,.25	SOP, SOP8,.25	SOP, SOP8,.25	4.40 MM, ROHS COMPLIANT, PLASTIC, MO-153, TSSOP-8	DIP, DIP8,.3	TSSOP, TSSOP8,.19	0.150 INCH, ROHS COMPLIANT, PLASTIC, MS-012, SOIC-8	-	ROHS COMPLIANT, PLASTIC, MO-187, MSOP-8
针数	8	8	8	8	8	8	8	8	-	8
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compli	compli	-	compli
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	-	EAR99
其他特性	1000K ERASE/WRITE CYCLES; CAN BE ORGANIZED AS 8 BLOCKS OF 256 BYTES; DATA RETENTION >200 YEARS	2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED	2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED	2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED	1 MILLION ERASE/WRITE CYCLES	2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED	1 MILLION ERASE/WRITE CYCLES	1000K ERASE/WRITE CYCLES; CAN BE ORGANIZED AS 8 BLOCKS OF 256 BYTES; DATA RETENTION >200 YEARS	-	1 MILLION ERASE/WRITE CYCLES
最大时钟频率 (fCLK)	0.4 MHz	0.1 MHz	0.1 MHz	0.1 MHz	0.4 MHz	0.1 MHz	0.1 MHz	0.4 MHz	-	0.4 MHz
数据保留时间-最小值	200	200	200	200	200	200	200	200	-	200
耐久性	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	-	1000000 Write/Erase Cycles
I2C控制字节	1010MMMR	1010MMMR	1010MMMR	1010MMMR	1010MMMR	1010MMMR	1010MMMR	1010MMMR	-	1010MMMR
JESD-30 代码	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	S-PDSO-G8	R-PDSO-G8	-	S-PDSO-G8
JESD-609代码	e3	e3	e3	e3	e3	e3	e3	e3	-	e3
长度	9.46 mm	4.9 mm	4.9 mm	4.9 mm	4.4 mm	9.46 mm	3 mm	4.9 mm	-	3 mm
内存密度	16384 bi	16384 bi	16384 bi	16384 bi	16384 bi	16384 bi	16384 bi	16384 bi	-	16384 bi
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	-	EEPROM
内存宽度	8	8	8	8	8	8	8	8	-	8
功能数量	1	1	1	1	1	1	1	1	-	1
端子数量	8	8	8	8	8	8	8	8	-	8
字数	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	-	2048 words
字数代码	2000	2000	2000	2000	2000	2000	2000	2000	-	2000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS
最高工作温度	85 °C	70 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	-	85 °C
最低工作温度	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
封装代码	DIP	SOP	SOP	SOP	TSSOP	DIP	TSSOP	SOP	-	TSSOP
封装等效代码	DIP8,.3	SOP8,.25	SOP8,.25	SOP8,.25	TSSOP8,.25	DIP8,.3	TSSOP8,.19	SOP8,.25	-	TSSOP8,.19
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	-	SQUARE
封装形式	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	-	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED	260	260	260	260	NOT SPECIFIED	260	260	-	260
电源	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	-	2/5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
座面最大高度	4.32 mm	1.75 mm	1.75 mm	1.75 mm	1.1 mm	4.32 mm	1.1 mm	1.75 mm	-	1.1 mm
串行总线类型	I2C	I2C	I2C	I2C	I2C	I2C	I2C	I2C	-	I2C
最大待机电流	0.000001 A	0.00003 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	0.000001 A	-	0.000001 A
最大压摆率	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA	-	0.003 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	-	5.5 V
最小供电电压 (Vsup)	2.5 V	1.8 V	1.7 V	1.7 V	2.5 V	1.7 V	1.7 V	2.5 V	-	2.5 V
标称供电电压 (Vsup)	5 V	3 V	2.5 V	2.5 V	5 V	2.5 V	2.5 V	5 V	-	5 V
表面贴装	NO	YES	YES	YES	YES	NO	YES	YES	-	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-	CMOS
温度等级	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL
端子面层	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)
端子形式	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	-	GULL WING
端子节距	2.54 mm	1.27 mm	1.27 mm	1.27 mm	0.65 mm	2.54 mm	0.65 mm	1.27 mm	-	0.65 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	-	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	40	40	40	40	NOT SPECIFIED	40	40	-	40
宽度	7.62 mm	3.9 mm	3.91 mm	3.91 mm	3 mm	7.62 mm	3 mm	3.91 mm	-	3 mm
最长写入周期时间 (tWC)	5 ms	10 ms	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms	-	5 ms
写保护	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE	-	HARDWARE
Base Number Matches	1	1	1	1	1	1	1	1	-	1
湿度敏感等级	-	1	1	1	1	-	1	1	-	1

24LC16B-I/PG

24LC16B-I/PG概述

24LC16B-I/PG规格参数

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24LC16B-I/PG相似产品对比

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