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232272362553

产品描述Fixed Resistor, Metal Glaze/thick Film, 0.25W, 25500ohm, 200V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 1206, CHIP
产品类别无源元件    电阻器   
文件大小82KB,共11页
制造商YAGEO(国巨)
官网地址http://www.yageo.com/
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232272362553概述

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 25500ohm, 200V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 1206, CHIP

232272362553规格参数

参数名称属性值
Objectid1922342761
包装说明CHIP
Reach Compliance Codeunknown
ECCN代码EAR99
安装特点SURFACE MOUNT
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
包装方法TR, EMBOSSED
额定功率耗散 (P)0.25 W
额定温度70 °C
电阻25500 Ω
电阻器类型FIXED RESISTOR
尺寸代码1206
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数50 ppm/°C
端子形状WRAPAROUND
容差1%
工作电压200 V

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Philips Components
Product specification
Precision chip resistors
sizes 1206, 0805 and 0603
FEATURES
Low assembly costs
High component and equipment
reliability
Excellent performance at high
frequency, especially the RC22.
TC 50 in thick film technology
Complete precision SMD family.
APPLICATIONS
All general purpose applications.
QUICK REFERENCE DATA
VALUE
DESCRIPTION
RC02H
Size code
Resistance range
Resistance tolerance and
E-series
Temperature coefficient; note 1:
1
Ω≤
R<5
5
Ω ≤
R < 10
10
Ω ≤
R < 100
100
Ω ≤
R
1 MΩ
1 MΩ < R
10 MΩ
Maximum dissipation at
T
amb
= 70
°C
Maximum permissible voltage
Climatic category (IEC 68)
Basic specification
Stability after:
load, 1000 hours at T
amb
= 70
°C:
1
Ω ≤
R
1 MΩ
R > 1 MΩ
climatic tests:
1
Ω ≤
R
1 MΩ
R > 1 MΩ
resistance to soldering heat
short time overload
Note
1. All TC values should be multiplied by 10
−6
/K.
1996 Nov 18
1
∆R/R
max.:
±1.0%
+0.05
∆R/R
max.:
±1.5%
+0.05
∆R/R
max.:
±0.5%
+0.05
∆R/R
max.:
±1.0%
+0.05
∆R/R
max.:
±1.0%
+0.05
∆R/R
max.:
±1.5%
+0.05
≤ ±250
≤ ±200
≤ ±100
≤ ±100
≤ ±200
0.25 W
200 V
(DC or RMS)
55/155/56
55/125/56
≤ ±50
≤ ±250
≤ ±200
≤ ±100
≤ ±100
≤ ±200
0.125 W
150 V
(DC or RMS)
55/155/56
IEC 115-8
≤ ±50
1
to 10 MΩ
RC02G
100
to 1 MΩ
RC12H
1
to 10 MΩ
RC12G
DESCRIPTION
The resistors are constructed on a
high grade ceramic body (aluminium
oxide). Internal metal electrodes are
added at each end and connected by
a resistive paste which is applied to
the top surface of the substrate. The
composition of the paste is adjusted
to give the approximate resistance
required and the value is trimmed to
within tolerance, by laser cutting of
this resistive layer.
RC02/12/22
The resistive layer is covered with a
protective coat and printed with the
resistance value (no printing on
RC22). Finally, the two external end
terminations are added. For ease of
soldering the outerlayer of these end
terminations is a lead/tin alloy.
RC22H
0603 (1608)
1
to 10 MΩ
1206 (3216)
0805 (2012)
100
to 1 MΩ
±1%;
E24/E96 series
≤ ±250
≤ ±200
≤ ±100
≤ ±100
≤ ±200
0.063 W
50 V
(DC or RMS)
55/155/56
55/125/56
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